Encapsulation Protection for Power Modules | SANCO<\/title>\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\n<\/head>\n<body>\n\n\n\n<script type=\"application\/ld+json\">\n{\n \"@context\": \"https:\/\/schema.org\",\n \"@graph\": [\n {\n \"@type\": \"WebPage\",\n \"@id\": \"https:\/\/www.sancofd.com\/application\/industrial-electronics\/encapsulation-protection-for-power-modules\/\",\n \"url\": \"https:\/\/www.sancofd.com\/application\/industrial-electronics\/encapsulation-protection-for-power-modules\/\",\n \"name\": \"Encapsulation Protection for Power Modules | SANCO\",\n \"description\": \"SANCO dispensing machines deliver precision silicone gel encapsulation for IGBT and power semiconductor modules, providing dielectric insulation and thermal management for industrial drive and power conversion applications.\",\n \"inLanguage\": \"en\",\n \"isPartOf\": {\n \"@type\": \"WebSite\",\n \"url\": \"https:\/\/www.sancofd.com\/\",\n \"name\": \"SANCO Fluid Dispensing\"\n },\n \"breadcrumb\": {\n \"@type\": \"BreadcrumbList\",\n \"itemListElement\": [\n {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\n {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\n {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Industrial Electronics\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\n {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Encapsulation Protection for Power Modules\",\"item\":\"https:\/\/www.sancofd.com\/application\/industrial-electronics\/encapsulation-protection-for-power-modules\/\"}\n ]\n }\n },\n {\n \"@type\": \"HowTo\",\n \"name\": \"Encapsulation Process for Power Modules Using SANCO Equipment\",\n \"description\": \"Step-by-step guide to precision silicone gel encapsulation and cure for IGBT and power semiconductor module protection using SANCO dispensing equipment.\",\n \"step\": [\n {\n \"@type\": \"HowToStep\",\n \"position\": 1,\n \"name\": \"Module Substrate Load & Component Inspection\",\n \"text\": \"Power module substrate with mounted die and wire bonds is loaded and inspected to confirm bond integrity before encapsulant contact.\"\n },\n {\n \"@type\": \"HowToStep\",\n \"position\": 2,\n \"name\": \"Dam Wall Dispensing (If Required)\",\n \"text\": \"Where the module housing does not provide a full containment boundary, a dam wall is dispensed around the die array to contain the subsequently dispensed gel fill.\"\n },\n {\n \"@type\": \"HowToStep\",\n \"position\": 3,\n \"name\": \"Silicone Gel Fill Dispensing\",\n \"text\": \"SANCO dispensing machine deposits a precise volume of soft silicone gel over the power die and wire bond array, achieving complete, void-free coverage for dielectric insulation.\"\n },\n {\n \"@type\": \"HowToStep\",\n \"position\": 4,\n \"name\": \"Vacuum Degas \/ Bubble Release\",\n \"text\": \"Filled module undergoes vacuum degassing to remove air entrapped around wire bonds and die edges before the gel sets, since voids compromise dielectric withstand voltage.\"\n },\n {\n \"@type\": \"HowToStep\",\n \"position\": 5,\n \"name\": \"Cure & Dielectric \/ Thermal Test\",\n \"text\": \"Silicone gel cures per material specification. Sample units undergo dielectric withstand voltage testing and thermal cycling to confirm the encapsulation meets power module reliability specification.\"\n }\n]\n }\n ]\n}\n<\/script>\n\n\n<style>\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\n.sanco-app-wrap *{box-sizing:border-box;margin:0;padding:0}\n\n\/* \u2500\u2500 tokens \u2500\u2500 *\/\n.sanco-app-wrap{\n --navy:#0a1628;\n --blue:#2e7dd1;\n --blue-dk:#1c68b8;\n --g50:#f8fafc;\n --g100:#f1f5f9;\n --g200:#e2e8f0;\n --g400:#94a3b8;\n --g600:#475569;\n --radius-card:14px;\n font-family:'DM Sans',sans-serif;\n color:var(--navy);\n}\n\n\/* \u2500\u2500 HERO \u2500\u2500 *\/\n.sanco-app-hero{\n position:relative;\n height:480px;\n overflow:hidden;\n display:flex;\n align-items:center;\n border-radius:0;\n}\n.sanco-app-hero-bg{\n position:absolute;inset:0;\n background:url('https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Industrial-Electronics-4.png')\n center\/cover no-repeat;\n 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.sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\n .sanco-process-step::after{display:none}\n}\n@media(max-width:600px){\n .sanco-app-hero{height:auto;min-height:340px;padding:32px 0}\n .sanco-app-hero h1{font-size:30px}\n .sanco-app-hero-sub{font-size:15px}\n .sanco-app-hl-wrap,.sanco-challenge-grid,\n .sanco-process-steps{grid-template-columns:1fr}\n .sanco-app-intro-text h2,.sanco-app-sec-head h2{font-size:28px}\n .sanco-app-hero-inner,.sanco-app-bread,\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\n .sanco-app-materials-wrap,.sanco-app-faq-wrap{padding-left:16px;padding-right:16px}\n .sanco-challenge-card,.sanco-app-hl-card,.sanco-process-step{padding:20px 16px}\n}\n<\/style>\n\n\n<div class=\"sanco-app-wrap\">\n\n \n <section class=\"sanco-app-hero\" aria-label=\"Industrial Electronics application hero\">\n <div class=\"sanco-app-hero-bg\"><\/div>\n <div class=\"sanco-app-hero-overlay\"><\/div>\n <div class=\"sanco-app-hero-inner\">\n <span class=\"sanco-app-hero-label\">Industrial Electronics \u00b7 Applications<\/span>\n <h1>Encapsulation Protection for Power Modules<\/h1>\n <p class=\"sanco-app-hero-sub\">Precision silicone gel encapsulation for IGBT and power semiconductor modules \u2014 providing dielectric insulation and thermal management for industrial drive and power conversion applications.<\/p>\n <\/div>\n <\/section>\n\n \n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <span>Industrial Electronics<\/span>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <span class=\"cur\">Encapsulation Protection for Power Modules<\/span>\n <\/nav>\n\n \n <section class=\"sanco-app-intro\">\n <div class=\"sanco-app-intro-wrap\">\n <div class=\"sanco-app-intro-text\">\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\n <h2>Precision Dielectric Encapsulation for Industrial Power Semiconductor Modules<\/h2>\n <p>IGBT and power semiconductor modules used in industrial motor drives, power conversion equipment and renewable energy inverters carry high voltage and current across die and wire bond structures that require both dielectric insulation and mechanical protection to operate reliably over the module's service life. Soft silicone gel encapsulation is the standard protective approach, chosen specifically because its low modulus accommodates the thermal expansion mismatch between die, substrate and package materials without introducing the mechanical stress that harder encapsulants would place on delicate wire bonds during thermal cycling.<\/p>\n <p>The dispensing challenge is achieving complete, void-free gel coverage around a densely populated die and wire bond array, since any void in the gel directly reduces the dielectric withstand voltage at that location \u2014 a critical failure mode in high-voltage power module applications where partial discharge at a void site can progressively degrade insulation over time. Gel volume must also be precisely controlled relative to the module housing's fill capacity, since underfill leaves die and bonds inadequately protected while overfill risks encapsulant migration beyond the intended containment area.<\/p>\n <p>SANCO precision gel dispensing systems, built on our <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machine<\/a> platform, deliver the void-free fill control, vacuum degassing integration and volume precision required for power module silicone gel encapsulation across industrial drive and power conversion module manufacturing.<\/p>\n <\/div>\n <div class=\"sanco-app-intro-img\">\n <img loading=\"lazy\" decoding=\"async\"\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Industrial-Electronics-4.png\"\n alt=\"SANCO dispensing machine applying silicone gel encapsulation to an IGBT power module die array\"\n loading=\"lazy\"\n width=\"600\" height=\"420\"\n >\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-challenges\">\n <div class=\"sanco-app-challenges-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Manufacturing Challenges<\/span>\n <h2>Why Power Module Encapsulation Demands Dielectric-Grade Void-Free Fill<\/h2>\n <p>Any void in the gel encapsulant directly compromises dielectric withstand voltage, making complete, uniform coverage a functional requirement rather than a cosmetic one.<\/p>\n <\/div>\n <div class=\"sanco-challenge-grid\">\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">01<\/div>\n <h4>Void-Free Fill for Dielectric Withstand Voltage<\/h4>\n <p>Air voids within the cured gel encapsulant create localized regions of reduced dielectric strength; under high-voltage operation, these voids can become sites of partial discharge that progressively degrade insulation and lead to premature module failure.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">02<\/div>\n <h4>Complete Coverage Around Dense Wire Bond Arrays<\/h4>\n <p>Power modules incorporate numerous wire bonds connecting die to substrate; gel must flow completely around and beneath this dense bond array without trapping air pockets at bond wire crossings or beneath die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">03<\/div>\n <h4>Low-Stress Encapsulation for Thermal Cycling Durability<\/h4>\n <p>Power modules experience significant thermal cycling from load-driven junction temperature swings; gel must remain soft and low-modulus throughout the module's service life to avoid introducing mechanical stress that could fatigue wire bonds.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">04<\/div>\n <h4>Precise Volume Control Relative to Housing Capacity<\/h4>\n <p>Gel fill volume must be precisely matched to the module housing's containment capacity; underfill leaves die and bonds inadequately protected against moisture and contamination, while overfill risks encapsulant migration beyond the intended area.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">05<\/div>\n <h4>Compatibility with High-Power Die and Substrate Materials<\/h4>\n <p>Gel encapsulant must maintain adhesion and dielectric performance in direct contact with power semiconductor die, ceramic or metal substrates and the range of materials found in modern power module construction.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">06<\/div>\n <h4>Consistent Fill Across High-Volume Module Production<\/h4>\n <p>Industrial power module manufacturing operates at meaningful production volume; gel dispensing volume and coverage quality must remain consistent from the first module to the last across extended production runs.<\/p>\n <\/div>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-hl\">\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\n Key Capabilities for Power Module Encapsulation\n <\/h2>\n <\/div>\n <\/div>\n <div class=\"sanco-app-hl-wrap\">\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\n <h4>Void-Free Gel Fill for Dielectric Performance<\/h4>\n <p>Controlled dispensing flow and vacuum degassing integration eliminate air voids that would otherwise compromise dielectric withstand voltage at void sites.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\n <h4>Complete Wire Bond Array Coverage<\/h4>\n <p>Precision dispensing achieves complete gel flow around and beneath dense wire bond arrays, avoiding trapped air at bond crossings and die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\n <h4>Low-Stress Soft Gel Material Compatibility<\/h4>\n <p>Dispensing platform handles low-modulus silicone gel formulations engineered to avoid introducing wire-bond-fatiguing stress during thermal cycling.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\n <h4>Precision Volume Control to Housing Capacity<\/h4>\n <p>Closed-loop volumetric dosing matches gel fill volume precisely to module housing containment capacity, avoiding both underfill and overfill.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\n <h4>Dam-and-Fill Boundary Control<\/h4>\n <p>Programmable containment dam dispensing defines precise gel fill boundaries for module housings without a full integrated containment structure.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\n <h4>Vacuum Degassing for Dielectric-Critical Fill<\/h4>\n <p>Vacuum degassing station removes entrapped air from the gel fill before cure, supporting the void-free coverage dielectric performance depends on.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\n <h4>High-Power Substrate Material Compatibility<\/h4>\n <p>Dispensing system handles gel formulations compatible with ceramic, metal and composite substrate materials common to power module construction.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\n <h4>Inline Power Module Assembly Integration<\/h4>\n <p>SMEMA-compatible conveyor integration links SANCO gel dispensing equipment directly into power module assembly lines between die\/wire-bond inspection and cure oven stations.<\/p>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-process\">\n <div class=\"sanco-app-process-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Process Guide<\/span>\n <h2>The Power Module Encapsulation Process Step by Step<\/h2>\n <p>Power module encapsulation must achieve complete, void-free gel coverage to preserve dielectric performance and thermal cycling reliability. SANCO equipment is calibrated for every stage.<\/p>\n <\/div>\n <div class=\"sanco-process-steps\">\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 01<\/div>\n <h4>Module Substrate Load & Component Inspection<\/h4>\n <p>Power module substrate with mounted die and wire bonds is loaded and inspected before encapsulant contact.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 02<\/div>\n <h4>Dam Wall Dispensing<\/h4>\n <p>Where required, a dam wall is dispensed around the die array to contain the subsequently dispensed gel fill.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 03<\/div>\n <h4>Silicone Gel Fill Dispensing<\/h4>\n <p>A precise volume of soft silicone gel is deposited over the die and wire bond array for complete, void-free coverage.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 04<\/div>\n <h4>Vacuum Degas \/ Bubble Release<\/h4>\n <p>Filled module undergoes vacuum degassing to remove air entrapped around wire bonds before the gel sets.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 05<\/div>\n <h4>Cure & Dielectric \/ Thermal Test<\/h4>\n <p>Gel cures per specification; sample units undergo dielectric withstand voltage and thermal cycling testing.<\/p>\n <\/div>\n <\/div>\n <\/div>\n <\/section>\n\n\n \n <section class=\"sanco-app-materials\">\n <div class=\"sanco-app-materials-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Materials Compatibility<\/span>\n <h2>Power Module Encapsulation Material Types & SANCO Compatibility<\/h2>\n <p>SANCO dispensing machines handle the silicone gel and encapsulant materials used across IGBT and power semiconductor module protection.<\/p>\n <\/div>\n <div class=\"sanco-mat-table-scroll\">\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Power Module Encapsulation Material Types & SANCO Compatibility\">\n <thead>\n <tr>\n <th>Material Type<\/th>\n <th>Viscosity Range<\/th>\n <th>Cure Method<\/th>\n <th>Typical Application<\/th>\n <th>SANCO Compatibility<\/th>\n <\/tr>\n <\/thead>\n <tbody>\n <tr>\n <td><strong>Soft Silicone Dielectric Gel<\/strong><\/td>\n <td>3,000 \u2013 20,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C<\/td>\n <td>Primary die and wire bond encapsulation providing dielectric insulation with minimal mechanical stress<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>High-Dielectric-Strength Silicone Gel<\/strong><\/td>\n <td>5,000 \u2013 25,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C<\/td>\n <td>Enhanced dielectric performance gel for high-voltage power module applications<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Two-Layer Gel\/Hard Coat System<\/strong><\/td>\n <td>Gel: 3,000\u201315,000; Overcoat: 10,000\u201340,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C, sequential cure<\/td>\n <td>Soft gel layer with protective hard-coat overcoat for enhanced mechanical and environmental protection<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Dam \/ Containment Silicone<\/strong><\/td>\n <td>40,000 \u2013 150,000 mPa\u00b7s<\/td>\n <td>Thermal or UV cure<\/td>\n <td>High-viscosity containment wall material for module housings without integrated fill boundaries<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Thermally Conductive Silicone Gel<\/strong><\/td>\n <td>5,000 \u2013 25,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013130\u00b0C<\/td>\n <td>Dielectric gel formulation with enhanced thermal conductivity for high-power-density module designs<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-faq\">\n <div class=\"sanco-app-faq-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">FAQ<\/span>\n <h2>Frequently Asked Questions<\/h2>\n <\/div>\n <div class=\"sanco-faq-item\">\n <h4>How does SANCO ensure void-free gel fill for dielectric performance?<\/h4>\n <p>SANCO's controlled dispensing flow combined with vacuum degassing integration removes air voids that would otherwise create localized regions of reduced dielectric strength, supporting the withstand voltage performance power module reliability depends on. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to review void-free fill requirements for your module design.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Can SANCO equipment fill completely around dense wire bond arrays without trapping air?<\/h4>\n <p>Yes. Precision dispensing flow control achieves complete gel coverage around and beneath dense wire bond arrays, avoiding trapped air pockets at bond wire crossings and die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>How does SANCO control gel fill volume relative to module housing capacity?<\/h4>\n <p>Closed-loop volumetric dosing precisely matches dispensed gel volume to the module housing's containment capacity, avoiding both underfill that leaves components inadequately protected and overfill that risks encapsulant migration.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Does SANCO support dam dispensing for module housings without integrated containment?<\/h4>\n <p>Yes. Programmable dam wall dispensing defines precise gel fill boundaries for power module housings that do not provide a full integrated containment structure, enabling targeted encapsulation of the die and wire bond area.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>What throughput can SANCO achieve for high-volume power module production?<\/h4>\n <p>Cycle time depends on die array size and gel fill volume required. SANCO dispensing platforms are configured to maintain consistent fill volume and coverage quality from the first module to the last across extended, high-volume production runs.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Where can I learn about other industrial electronics dispensing applications?<\/h4>\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering potting for relays\/transformers, conformal coating for motor drive boards and sealing for industrial connectors. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\n <\/div>\n <\/div>\n <\/section>\n\n<\/div>\n\n<\/body>\n<\/html>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c46ed25 elementor-widget elementor-widget-html\" data-id=\"c46ed25\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; }\r\n to { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n background: #fff;\r\n border-radius: 20px;\r\n width: 100%;\r\n max-width: 560px;\r\n max-height: 92vh;\r\n overflow-y: auto;\r\n box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n to { opacity: 1; transform: translateY(0) scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n padding: 28px 32px 24px;\r\n border-radius: 20px 20px 0 0;\r\n position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n font-size: 22px;\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n font-size: 14px;\r\n color: rgba(255,255,255,0.6);\r\n margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n position: absolute;\r\n top: 18px;\r\n right: 18px;\r\n width: 36px;\r\n height: 36px;\r\n background: rgba(255,255,255,0.22);\r\n border: 1.5px solid rgba(255,255,255,0.5);\r\n border-radius: 8px;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n transition: background 0.2s, border-color 0.2s;\r\n color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n background: rgba(255,255,255,0.38);\r\n border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; 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height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; 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Home \u203a Applications \u203a Industrial Electronics \u203a Encapsulation Protection for Power Modules Industry Overview Precision […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7138","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/comments?post=7138"}],"version-history":[{"count":7,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138\/revisions"}],"predecessor-version":[{"id":7403,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138\/revisions\/7403"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/media?parent=7138"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}

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48px}\n.sanco-mat-table-scroll{width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;margin-top:8px}\n.sanco-mat-table{width:100%;min-width:640px;border-collapse:collapse;font-size:14px}\n.sanco-mat-table th{\n background:var(--navy);color:#fff;\n padding:13px 18px;text-align:left;font-size:12px;\n font-weight:700;letter-spacing:1px;text-transform:uppercase;\n}\n.sanco-mat-table th:first-child{border-radius:10px 0 0 0}\n.sanco-mat-table th:last-child{border-radius:0 10px 0 0}\n.sanco-mat-table td{\n padding:13px 18px;border-bottom:1px solid var(--g200);\n color:var(--g600);line-height:1.55;vertical-align:top;\n}\n.sanco-mat-table tr:last-child td{border-bottom:none}\n.sanco-mat-table tr:nth-child(even) td{background:var(--g100)}\n.sanco-mat-table .tag-rec{\n display:inline-block;padding:2px 10px;border-radius:50px;\n font-size:11px;font-weight:700;\n background:rgba(46,125,209,.1);color:var(--blue);\n}\n\n\/* \u2500\u2500 FAQS \u2500\u2500 *\/\n.sanco-app-faq{padding:60px 0;background:#fff}\n.sanco-app-faq-wrap{max-width:860px;margin:0 auto;padding:0 48px}\n.sanco-faq-item{\n border-bottom:1px solid var(--g200);padding:22px 0;\n}\n.sanco-faq-item:last-child{border-bottom:none}\n.sanco-faq-item h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\n.sanco-faq-item p{font-size:14.5px;color:var(--g600);line-height:1.8}\n.sanco-faq-item a{color:var(--blue);font-weight:600;text-decoration:none}\n.sanco-faq-item a:hover{text-decoration:underline}\n\n\/* \u2500\u2500 RESPONSIVE \u2500\u2500 *\/\n@media(max-width:1024px){\n .sanco-app-hero{height:360px}\n .sanco-app-hero-inner,.sanco-app-bread,\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\n .sanco-app-products-wrap,.sanco-app-materials-wrap,\n .sanco-app-faq-wrap{padding-left:24px;padding-right:24px}\n .sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\n .sanco-app-intro-img img{height:260px}\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\n .sanco-process-step::after{display:none}\n}\n@media(max-width:600px){\n .sanco-app-hero{height:auto;min-height:340px;padding:32px 0}\n .sanco-app-hero h1{font-size:30px}\n .sanco-app-hero-sub{font-size:15px}\n .sanco-app-hl-wrap,.sanco-challenge-grid,\n .sanco-process-steps{grid-template-columns:1fr}\n .sanco-app-intro-text h2,.sanco-app-sec-head h2{font-size:28px}\n .sanco-app-hero-inner,.sanco-app-bread,\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\n .sanco-app-materials-wrap,.sanco-app-faq-wrap{padding-left:16px;padding-right:16px}\n .sanco-challenge-card,.sanco-app-hl-card,.sanco-process-step{padding:20px 16px}\n}\n<\/style>\n\n\n<div class=\"sanco-app-wrap\">\n\n \n <section class=\"sanco-app-hero\" aria-label=\"Industrial Electronics application hero\">\n <div class=\"sanco-app-hero-bg\"><\/div>\n <div class=\"sanco-app-hero-overlay\"><\/div>\n <div class=\"sanco-app-hero-inner\">\n <span class=\"sanco-app-hero-label\">Industrial Electronics \u00b7 Applications<\/span>\n <h1>Encapsulation Protection for Power Modules<\/h1>\n <p class=\"sanco-app-hero-sub\">Precision silicone gel encapsulation for IGBT and power semiconductor modules \u2014 providing dielectric insulation and thermal management for industrial drive and power conversion applications.<\/p>\n <\/div>\n <\/section>\n\n \n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <span>Industrial Electronics<\/span>\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\n <span class=\"cur\">Encapsulation Protection for Power Modules<\/span>\n <\/nav>\n\n \n <section class=\"sanco-app-intro\">\n <div class=\"sanco-app-intro-wrap\">\n <div class=\"sanco-app-intro-text\">\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\n <h2>Precision Dielectric Encapsulation for Industrial Power Semiconductor Modules<\/h2>\n <p>IGBT and power semiconductor modules used in industrial motor drives, power conversion equipment and renewable energy inverters carry high voltage and current across die and wire bond structures that require both dielectric insulation and mechanical protection to operate reliably over the module's service life. Soft silicone gel encapsulation is the standard protective approach, chosen specifically because its low modulus accommodates the thermal expansion mismatch between die, substrate and package materials without introducing the mechanical stress that harder encapsulants would place on delicate wire bonds during thermal cycling.<\/p>\n <p>The dispensing challenge is achieving complete, void-free gel coverage around a densely populated die and wire bond array, since any void in the gel directly reduces the dielectric withstand voltage at that location \u2014 a critical failure mode in high-voltage power module applications where partial discharge at a void site can progressively degrade insulation over time. Gel volume must also be precisely controlled relative to the module housing's fill capacity, since underfill leaves die and bonds inadequately protected while overfill risks encapsulant migration beyond the intended containment area.<\/p>\n <p>SANCO precision gel dispensing systems, built on our <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machine<\/a> platform, deliver the void-free fill control, vacuum degassing integration and volume precision required for power module silicone gel encapsulation across industrial drive and power conversion module manufacturing.<\/p>\n <\/div>\n <div class=\"sanco-app-intro-img\">\n <img loading=\"lazy\" decoding=\"async\"\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Industrial-Electronics-4.png\"\n alt=\"SANCO dispensing machine applying silicone gel encapsulation to an IGBT power module die array\"\n loading=\"lazy\"\n width=\"600\" height=\"420\"\n >\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-challenges\">\n <div class=\"sanco-app-challenges-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Manufacturing Challenges<\/span>\n <h2>Why Power Module Encapsulation Demands Dielectric-Grade Void-Free Fill<\/h2>\n <p>Any void in the gel encapsulant directly compromises dielectric withstand voltage, making complete, uniform coverage a functional requirement rather than a cosmetic one.<\/p>\n <\/div>\n <div class=\"sanco-challenge-grid\">\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">01<\/div>\n <h4>Void-Free Fill for Dielectric Withstand Voltage<\/h4>\n <p>Air voids within the cured gel encapsulant create localized regions of reduced dielectric strength; under high-voltage operation, these voids can become sites of partial discharge that progressively degrade insulation and lead to premature module failure.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">02<\/div>\n <h4>Complete Coverage Around Dense Wire Bond Arrays<\/h4>\n <p>Power modules incorporate numerous wire bonds connecting die to substrate; gel must flow completely around and beneath this dense bond array without trapping air pockets at bond wire crossings or beneath die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">03<\/div>\n <h4>Low-Stress Encapsulation for Thermal Cycling Durability<\/h4>\n <p>Power modules experience significant thermal cycling from load-driven junction temperature swings; gel must remain soft and low-modulus throughout the module's service life to avoid introducing mechanical stress that could fatigue wire bonds.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">04<\/div>\n <h4>Precise Volume Control Relative to Housing Capacity<\/h4>\n <p>Gel fill volume must be precisely matched to the module housing's containment capacity; underfill leaves die and bonds inadequately protected against moisture and contamination, while overfill risks encapsulant migration beyond the intended area.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">05<\/div>\n <h4>Compatibility with High-Power Die and Substrate Materials<\/h4>\n <p>Gel encapsulant must maintain adhesion and dielectric performance in direct contact with power semiconductor die, ceramic or metal substrates and the range of materials found in modern power module construction.<\/p>\n <\/div>\n\n <div class=\"sanco-challenge-card\">\n <div class=\"cc-num\">06<\/div>\n <h4>Consistent Fill Across High-Volume Module Production<\/h4>\n <p>Industrial power module manufacturing operates at meaningful production volume; gel dispensing volume and coverage quality must remain consistent from the first module to the last across extended production runs.<\/p>\n <\/div>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-hl\">\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\n Key Capabilities for Power Module Encapsulation\n <\/h2>\n <\/div>\n <\/div>\n <div class=\"sanco-app-hl-wrap\">\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\n <h4>Void-Free Gel Fill for Dielectric Performance<\/h4>\n <p>Controlled dispensing flow and vacuum degassing integration eliminate air voids that would otherwise compromise dielectric withstand voltage at void sites.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\n <h4>Complete Wire Bond Array Coverage<\/h4>\n <p>Precision dispensing achieves complete gel flow around and beneath dense wire bond arrays, avoiding trapped air at bond crossings and die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\n <h4>Low-Stress Soft Gel Material Compatibility<\/h4>\n <p>Dispensing platform handles low-modulus silicone gel formulations engineered to avoid introducing wire-bond-fatiguing stress during thermal cycling.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\n <h4>Precision Volume Control to Housing Capacity<\/h4>\n <p>Closed-loop volumetric dosing matches gel fill volume precisely to module housing containment capacity, avoiding both underfill and overfill.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\n <h4>Dam-and-Fill Boundary Control<\/h4>\n <p>Programmable containment dam dispensing defines precise gel fill boundaries for module housings without a full integrated containment structure.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\n <h4>Vacuum Degassing for Dielectric-Critical Fill<\/h4>\n <p>Vacuum degassing station removes entrapped air from the gel fill before cure, supporting the void-free coverage dielectric performance depends on.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\n <h4>High-Power Substrate Material Compatibility<\/h4>\n <p>Dispensing system handles gel formulations compatible with ceramic, metal and composite substrate materials common to power module construction.<\/p>\n <\/div>\n\n <div class=\"sanco-app-hl-card\">\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\n <h4>Inline Power Module Assembly Integration<\/h4>\n <p>SMEMA-compatible conveyor integration links SANCO gel dispensing equipment directly into power module assembly lines between die\/wire-bond inspection and cure oven stations.<\/p>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-process\">\n <div class=\"sanco-app-process-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Process Guide<\/span>\n <h2>The Power Module Encapsulation Process Step by Step<\/h2>\n <p>Power module encapsulation must achieve complete, void-free gel coverage to preserve dielectric performance and thermal cycling reliability. SANCO equipment is calibrated for every stage.<\/p>\n <\/div>\n <div class=\"sanco-process-steps\">\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 01<\/div>\n <h4>Module Substrate Load & Component Inspection<\/h4>\n <p>Power module substrate with mounted die and wire bonds is loaded and inspected before encapsulant contact.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 02<\/div>\n <h4>Dam Wall Dispensing<\/h4>\n <p>Where required, a dam wall is dispensed around the die array to contain the subsequently dispensed gel fill.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 03<\/div>\n <h4>Silicone Gel Fill Dispensing<\/h4>\n <p>A precise volume of soft silicone gel is deposited over the die and wire bond array for complete, void-free coverage.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 04<\/div>\n <h4>Vacuum Degas \/ Bubble Release<\/h4>\n <p>Filled module undergoes vacuum degassing to remove air entrapped around wire bonds before the gel sets.<\/p>\n <\/div>\n\n <div class=\"sanco-process-step\">\n <div class=\"ps-num\">Step 05<\/div>\n <h4>Cure & Dielectric \/ Thermal Test<\/h4>\n <p>Gel cures per specification; sample units undergo dielectric withstand voltage and thermal cycling testing.<\/p>\n <\/div>\n <\/div>\n <\/div>\n <\/section>\n\n\n \n <section class=\"sanco-app-materials\">\n <div class=\"sanco-app-materials-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">Materials Compatibility<\/span>\n <h2>Power Module Encapsulation Material Types & SANCO Compatibility<\/h2>\n <p>SANCO dispensing machines handle the silicone gel and encapsulant materials used across IGBT and power semiconductor module protection.<\/p>\n <\/div>\n <div class=\"sanco-mat-table-scroll\">\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Power Module Encapsulation Material Types & SANCO Compatibility\">\n <thead>\n <tr>\n <th>Material Type<\/th>\n <th>Viscosity Range<\/th>\n <th>Cure Method<\/th>\n <th>Typical Application<\/th>\n <th>SANCO Compatibility<\/th>\n <\/tr>\n <\/thead>\n <tbody>\n <tr>\n <td><strong>Soft Silicone Dielectric Gel<\/strong><\/td>\n <td>3,000 \u2013 20,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C<\/td>\n <td>Primary die and wire bond encapsulation providing dielectric insulation with minimal mechanical stress<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>High-Dielectric-Strength Silicone Gel<\/strong><\/td>\n <td>5,000 \u2013 25,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C<\/td>\n <td>Enhanced dielectric performance gel for high-voltage power module applications<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Two-Layer Gel\/Hard Coat System<\/strong><\/td>\n <td>Gel: 3,000\u201315,000; Overcoat: 10,000\u201340,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013150\u00b0C, sequential cure<\/td>\n <td>Soft gel layer with protective hard-coat overcoat for enhanced mechanical and environmental protection<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Dam \/ Containment Silicone<\/strong><\/td>\n <td>40,000 \u2013 150,000 mPa\u00b7s<\/td>\n <td>Thermal or UV cure<\/td>\n <td>High-viscosity containment wall material for module housings without integrated fill boundaries<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <tr>\n <td><strong>Thermally Conductive Silicone Gel<\/strong><\/td>\n <td>5,000 \u2013 25,000 mPa\u00b7s<\/td>\n <td>Thermal 100\u2013130\u00b0C<\/td>\n <td>Dielectric gel formulation with enhanced thermal conductivity for high-power-density module designs<\/td>\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n <\/div>\n <\/div>\n <\/section>\n\n \n <section class=\"sanco-app-faq\">\n <div class=\"sanco-app-faq-wrap\">\n <div class=\"sanco-app-sec-head\">\n <span class=\"pill\">FAQ<\/span>\n <h2>Frequently Asked Questions<\/h2>\n <\/div>\n <div class=\"sanco-faq-item\">\n <h4>How does SANCO ensure void-free gel fill for dielectric performance?<\/h4>\n <p>SANCO's controlled dispensing flow combined with vacuum degassing integration removes air voids that would otherwise create localized regions of reduced dielectric strength, supporting the withstand voltage performance power module reliability depends on. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to review void-free fill requirements for your module design.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Can SANCO equipment fill completely around dense wire bond arrays without trapping air?<\/h4>\n <p>Yes. Precision dispensing flow control achieves complete gel coverage around and beneath dense wire bond arrays, avoiding trapped air pockets at bond wire crossings and die edges.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>How does SANCO control gel fill volume relative to module housing capacity?<\/h4>\n <p>Closed-loop volumetric dosing precisely matches dispensed gel volume to the module housing's containment capacity, avoiding both underfill that leaves components inadequately protected and overfill that risks encapsulant migration.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Does SANCO support dam dispensing for module housings without integrated containment?<\/h4>\n <p>Yes. Programmable dam wall dispensing defines precise gel fill boundaries for power module housings that do not provide a full integrated containment structure, enabling targeted encapsulation of the die and wire bond area.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>What throughput can SANCO achieve for high-volume power module production?<\/h4>\n <p>Cycle time depends on die array size and gel fill volume required. SANCO dispensing platforms are configured to maintain consistent fill volume and coverage quality from the first module to the last across extended, high-volume production runs.<\/p>\n <\/div>\n\n <div class=\"sanco-faq-item\">\n <h4>Where can I learn about other industrial electronics dispensing applications?<\/h4>\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering potting for relays\/transformers, conformal coating for motor drive boards and sealing for industrial connectors. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\n <\/div>\n <\/div>\n <\/section>\n\n<\/div>\n\n<\/body>\n<\/html>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c46ed25 elementor-widget elementor-widget-html\" data-id=\"c46ed25\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; 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height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; 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height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n \r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Encapsulation Protection for Power Modules | SANCO Industrial Electronics \u00b7 Applications Encapsulation Protection for Power Modules Precision silicone gel encapsulation for IGBT and power semiconductor modules \u2014 providing dielectric insulation and thermal management for industrial drive and power conversion applications. Home \u203a Applications \u203a Industrial Electronics \u203a Encapsulation Protection for Power Modules Industry Overview Precision […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7138","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/comments?post=7138"}],"version-history":[{"count":7,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138\/revisions"}],"predecessor-version":[{"id":7403,"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/pages\/7138\/revisions\/7403"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/fr\/wp-json\/wp\/v2\/media?parent=7138"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}