코팅 장비
3D Digital Printing Conformal Coating Machine
Pixel-level precision jetting with 1,000+ independently controlled nozzles — digital, layer-by-layer PCBA protection without masking.
제품 설명
The 3D Digital Printing Conformal Coating Machine applies inkjet-based digital control to PCBA protection. Instead of spraying coating material across a board and masking off sensitive areas, the system jets material through more than 1,000 independently controlled nozzles — each one turned on or off individually to build coating exactly where it's needed and nowhere else.
Coating is built layer by layer, with each layer cured instantly under UV-LED before the next is applied. This digital, additive process gives full control over thickness and geometry across a single board — thin-film protection in most areas, with selective reinforcement built up only where required.
Because keep-out zones are defined in software rather than physical masking, the system automatically avoids test points, connectors, gold fingers, and sensor windows — reducing labor, rework, and material waste while improving first-pass yield.
Digital, Layer-by-Layer Coating
From board data to cured protection, entirely software-defined
Import Board Data
CAD/Gerber data defines coating zones and keep-out areas digitally — no physical masking required.
Pixel-Level Jetting
Over 1,000 nozzles jet ~80 pL droplets at up to 400 dpi, coating only the defined target areas.
Instant UV-LED Cure
Each layer cures immediately after jetting, preventing dripping, spreading, or edge distortion.
Build Up in 3D
Layers stack digitally to create variable thickness — thin film in most zones, reinforced protection where needed.
Where Precision Matters Most
Built for dense, high-value, and safety-critical PCBA
자동차 전자 제품
ECUs, sensor modules, and control boards exposed to vibration and moisture
Medical Device PCBA
High-reliability boards requiring precise, repeatable protective coating
Aerospace & Industrial Control
Mission-critical modules requiring consistent, verified coating coverage
High-Density Consumer Electronics
Compact boards with connectors and test points that can't be blocked
기술 하이라이트
Key specifications that define pixel-level coating
Independently controlled
Minimum droplet volume
Jetting resolution
Minimum layer thickness
Edge control accuracy
주요 기능
Ten advantages of digital jetting for PCBA conformal coating
Pixel-Level Precision Jetting
Over 1,000 independently controlled nozzles enable fine, selective coating of targeted areas.
Ultra-Fine Droplet Control
Minimum droplet volume of approximately 80 pL, with jetting resolution up to 400 dpi.
Ultra-Thin Film Formation
Single-layer thickness as low as 0.016 mm, ideal for lightweight, high-precision protection.
3D Multi-Layer Stacked Encapsulation
Layer-by-layer jetting and curing enables fully digital control of thickness and geometry.
Sharp, Clean Coating Edges
Edge control accuracy within 0.05 mm, significantly reducing overspray.
Precise Keep-Out Zone Avoidance
Automatically avoids test points, connectors, gold fingers, and sensor windows without masking.
Localized Variable Thickness
Enables thin-film protection, selective reinforcement, and 3D encapsulation on the same PCBA.
Instant UV-LED Curing
Curing immediately follows jetting, minimizing dripping, spreading, and edge distortion.
High Material Utilization
On-demand jetting eliminates atomization waste, reducing material consumption by roughly one-third.
Intelligent Automated Maintenance
Supports automatic humidification, nozzle-clog detection, fluid path circulation, and printhead condition monitoring.
기술 매개변수
| 항목 | 기술 매개변수 및 설명 | 항목 | 기술 매개변수 및 설명 |
|---|---|---|---|
| 기술 | Digital inkjet selective encapsulation (piezoelectric) | 작업 방향 | 왼쪽→오른쪽(표준) Right→left (optional) |
| 치수 | W1000mm * L1200mm * H1170mm | 운반 높이 | 900±20mm |
| 무게 | 1000kg (1 ton) | 전송 속도 | 0~13m/분 |
| 제어 방법 | IPC + motion controller | 컨베이어 트랙 | 체인 컨베이어 |
| 소프트웨어 | RIP / layer-slicing software + Windows system | 레일 폭 조절 속도 | 250mm/min |
| 프로그래밍 | Graphic import + teach points, layer/thickness setting | PCB 가장자리 공간 | ≥5mm |
| Print head type | Multi-nozzle piezoelectric inkjet head, X Y Z axes | 통신 포트 | SMEMA 커넥터 |
| Nozzle count | >1,000 independently driven nozzles | No-coat zone control | Digitally masked — test points, connectors, gold fingers, sensor windows |
| Print resolution | 400 dpi (pixel pitch ≈63.5 μm) | Head maintenance | Auto humidification, clog detection, ink-path circulation |
| Minimum droplet volume | ≈80 pL | Material utilization | On-demand jetting, no atomization loss — up to ~1/3 material savings vs. spray |
| Jetting frequency | Up to ≈20 kHz per nozzle | 장비 공기 압력 | 0.5 Mpa |
| Coating area | X: 460mm Y: 460mm | 배기 풍량 요구 사항 | More than 15m³/min |
| Single-layer thickness | ≈15/30/50 μm (settable) | 입력 전압 | AC220V 50~60HZ |
| Total thickness range | ≈15-500 μm+ (multi-layer stacking) | 총 전력 | 2.2kw |
| Coating edge precision | <0.05mm | 표준 기능 | Purge station, LED UV detection light, LED lighting |
| Curing method | Water-cooled UV-LED, cure-per-layer | ||
| 최대 이동 속도 | 800mm/sec | ||
| 컴포넌트 최대 높이 | Conveying surface 180mm, bottom 100mm | ||
| 반복성 | 0.02mm |
