3D Digital Printing Conformal Coating Machine | Pixel-Level PCBA Protection | Sanco

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3D Digital Printing Conformal Coating Machine

Pixel-level precision jetting with 1,000+ independently controlled nozzles — digital, layer-by-layer PCBA protection without masking.

1,000+ Nozzles 0.016mm Layers No Masking Needed

Opis produktu

The 3D Digital Printing Conformal Coating Machine applies inkjet-based digital control to PCBA protection. Instead of spraying coating material across a board and masking off sensitive areas, the system jets material through more than 1,000 independently controlled nozzles — each one turned on or off individually to build coating exactly where it's needed and nowhere else.

Coating is built layer by layer, with each layer cured instantly under UV-LED before the next is applied. This digital, additive process gives full control over thickness and geometry across a single board — thin-film protection in most areas, with selective reinforcement built up only where required.

Because keep-out zones are defined in software rather than physical masking, the system automatically avoids test points, connectors, gold fingers, and sensor windows — reducing labor, rework, and material waste while improving first-pass yield.

                            
Nozzle Array
1,000+ Independent Nozzles

                            
Droplet Size
~80 pL, 400 dpi Resolution

                            
Layer Thickness
From 0.016mm per Layer

                            
Utwardzanie
Instant UV-LED, No Bake Oven

How It Works

Digital, Layer-by-Layer Coating

From board data to cured protection, entirely software-defined

Step 01

Import Board Data

CAD/Gerber data defines coating zones and keep-out areas digitally — no physical masking required.

Step 02

Pixel-Level Jetting

Over 1,000 nozzles jet ~80 pL droplets at up to 400 dpi, coating only the defined target areas.

Step 03

Instant UV-LED Cure

Each layer cures immediately after jetting, preventing dripping, spreading, or edge distortion.

Step 04

Build Up in 3D

Layers stack digitally to create variable thickness — thin film in most zones, reinforced protection where needed.

Zastosowania

Where Precision Matters Most

Built for dense, high-value, and safety-critical PCBA

Elektronika samochodowa

ECUs, sensor modules, and control boards exposed to vibration and moisture

Medical Device PCBA

High-reliability boards requiring precise, repeatable protective coating

Aerospace & Industrial Control

Mission-critical modules requiring consistent, verified coating coverage

High-Density Consumer Electronics

Compact boards with connectors and test points that can't be blocked

Wydajność

Najważniejsze informacje techniczne

Key specifications that define pixel-level coating

1,000+

Nozzles

Independently controlled

Minimum droplet volume

400

dpi

Jetting resolution

0.016

Minimum layer thickness

0.05

Edge control accuracy

Technologia

Kluczowe cechy

Ten advantages of digital jetting for PCBA conformal coating

Pixel-Level Precision Jetting

Over 1,000 independently controlled nozzles enable fine, selective coating of targeted areas.

Ultra-Fine Droplet Control

Minimum droplet volume of approximately 80 pL, with jetting resolution up to 400 dpi.

Ultra-Thin Film Formation

Single-layer thickness as low as 0.016 mm, ideal for lightweight, high-precision protection.

3D Multi-Layer Stacked Encapsulation

Layer-by-layer jetting and curing enables fully digital control of thickness and geometry.

Sharp, Clean Coating Edges

Edge control accuracy within 0.05 mm, significantly reducing overspray.

Precise Keep-Out Zone Avoidance

Automatically avoids test points, connectors, gold fingers, and sensor windows without masking.

Localized Variable Thickness

Enables thin-film protection, selective reinforcement, and 3D encapsulation on the same PCBA.

Instant UV-LED Curing

Curing immediately follows jetting, minimizing dripping, spreading, and edge distortion.

High Material Utilization

On-demand jetting eliminates atomization waste, reducing material consumption by roughly one-third.

Intelligent Automated Maintenance

Supports automatic humidification, nozzle-clog detection, fluid path circulation, and printhead condition monitoring.

3D Digital Printing Conformal Coating Machine - Technical Parameter

Parametry techniczne

Pozycja	Parametry techniczne i opis	Pozycja	Parametry techniczne i opis
Technologia	Digital inkjet selective encapsulation (piezoelectric)	Kierunek pracy	Left→right (standard) Right→left (optional)
Wymiary	W1000mm * L1200mm * H1170mm	Wysokość przenoszenia	900±20mm
Waga	1000kg (1 ton)	Prędkość transferu	0-13m/min
Metoda kontroli	IPC + motion controller	Conveyor track	Chain conveyor
Oprogramowanie	RIP / layer-slicing software + Windows system	Rail width adjust speed	250 mm/min
Programowanie	Graphic import + teach points, layer/thickness setting	Przestrzeń krawędzi PCB	≥5mm
Print head type	Multi-nozzle piezoelectric inkjet head, X Y Z axes	Port komunikacyjny	SMEMA connector
Nozzle count	>1,000 independently driven nozzles	No-coat zone control	Digitally masked — test points, connectors, gold fingers, sensor windows
Print resolution	400 dpi (pixel pitch ≈63.5 μm)	Head maintenance	Auto humidification, clog detection, ink-path circulation
Minimum droplet volume	≈80 pL	Material utilization	On-demand jetting, no atomization loss — up to ~1/3 material savings vs. spray
Jetting frequency	Up to ≈20 kHz per nozzle	Ciśnienie powietrza w urządzeniu	0.5 Mpa
Coating area	X: 460 mm Y: 460 mm	Exhaust air volume requirements	More than 15m³/min
Single-layer thickness	≈15/30/50 μm (settable)	Napięcie wejściowe	AC220V 50~60HZ
Total thickness range	≈15-500 μm+ (multi-layer stacking)	Całkowita moc	2.2kw
Coating edge precision	<0.05mm	Funkcje standardowe	Purge station, LED UV detection light, LED lighting
Curing method	Water-cooled UV-LED, cure-per-layer
Maksymalna prędkość ruchu	800 mm/s
Maksymalna wysokość komponentu	Conveying surface 180mm, bottom 100mm
Powtarzalność	0,02 mm