{"id":6714,"date":"2026-06-26T02:06:44","date_gmt":"2026-06-26T02:06:44","guid":{"rendered":"https:\/\/www.sancofd.com\/"},"modified":"2026-07-03T03:41:53","modified_gmt":"2026-07-03T03:41:53","slug":"chip-underfill","status":"publish","type":"page","link":"https:\/\/www.sancofd.com\/pl\/chip-underfill\/","title":{"rendered":"Chip Underfill"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"6714\" class=\"elementor elementor-6714\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9aa8703 e-con-full e-flex e-con e-parent\" data-id=\"9aa8703\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-962844c elementor-widget elementor-widget-html\" data-id=\"962844c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t<!-- ============================================================\r\n  SANCO \u2014 Application Sub-page: Chip Underfill (Consumer Electronics)\r\n  For use inside Elementor HTML widget\r\n  SEO\/GEO optimised \u00b7 JSON-LD Schema \u00b7 Internal product links \u2264 5\r\n============================================================ -->\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n  JSON-LD SCHEMA  (WebPage + HowTo + Product mentions)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<script type=\"application\/ld+json\">\r\n{\r\n  \"@context\": \"https:\/\/schema.org\",\r\n  \"@graph\": [\r\n    {\r\n      \"@type\": \"WebPage\",\r\n      \"@id\": \"https:\/\/www.sancofd.com\/application\/consumer-electronics\/chip-underfill\/\",\r\n      \"url\": \"https:\/\/www.sancofd.com\/application\/consumer-electronics\/chip-underfill\/\",\r\n      \"name\": \"Chip Underfill for Consumer Electronics | Dispensing Machine & Potting Solutions | SANCO\",\r\n      \"description\": \"SANCO dispensing machines deliver precise chip underfill for consumer electronics ICs \u2014 encapsulating bare dies, wafer-level chips and system-in-package devices to protect against mechanical stress, moisture and thermal fatigue.\",\r\n      \"inLanguage\": \"en\",\r\n      \"isPartOf\": {\r\n        \"@type\": \"WebSite\",\r\n        \"url\": \"https:\/\/www.sancofd.com\/\",\r\n        \"name\": \"SANCO Fluid Dispensing\"\r\n      },\r\n      \"breadcrumb\": {\r\n        \"@type\": \"BreadcrumbList\",\r\n        \"itemListElement\": [\r\n          {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\r\n          {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n          {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Consumer Electronics\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n          {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Chip Underfill\",\"item\":\"https:\/\/www.sancofd.com\/application\/consumer-electronics\/chip-underfill\/\"}\r\n        ]\r\n      }\r\n    },\r\n    {\r\n      \"@type\": \"HowTo\",\r\n      \"name\": \"Chip Underfill Process for Consumer Electronics Using SANCO Equipment\",\r\n      \"description\": \"Step-by-step guide to applying chip underfill epoxy beneath bare dies, flip-chips and SiP modules in consumer electronics using SANCO dispensing machines.\",\r\n      \"step\": [\r\n        {\r\n          \"@type\": \"HowToStep\",\r\n          \"position\": 1,\r\n          \"name\": \"Substrate Preparation & Plasma Cleaning\",\r\n          \"text\": \"Clean the substrate surface with plasma or UV-ozone treatment to remove organic contamination and maximise adhesion energy for the underfill epoxy.\"\r\n        },\r\n        {\r\n          \"@type\": \"HowToStep\",\r\n          \"position\": 2,\r\n          \"name\": \"Die Attach & Reflow\",\r\n          \"text\": \"Attach the bare die or flip-chip to the substrate via solder bumps or copper pillars and reflow. Confirm coplanarity before proceeding to underfill.\"\r\n        },\r\n        {\r\n          \"@type\": \"HowToStep\",\r\n          \"position\": 3,\r\n          \"name\": \"Substrate Preheat\",\r\n          \"text\": \"Preheat the assembly to 80\u2013100 \u00b0C to lower underfill viscosity below 500 mPa\u00b7s for rapid capillary penetration beneath ultra-low standoff gaps of 20\u201350 \u00b5m.\"\r\n        },\r\n        {\r\n          \"@type\": \"HowToStep\",\r\n          \"position\": 4,\r\n          \"name\": \"Precision Dispensing\",\r\n          \"text\": \"SANCO dispensing machine places a micro-volume epoxy bead on one or two die edges. 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UV-cure formulations can reduce this to under 90 seconds for high-speed lines.\"\r\n        }\r\n      ]\r\n    }\r\n  ]\r\n}\r\n<\/script>\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n  STYLES  (scoped, safe inside Elementor)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap *{box-sizing:border-box;margin:0;padding:0}\r\n\r\n\/* \u2500\u2500 tokens 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\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n  PAGE WRAPPER\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<div class=\"sanco-app-wrap\">\r\n\r\n  <!-- \u2550\u2550 HERO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-hero\" aria-label=\"Chip Underfill application hero\">\r\n    <div class=\"sanco-app-hero-bg\"><\/div>\r\n    <div class=\"sanco-app-hero-overlay\"><\/div>\r\n    <div class=\"sanco-app-hero-inner\">\r\n      <span class=\"sanco-app-hero-label\">Consumer Electronics \u00b7 Applications<\/span>\r\n      <h1>Chip Underfill<\/h1>\r\n      <p class=\"sanco-app-hero-sub\">Micro-volume dispensing solutions for chip underfill encapsulation of bare dies, flip-chips, wafer-level packages and system-in-package modules in consumer electronics.<\/p>\r\n    <\/div>\r\n  <\/section>\r\n\r\n  <!-- \u2550\u2550 BREADCRUMB \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n    <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n    <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n    <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n    <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n    <span>Consumer Electronics<\/span>\r\n    <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n    <span class=\"cur\">Chip Underfill<\/span>\r\n  <\/nav>\r\n\r\n  <!-- \u2550\u2550 INTRO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-intro\">\r\n    <div class=\"sanco-app-intro-wrap\">\r\n      <div class=\"sanco-app-intro-text\">\r\n        <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n        <h2>Precise Chip Underfill Dispensing for Consumer Electronics ICs<\/h2>\r\n        <p>Modern consumer electronics \u2014 smartphones, tablets, smartwatches, TWS earbuds and AR\/VR headsets \u2014 are built around extremely compact semiconductor packages: bare flip-chip dies, wafer-level chip-scale packages (WL-CSP), fan-out wafer-level packages (FOWLP) and system-in-package (SiP) modules. Each of these packages relies on solder bumps or copper pillars with standoff heights as small as 20\u201350 \u00b5m \u2014 far smaller than traditional BGA components. Without underfill, repeated thermal cycling and mechanical shock from everyday use concentrates stress on individual bumps, leading to fatigue cracking and field failure.<\/p>\r\n        <p>Chip underfill fills this microscopic gap with a thermoset epoxy that co-cures with the interconnect structure, redistributing stress across the entire die footprint. The result is a 10\u00d7 or greater improvement in thermal cycle life and significantly higher drop-test pass rates \u2014 both critical qualification criteria for consumer OEMs. The challenge for contract manufacturers and IDMs alike is applying this material at sub-milligram volumes with zero contamination of adjacent bond pads, optical elements or RF structures.<\/p>\r\n        <p>SANCO <a href=\"https:\/\/www.sancofd.com\/desktop-visual\/\" title=\"SANCO Desktop Visual Dispensing Machine\">desktop visual dispensing machines<\/a> and <a href=\"https:\/\/www.sancofd.com\/ds-series-linlinehigh-speeddispensing-machine\/\" title=\"SANCO DS Series Inline Dispensing Machine\">inline high-speed dispensing machines<\/a> are engineered for exactly this application window \u2014 delivering needle-position accuracy to \u00b10.03 mm, heated barrel stability within \u00b11 \u00b0C, and closed-loop pressure control that maintains consistent bead volume from the first die to the ten-thousandth.<\/p>\r\n      <\/div>\r\n      <div class=\"sanco-app-intro-img\">\r\n        <img loading=\"lazy\" decoding=\"async\"\r\n          src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/02\/Component-packaging_\u7ed3\u679c.webp\"\r\n          alt=\"SANCO dispensing machine applying chip underfill beneath a flip-chip die on a consumer electronics substrate\"\r\n          loading=\"lazy\"\r\n          width=\"600\" height=\"420\"\r\n        >\r\n      <\/div>\r\n    <\/div>\r\n  <\/section>\r\n\r\n  <!-- \u2550\u2550 CHALLENGES \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-challenges\">\r\n    <div class=\"sanco-app-challenges-wrap\">\r\n      <div class=\"sanco-app-sec-head\">\r\n        <span class=\"pill\">Manufacturing Challenges<\/span>\r\n        <h2>Why Chip Underfill Is Harder Than PCB Underfill<\/h2>\r\n        <p>Chip-level underfill operates at dimensions and tolerances an order of magnitude tighter than board-level processes. These are the six key challenges manufacturers face.<\/p>\r\n      <\/div>\r\n      <div class=\"sanco-challenge-grid\">\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">01<\/div>\r\n          <h4>Ultra-Low Standoff Gaps (20\u201350 \u00b5m)<\/h4>\r\n          <p>Flip-chip and WL-CSP standoffs are 2\u20134\u00d7 smaller than BGA components. Underfill viscosity must be below 300\u2013500 mPa\u00b7s at dispense temperature to achieve complete capillary fill without voiding, requiring precise barrel temperature control throughout the run.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">02<\/div>\r\n          <h4>Die Sizes From 1 mm\u00b2 to 100 mm\u00b2<\/h4>\r\n          <p>Consumer electronics chips span an enormous size range \u2014 from tiny 1\u00d71 mm RF dies to large 10\u00d710 mm application processors. Each die size requires a different dispensing pattern, bead volume and flow time. SANCO's offline programming handles this automatically from die dimensions entered in the software.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">03<\/div>\r\n          <h4>Contamination-Sensitive Adjacent Structures<\/h4>\r\n          <p>Consumer IC substrates often carry wire-bond pads, optical apertures, MEMS membranes and RF antenna traces immediately adjacent to the die. Any underfill flash on these structures causes immediate functional failure. Needle positioning accuracy must be within \u00b10.03 mm to maintain safe keep-out zones.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">04<\/div>\r\n          <h4>Multi-Die SiP Substrates<\/h4>\r\n          <p>System-in-package modules integrate multiple dies \u2014 logic, memory, PMIC, RF \u2014 on a single substrate. Each die may need a different underfill material or dispensing pattern, and the narrow inter-die gaps (as little as 100 \u00b5m) demand precise toolpath programming to avoid cross-contamination between cavities.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">05<\/div>\r\n          <h4>Warpage During Cure<\/h4>\r\n          <p>Thermal mismatch between die, underfill and substrate causes warpage during cure, which can open solder joints on adjacent components if not controlled. SANCO supports staged cure profiles and low-CTE underfill formulations to minimise warpage on thin substrates common in wearables and earbuds.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-challenge-card\">\r\n          <div class=\"cc-num\">06<\/div>\r\n          <h4>Takt Time Pressure on Advanced Packaging Lines<\/h4>\r\n          <p>Advanced packaging lines for flagship consumer devices target takt times below 10 seconds per substrate. SANCO's piezo jetting valve option eliminates needle Z-travel time entirely, enabling non-contact chip underfill dispensing at speeds compatible with the fastest flip-chip attach lines.<\/p>\r\n        <\/div>\r\n\r\n      <\/div>\r\n    <\/div>\r\n  <\/section>\r\n\r\n  <!-- \u2550\u2550 HIGHLIGHTS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-hl\">\r\n    <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n      <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n        <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n        <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n          Key Capabilities for Chip Underfill Applications\r\n        <\/h2>\r\n      <\/div>\r\n    <\/div>\r\n    <div class=\"sanco-app-hl-wrap\">\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\u25ce<\/div>\r\n        <h4>Sub-Milligram Dispense Volume<\/h4>\r\n        <p>Minimum dispense volume of 0.001 ml supports the smallest 1\u00d71 mm dies without overflow onto adjacent structures or bond pads.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\ud83c\udf21<\/div>\r\n        <h4>Barrel Temperature Control \u00b11 \u00b0C<\/h4>\r\n        <p>Tight thermal regulation of the material barrel keeps underfill viscosity stable across a full production shift, eliminating flow rate drift that causes voids or excess fillet.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\u25c8<\/div>\r\n        <h4>\u00b10.03 mm Needle Positioning<\/h4>\r\n        <p>CCD vision alignment corrects for substrate panel distortion and die placement offsets in real time, holding dispensing accuracy well within the keep-out zones of adjacent structures.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\u26a1<\/div>\r\n        <h4>Piezo Jetting for Non-Contact Dispense<\/h4>\r\n        <p>Optional piezo jetting valve eliminates needle-to-substrate contact entirely \u2014 essential for fragile MEMS, optical dies and ultra-thin wafer-level packages where mechanical contact would cause cracking.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\u267b<\/div>\r\n        <h4>Closed-Loop Pressure Feedback<\/h4>\r\n        <p>Real-time pressure monitoring auto-compensates for material aging and temperature variation, maintaining constant bead geometry from the first substrate to the last without manual intervention.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\u2726<\/div>\r\n        <h4>Multi-Die Pattern Programming<\/h4>\r\n        <p>Program separate dispensing patterns, volumes and keep-out zones for each die on a SiP substrate in a single programme file \u2014 no manual switching between recipes during production.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\ud83d\udcd0<\/div>\r\n        <h4>Gerber & CAD Import<\/h4>\r\n        <p>Import die layout data directly from Gerber or CSV to auto-generate dispensing toolpaths, reducing new product introduction time for each new consumer IC design entering production.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-app-hl-card\">\r\n        <div class=\"sanco-app-hl-icon\">\ud83d\udd17<\/div>\r\n        <h4>Inline Flip-Chip Line Integration<\/h4>\r\n        <p>SMEMA-compatible conveyor interface allows seamless integration between flip-chip bonder, SANCO underfill station and cure oven \u2014 fully automated with zero manual board handling.<\/p>\r\n      <\/div>\r\n\r\n    <\/div>\r\n  <\/section>\r\n\r\n  <!-- \u2550\u2550 PROCESS STEPS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-process\">\r\n    <div class=\"sanco-app-process-wrap\">\r\n      <div class=\"sanco-app-sec-head\">\r\n        <span class=\"pill\">Process Guide<\/span>\r\n        <h2>The Chip Underfill Process Step by Step<\/h2>\r\n        <p>Chip underfill demands tighter process control than board-level underfill. SANCO equipment is calibrated to support every stage from substrate prep through post-cure inspection.<\/p>\r\n      <\/div>\r\n      <div class=\"sanco-process-steps\">\r\n\r\n        <div class=\"sanco-process-step\">\r\n          <div class=\"ps-num\">Step 01<\/div>\r\n          <h4>Substrate Preparation & Plasma Clean<\/h4>\r\n          <p>Plasma or UV-ozone treatment removes organic contamination and raises surface energy for maximum underfill adhesion on bare substrates.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-process-step\">\r\n          <div class=\"ps-num\">Step 02<\/div>\r\n          <h4>Die Attach & Reflow<\/h4>\r\n          <p>Flip-chip or bare die is attached via solder bump or copper pillar reflow. Coplanarity and standoff uniformity are verified before underfill begins.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-process-step\">\r\n          <div class=\"ps-num\">Step 03<\/div>\r\n          <h4>Preheat to 80\u2013100 \u00b0C<\/h4>\r\n          <p>Substrate is preheated to lower underfill viscosity below 500 mPa\u00b7s, enabling rapid and complete capillary penetration into 20\u201350 \u00b5m gaps.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-process-step\">\r\n          <div class=\"ps-num\">Step 04<\/div>\r\n          <h4>Precision Dispensing & Fillet<\/h4>\r\n          <p>SANCO machine deposits a micro-volume bead on die edges. Capillary action fills beneath the die; a reinforcing fillet is then applied to all perimeter edges.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-process-step\">\r\n          <div class=\"ps-num\">Step 05<\/div>\r\n          <h4>Cure & C-SAM Inspection<\/h4>\r\n          <p>Thermal cure at 150\u2013165 \u00b0C \/ 30\u201345 min, or UV-assisted rapid cure. Post-cure acoustic microscopy (C-SAM) verifies void-free fill to OEM specification.<\/p>\r\n        <\/div>\r\n\r\n      <\/div>\r\n    <\/div>\r\n  <\/section>\r\n\r\n\r\n  <!-- \u2550\u2550 MATERIALS TABLE \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-materials\">\r\n    <div class=\"sanco-app-materials-wrap\">\r\n      <div class=\"sanco-app-sec-head\">\r\n        <span class=\"pill\">Materials Compatibility<\/span>\r\n        <h2>Chip Underfill Material Types & SANCO Compatibility<\/h2>\r\n        <p>SANCO dispensing machines handle the full spectrum of chip-level underfill materials used in advanced consumer electronics packaging.<\/p>\r\n      <\/div>\r\n      <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Chip underfill material types and SANCO equipment compatibility\">\r\n        <thead>\r\n          <tr>\r\n            <th>Material Type<\/th>\r\n            <th>Viscosity Range<\/th>\r\n            <th>Cure Method<\/th>\r\n            <th>Typical Application<\/th>\r\n            <th>SANCO Compatibility<\/th>\r\n          <\/tr>\r\n        <\/thead>\r\n        <tbody>\r\n          <tr>\r\n            <td><strong>Capillary Chip Underfill (CUF)<\/strong><\/td>\r\n            <td>100 \u2013 500 mPa\u00b7s<\/td>\r\n            <td>Thermal 150\u2013165 \u00b0C<\/td>\r\n            <td>Flip-chip on organic substrate; WL-CSP on PCB in smartphones and tablets<\/td>\r\n            <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n          <\/tr>\r\n          <tr>\r\n            <td><strong>No-Flow Underfill (NUF)<\/strong><\/td>\r\n            <td>500 \u2013 3,000 mPa\u00b7s<\/td>\r\n            <td>Reflow-activated<\/td>\r\n            <td>Pre-applied beneath bare die before bump reflow; earbuds, wearable SiP<\/td>\r\n            <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n          <\/tr>\r\n          <tr>\r\n            <td><strong>Wafer-Applied Underfill (WAUF)<\/strong><\/td>\r\n            <td>200 \u2013 1,000 mPa\u00b7s<\/td>\r\n            <td>Thermal or UV<\/td>\r\n            <td>Applied at wafer level before dicing; FOWLP and advanced node mobile SoCs<\/td>\r\n            <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n          <\/tr>\r\n          <tr>\r\n            <td><strong>SiP Multi-Die Underfill<\/strong><\/td>\r\n            <td>300 \u2013 2,000 mPa\u00b7s<\/td>\r\n            <td>Staged thermal cure<\/td>\r\n            <td>Individual die underfill within multi-chip SiP modules; smartwatches, TWS ICs<\/td>\r\n            <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n          <\/tr>\r\n          <tr>\r\n            <td><strong>Reworkable Chip Underfill<\/strong><\/td>\r\n            <td>1,000 \u2013 5,000 mPa\u00b7s<\/td>\r\n            <td>Thermal 125\u2013140 \u00b0C<\/td>\r\n            <td>Prototype and low-volume runs; high-value dies requiring rework capability<\/td>\r\n            <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n          <\/tr>\r\n        <\/tbody>\r\n      <\/table>\r\n    <\/div>\r\n  <\/section>\r\n\r\n  <!-- \u2550\u2550 FAQ \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n  <section class=\"sanco-app-faq\">\r\n    <div class=\"sanco-app-faq-wrap\">\r\n      <div class=\"sanco-app-sec-head\">\r\n        <span class=\"pill\">FAQ<\/span>\r\n        <h2>Frequently Asked Questions<\/h2>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>What is the smallest die size that SANCO dispensing machines can underfill?<\/h4>\r\n        <p>SANCO desktop visual dispensing machines support minimum dispense volumes of 0.001 ml with 30G needle gauges, enabling reliable capillary underfill on dies as small as 1\u00d71 mm \u2014 including the smallest RF and PMIC dies found in TWS earbud and smartwatch SiP modules. Contact our <a href=\"https:\/\/www.sancofd.com\/contact\/\" title=\"Contact SANCO engineers\">application engineers<\/a> to validate your specific die geometry and standoff specification.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>What is the difference between chip underfill and PCB underfill?<\/h4>\r\n        <p>Chip underfill refers to underfill applied directly beneath a bare die or wafer-level package on a substrate \u2014 standoff gaps are typically 20\u201350 \u00b5m and underfill viscosity must be extremely low (100\u2013500 mPa\u00b7s) for complete capillary fill. PCB underfill applies to board-level BGA and CSP packages with larger standoff gaps of 100\u2013300 \u00b5m and can use higher-viscosity materials. SANCO dispensing machines support both processes through interchangeable valve heads and adjustable barrel temperature.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>Can SANCO machines handle multi-die SiP substrates with different underfill patterns per die?<\/h4>\r\n        <p>Yes. SANCO's offline programming software allows engineers to define individual dispensing patterns, bead volumes, keep-out zones and cure profiles for each die on a SiP substrate within a single programme file. The machine executes each die's pattern sequentially in one pass without operator intervention or recipe switching.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>Is non-contact piezo jetting available for chip underfill?<\/h4>\r\n        <p>Yes. SANCO offers a <a href=\"https:\/\/www.sancofd.com\/piezo-valve-1\/\" title=\"SANCO Piezo Dispensing Valve\">piezo jetting valve<\/a> option that dispenses underfill as micro-droplets without needle contact. This is the preferred method for MEMS dies, optical packages and ultra-thin wafer-level packages where needle contact carries cracking risk. Jetting also eliminates needle Z-travel time, reducing cycle time by up to 40% on multi-die substrates.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>How does SANCO equipment prevent underfill voiding beneath flip-chip dies?<\/h4>\r\n        <p>Voids are primarily caused by insufficient substrate preheating, incorrect bead placement or material viscosity drift. SANCO addresses all three: the heated stage maintains substrate temperature within \u00b12 \u00b0C throughout dispensing; CCD vision places the bead within \u00b10.03 mm of the target die edge; and closed-loop pressure control compensates for material viscosity change as the barrel cools or ages. For applications with strict void specifications (below 1% by C-SAM), our application engineers can assist with process recipe development and validation.<\/p>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-faq-item\">\r\n        <h4>Where can I learn about other consumer electronics packaging applications?<\/h4>\r\n        <p>Visit our <a href=\"https:\/\/www.sancofd.com\/application\/\" title=\"SANCO Applications\">Applications section<\/a> for detailed guides covering PCB underfill, camera module bonding, speaker sealing, SMT surface mounting and more consumer electronics processes. For equipment specifications, see our <a href=\"https:\/\/www.sancofd.com\/desktop-visual\/\" title=\"SANCO Desktop Visual Dispensing Machine\">dispensing machine product pages<\/a>.<\/p>\r\n      <\/div>\r\n\r\n    <\/div>\r\n  <\/section>\r\n\r\n<\/div><!-- \/.sanco-app-wrap -->\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7acbe13 elementor-widget elementor-widget-html\" data-id=\"7acbe13\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t<!-- SANCO CTA Section with Popup Contact Form | Elementor HTML Widget -->\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n  font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n  background: #ffffff;\r\n  position: relative;\r\n  overflow: hidden;\r\n  padding: 80px 24px;\r\n  text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n  content: '';\r\n  position: absolute;\r\n  top: -140px;\r\n  right: -120px;\r\n  width: 480px;\r\n  height: 480px;\r\n  border-radius: 50%;\r\n  background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n  pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n  content: '';\r\n  position: absolute;\r\n  bottom: -160px;\r\n  left: -130px;\r\n  width: 420px;\r\n  height: 420px;\r\n  border-radius: 50%;\r\n  background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n  pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n  position: relative;\r\n  z-index: 1;\r\n  max-width: 680px;\r\n  margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n  font-size: clamp(26px, 4vw, 42px);\r\n  font-weight: 800;\r\n  color: #0a1628;\r\n  margin: 0 0 14px;\r\n  line-height: 1.2;\r\n  letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n  font-size: clamp(14px, 1.8vw, 17px);\r\n  color: #5a6472;\r\n  margin: 0 auto 36px;\r\n  max-width: 480px;\r\n  line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n  display: flex;\r\n  gap: 14px;\r\n  justify-content: center;\r\n  flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n  display: inline-flex;\r\n  align-items: center;\r\n  gap: 8px;\r\n  background: #2563eb;\r\n  color: #fff;\r\n  font-family: inherit;\r\n  font-size: 15px;\r\n  font-weight: 700;\r\n  padding: 14px 30px;\r\n  border-radius: 10px;\r\n  border: none;\r\n  cursor: pointer;\r\n  transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n  text-decoration: none;\r\n  letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n  background: #1d4ed8;\r\n  transform: translateY(-2px);\r\n  box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n  display: inline-flex;\r\n  align-items: center;\r\n  gap: 8px;\r\n  background: transparent;\r\n  color: #0a1628;\r\n  font-family: inherit;\r\n  font-size: 15px;\r\n  font-weight: 600;\r\n  padding: 14px 30px;\r\n  border-radius: 10px;\r\n  border: 1.5px solid #dbe0e8;\r\n  cursor: pointer;\r\n  transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n  text-decoration: none;\r\n  letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n  border-color: #2563eb;\r\n  color: #2563eb;\r\n  background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n  display: none;\r\n  position: fixed;\r\n  inset: 0;\r\n  background: rgba(5, 10, 22, 0.75);\r\n  backdrop-filter: blur(4px);\r\n  z-index: 99999;\r\n  align-items: center;\r\n  justify-content: center;\r\n  padding: 20px;\r\n  animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n  display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n  from { opacity: 0; }\r\n  to   { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n  background: #fff;\r\n  border-radius: 20px;\r\n  width: 100%;\r\n  max-width: 560px;\r\n  max-height: 92vh;\r\n  overflow-y: auto;\r\n  box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n  animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n  position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n  from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n  to   { opacity: 1; transform: translateY(0)   scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n  background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n  padding: 28px 32px 24px;\r\n  border-radius: 20px 20px 0 0;\r\n  position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n  font-size: 22px;\r\n  font-weight: 800;\r\n  color: #fff;\r\n  margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n  font-size: 14px;\r\n  color: rgba(255,255,255,0.6);\r\n  margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n  position: absolute;\r\n  top: 18px;\r\n  right: 18px;\r\n  width: 36px;\r\n  height: 36px;\r\n  background: rgba(255,255,255,0.22);\r\n  border: 1.5px solid rgba(255,255,255,0.5);\r\n  border-radius: 8px;\r\n  cursor: pointer;\r\n  display: flex;\r\n  align-items: center;\r\n  justify-content: center;\r\n  transition: background 0.2s, border-color 0.2s;\r\n  color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n  background: rgba(255,255,255,0.38);\r\n  border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n  padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n  display: grid;\r\n  grid-template-columns: 1fr 1fr;\r\n  gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n  margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n  display: block;\r\n  font-size: 13px;\r\n  font-weight: 600;\r\n  color: #0a1628;\r\n  margin-bottom: 7px;\r\n  letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n  color: #ef4444;\r\n  margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n  width: 100%;\r\n  padding: 12px 14px;\r\n  background: #f8fafc;\r\n  border: 1.5px solid #e5e7eb;\r\n  border-radius: 10px;\r\n  font-size: 14px;\r\n  color: #0a1628;\r\n  font-family: inherit;\r\n  transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n  box-sizing: border-box;\r\n  appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; }\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n  outline: none;\r\n  border-color: #2563eb;\r\n  background: #fff;\r\n  box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n  background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n  background-repeat: no-repeat;\r\n  background-position: right 12px center;\r\n  background-color: #f8fafc;\r\n  cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n  min-height: 100px;\r\n  resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n  width: 100%;\r\n  padding: 15px;\r\n  background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n  color: #fff;\r\n  border: none;\r\n  border-radius: 12px;\r\n  font-size: 16px;\r\n  font-weight: 700;\r\n  font-family: inherit;\r\n  cursor: pointer;\r\n  display: flex;\r\n  align-items: center;\r\n  justify-content: center;\r\n  gap: 10px;\r\n  margin-top: 6px;\r\n  transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n  letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n  opacity: 0.92;\r\n  transform: translateY(-1px);\r\n  box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n  display: flex;\r\n  align-items: flex-start;\r\n  gap: 10px;\r\n  margin-top: 18px;\r\n  padding: 12px 14px;\r\n  background: #f8fafc;\r\n  border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n  display: none;\r\n  align-items: center;\r\n  gap: 10px;\r\n  padding: 13px 16px;\r\n  border-radius: 10px;\r\n  font-size: 14px;\r\n  margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error  { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n  .sanco-form-row { grid-template-columns: 1fr; }\r\n  .sanco-modal-body { padding: 22px 20px 28px; }\r\n  .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n<!-- \u2500\u2500 CTA SECTION \u2500\u2500 -->\r\n<div class=\"sanco-cta-wrap\">\r\n  <div class=\"sanco-cta-inner\">\r\n    <h2>Ready to Optimize Your Production?<\/h2>\r\n    <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n    <div class=\"sanco-cta-btns\">\r\n      <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n        <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n        Get a Quote\r\n      <\/button>\r\n      <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n        <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n        View Products\r\n      <\/a>\r\n    <\/div>\r\n  <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 MODAL \u2500\u2500 -->\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n  <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n    <div class=\"sanco-modal-header\">\r\n      <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n      <p>Our team will respond within 24 hours.<\/p>\r\n      <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n        <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n      <\/button>\r\n    <\/div>\r\n\r\n    <div class=\"sanco-modal-body\">\r\n\r\n      <div class=\"sanco-msg error\" id=\"sancoError\">\r\n        <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n        <span id=\"sancoErrorText\"><\/span>\r\n      <\/div>\r\n\r\n      <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n        <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n        <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n      <\/div>\r\n\r\n      <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n        <!-- Honeypot -->\r\n        <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n          <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n        <\/div>\r\n\r\n        <div class=\"sanco-form-row\">\r\n          <div class=\"sanco-form-group\">\r\n            <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n            <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n          <\/div>\r\n          <div class=\"sanco-form-group\">\r\n            <label for=\"sancoCompany\">Company<\/label>\r\n            <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n          <\/div>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-form-row\">\r\n          <div class=\"sanco-form-group\">\r\n            <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n            <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n          <\/div>\r\n          <div class=\"sanco-form-group\">\r\n            <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n            <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n          <\/div>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-form-group\">\r\n          <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n          <select id=\"sancoInquiry\" name=\"inquiry\">\r\n            <option value=\"\">Select an option<\/option>\r\n            <option value=\"quote\">Request a Quote<\/option>\r\n            <option value=\"product\">Product Inquiry<\/option>\r\n            <option value=\"support\">Technical Support<\/option>\r\n            <option value=\"partnership\">Partnership<\/option>\r\n            <option value=\"other\">Other<\/option>\r\n          <\/select>\r\n        <\/div>\r\n\r\n        <div class=\"sanco-form-group\">\r\n          <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n          <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n        <\/div>\r\n\r\n        <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n          <span>Send Enquiry<\/span>\r\n          <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n        <\/button>\r\n\r\n        <div class=\"sanco-privacy\">\r\n          <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n          <span>Your information is secure and will never be shared with third parties.<\/span>\r\n        <\/div>\r\n\r\n      <\/form>\r\n    <\/div>\r\n  <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n  var loadTime = Date.now();\r\n\r\n  window.sancoOpenModal = function() {\r\n    document.getElementById('sancoModal').classList.add('active');\r\n    document.body.style.overflow = 'hidden';\r\n  };\r\n\r\n  window.sancoCloseModal = function() {\r\n    document.getElementById('sancoModal').classList.remove('active');\r\n    document.body.style.overflow = '';\r\n  };\r\n\r\n  window.sancoCloseOnBg = function(e) {\r\n    if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n  };\r\n\r\n  \/\/ Esc key\r\n  document.addEventListener('keydown', function(e) {\r\n    if (e.key === 'Escape') sancoCloseModal();\r\n  });\r\n\r\n  \/\/ Form submit\r\n  document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n    var err = document.getElementById('sancoError');\r\n    var suc = document.getElementById('sancoSuccess');\r\n    var errTxt = document.getElementById('sancoErrorText');\r\n\r\n    err.classList.remove('show');\r\n    suc.classList.remove('show');\r\n\r\n    \/\/ Honeypot\r\n    if (document.getElementById('sancoHp').value) {\r\n      e.preventDefault();\r\n      errTxt.textContent = 'Bot detected. Please try again.';\r\n      err.classList.add('show');\r\n      return;\r\n    }\r\n\r\n    \/\/ Time check\r\n    if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n      e.preventDefault();\r\n      errTxt.textContent = 'Please take a moment to fill in the form.';\r\n      err.classList.add('show');\r\n      return;\r\n    }\r\n\r\n    \/\/ Email\r\n    var email = document.getElementById('sancoEmail').value;\r\n    if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n      e.preventDefault();\r\n      errTxt.textContent = 'Please enter a valid email address.';\r\n      err.classList.add('show');\r\n      return;\r\n    }\r\n\r\n    suc.classList.add('show');\r\n  });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Consumer Electronics \u00b7 Applications Chip Underfill Micro-volume dispensing solutions for chip underfill encapsulation of bare dies, flip-chips, wafer-level packages and system-in-package modules in consumer electronics. Home \u203a Applications \u203a Consumer Electronics \u203a Chip Underfill Industry Overview Precise Chip Underfill Dispensing for Consumer Electronics ICs Modern consumer electronics \u2014 smartphones, tablets, smartwatches, TWS earbuds and AR\/VR [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6714","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/6714","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/comments?post=6714"}],"version-history":[{"count":13,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/6714\/revisions"}],"predecessor-version":[{"id":7249,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/6714\/revisions\/7249"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/media?parent=6714"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}