Mainboard Dispensing and Reinforcement | SANCO<\/title>\r\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\r\n<\/head>\r\n<body>\r\n\r\n\r\n\r\n<script type=\"application\/ld+json\">\r\n{\r\n \"@context\": \"https:\/\/schema.org\",\r\n \"@graph\": [\r\n {\r\n \"@type\": \"WebPage\",\r\n \"@id\": \"https:\/\/www.sancofd.com\/application\/mobile-computer-electronics\/mainboard-dispensing-and-reinforcement\/\",\r\n \"url\": \"https:\/\/www.sancofd.com\/application\/mobile-computer-electronics\/mainboard-dispensing-and-reinforcement\/\",\r\n \"name\": \"Mainboard Dispensing and Reinforcement for Mobile & Computer Electronics | SANCO\",\r\n \"description\": \"SANCO dispensing machines deliver precision underfill and mechanical reinforcement dispensing for smartphone and laptop mainboards, protecting fine-pitch 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and Reinforcement Process for Mobile & Computer Electronics Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to precision underfill and reinforcement adhesive dispensing for smartphone and laptop mainboard protection using SANCO dispensing equipment.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Mainboard Load & Vision Alignment\",\r\n \"text\": \"Assembled mainboard is loaded into the fixture; CCD vision locates BGA packages, connectors and reinforcement zones for the dispensing programme.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"Capillary Underfill Dispensing\",\r\n \"text\": \"SANCO dispensing machine deposits low-viscosity underfill along the edge of BGA and chip-scale packages, drawn by capillary action beneath the package to protect solder joints from mechanical and thermal stress.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Connector & Component Reinforcement Dispensing\",\r\n \"text\": \"A reinforcement adhesive bead is dispensed around board-to-board connectors, battery connectors and other mechanically stressed components to add drop-shock and flex resistance.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Cure (Thermal or UV)\",\r\n \"text\": \"Dispensed materials cure per specification, locking underfill and reinforcement adhesive into their final protective state without disturbing component position.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Coverage & Reliability Verification\",\r\n \"text\": \"Sample units undergo underfill coverage inspection via X-ray or cross-section, along with drop-test and flex-test verification to confirm the reinforcement meets reliability specification.\"\r\n }\r\n]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap 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.sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\r\n .sanco-app-intro-img img{height:260px}\r\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\r\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\r\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\r\n .sanco-process-step::after{display:none}\r\n}\r\n@media(max-width:600px){\r\n .sanco-app-hero{height:auto;min-height:340px;padding:32px 0}\r\n .sanco-app-hero h1{font-size:30px}\r\n .sanco-app-hero-sub{font-size:15px}\r\n .sanco-app-hl-wrap,.sanco-challenge-grid,\r\n .sanco-process-steps{grid-template-columns:1fr}\r\n .sanco-app-intro-text h2,.sanco-app-sec-head h2{font-size:28px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-materials-wrap,.sanco-app-faq-wrap{padding-left:16px;padding-right:16px}\r\n .sanco-challenge-card,.sanco-app-hl-card,.sanco-process-step{padding:20px 16px}\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-app-wrap\">\r\n\r\n \r\n <section class=\"sanco-app-hero\" aria-label=\"Mobile & Computer Electronics application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Mobile & Computer Electronics \u00b7 Applications<\/span>\r\n <h1>Mainboard Dispensing and Reinforcement<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision underfill and mechanical reinforcement dispensing for smartphone and laptop mainboards \u2014 protecting fine-pitch BGA and connector solder joints from drop shock and flex stress.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Mobile & Computer Electronics<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Mainboard Dispensing and Reinforcement<\/span>\r\n <\/nav>\r\n\r\n \r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Precision Underfill and Reinforcement for Drop-Resistant Mobile Mainboards<\/h2>\r\n <p>Smartphone and laptop mainboards pack fine-pitch BGA packages, chip-scale packages and board-to-board connectors into an increasingly compact, thin form factor that must survive the drop shocks, bending stress and thermal cycling of daily consumer use. Capillary underfill dispensed beneath BGA packages fills the gap between package and board with a resin that mechanically couples the solder balls, dramatically improving their resistance to the shear stress a drop impact or board flex event would otherwise concentrate directly on the solder joints.<\/p>\r\n <p>The dispensing challenge is achieving complete capillary fill beneath packages with standoff heights and ball pitches that continue to shrink with each device generation, while dispensing volume precisely enough that underfill wicks fully beneath the package without flowing onto adjacent components or test points. Reinforcement dispensing around connectors and mechanically exposed components requires a complementary but distinct precision \u2014 placing adhesive to add mechanical support without interfering with connector mating function or component removal during rework.<\/p>\r\n <p>SANCO high-speed micro-dispensing platforms and <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> deliver the capillary fill precision, CCD vision alignment and reinforcement dispensing accuracy required for smartphone and laptop mainboard protection across high-volume consumer electronics production.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Mobile-Electronics-2.png\"\r\n alt=\"SANCO dispensing machine applying capillary underfill along a BGA package edge on a smartphone mainboard\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Mainboard Reinforcement Demands Drop-Shock-Grade Precision<\/h2>\r\n <p>Fine-pitch packages and connectors on modern mobile mainboards must survive real-world drop and flex events that concentrate stress directly on solder joints.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Complete Capillary Fill Beneath Shrinking Standoff Heights<\/h4>\r\n <p>BGA and chip-scale package standoff heights continue to shrink with each device generation; underfill must achieve complete capillary fill beneath these increasingly narrow gaps without voids that would leave solder joints unprotected.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Volume Control to Prevent Component and Test Point Contamination<\/h4>\r\n <p>Dispensed underfill volume must be precisely calibrated so capillary action draws material fully beneath the package without excess flowing onto adjacent components, test points or connector contacts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Drop-Shock Reinforcement Without Connector Function Interference<\/h4>\r\n <p>Reinforcement adhesive around board-to-board and battery connectors must add mechanical support against drop shock without flowing into the connector's mating interface or compromising its electrical or mechanical function.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Multi-Package Sequential Dispensing on Dense Boards<\/h4>\r\n <p>Modern mainboards carry numerous BGA and CSP packages requiring underfill in a single production pass; dispensing sequence and cycle time must accommodate this component density within tight mainboard assembly takt times.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Rework Compatibility for High-Value Components<\/h4>\r\n <p>Some underfill and reinforcement processes must remain compatible with rework requirements for high-value components, balancing mechanical protection against the practical need to remove and replace failed components during manufacturing yield recovery.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>Thin Form Factor Volume and Height Constraints<\/h4>\r\n <p>Increasingly thin smartphone and laptop designs leave minimal vertical clearance for dispensed material; underfill and reinforcement bead height must stay within the board's stack-up tolerance without interfering with adjacent layers or the device housing.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Mainboard Dispensing and Reinforcement\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Sub-100 \u00b5m Capillary Underfill Precision<\/h4>\r\n <p>Low-viscosity underfill dispensing achieves complete capillary fill beneath fine-pitch BGA and CSP packages with standoff heights as small as tens of micrometres.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>CCD Vision Package & Connector Alignment<\/h4>\r\n <p>High-resolution optical alignment references package edges and connector positions, ensuring precise dispensing placement across dense mainboard layouts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Volume-Controlled Wicking Dispensing<\/h4>\r\n <p>Closed-loop volumetric dosing calibrates dispensed underfill volume to achieve complete fill without overflow onto adjacent components or contacts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>Connector-Safe Reinforcement Path Control<\/h4>\r\n <p>Programmable dispensing paths add mechanical reinforcement around connectors while precisely avoiding the mating interface and functional contact areas.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Multi-Package Sequential Dispensing<\/h4>\r\n <p>Single programme sequences underfill and reinforcement dispensing across every package and connector on the mainboard within one automated pass.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Low-Profile Bead Height Control<\/h4>\r\n <p>Precise dispensing volume and pattern control keep reinforcement bead height within the tight stack-up tolerance of thin smartphone and laptop mainboard designs.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Rework-Compatible Material Support<\/h4>\r\n <p>Compatible with underfill and reinforcement material chemistries selected to balance mechanical protection with rework accessibility requirements.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Mainboard SMT Line Integration<\/h4>\r\n <p>SMEMA-compatible conveyor integration links SANCO dispensing equipment directly into mainboard assembly lines between reflow and functional test stations.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Mainboard Dispensing and Reinforcement Process Step by Step<\/h2>\r\n <p>Mainboard reinforcement must achieve complete underfill coverage and connector-safe reinforcement across dense, thin-form-factor boards. SANCO equipment is calibrated for every stage.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Mainboard Load & Vision Alignment<\/h4>\r\n <p>Assembled mainboard is loaded and CCD vision locates BGA packages, connectors and reinforcement zones.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>Capillary Underfill Dispensing<\/h4>\r\n <p>Low-viscosity underfill is deposited along package edges, drawn beneath the package by capillary action to protect solder joints.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Connector & Component Reinforcement Dispensing<\/h4>\r\n <p>Reinforcement adhesive is dispensed around connectors and mechanically stressed components for drop-shock and flex resistance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Cure<\/h4>\r\n <p>Dispensed materials cure per specification, locking underfill and reinforcement into their final protective state.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Coverage & Reliability Verification<\/h4>\r\n <p>Sample units undergo underfill coverage inspection and drop\/flex-test verification against reliability specification.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n \r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Mainboard Dispensing Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing machines handle the underfill and reinforcement materials used across smartphone and laptop mainboard protection.<\/p>\r\n <\/div>\r\n <div class=\"sanco-mat-table-scroll\">\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Mainboard Dispensing Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>Capillary Underfill (No-Flow \/ Standard)<\/strong><\/td>\r\n <td>500 \u2013 5,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013150\u00b0C<\/td>\r\n <td>Solder joint protection beneath BGA and chip-scale packages against drop and flex stress<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Corner Bond \/ Edge Bond Adhesive<\/strong><\/td>\r\n <td>5,000 \u2013 30,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm or thermal 100\u2013130\u00b0C<\/td>\r\n <td>Targeted corner reinforcement for large BGA packages requiring partial rather than full underfill<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Connector Reinforcement Adhesive<\/strong><\/td>\r\n <td>10,000 \u2013 50,000 mPa\u00b7s<\/td>\r\n <td>UV or thermal 80\u2013120\u00b0C<\/td>\r\n <td>Mechanical reinforcement around board-to-board and battery connectors for drop-shock resistance<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Low-Stress Flexible Underfill<\/strong><\/td>\r\n <td>1,000 \u2013 8,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013130\u00b0C<\/td>\r\n <td>Flex-tolerant underfill for packages on boards subject to bending stress in thin form factors<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Rework-Compatible Underfill<\/strong><\/td>\r\n <td>800 \u2013 6,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013120\u00b0C<\/td>\r\n <td>Underfill formulation balancing solder joint protection with component rework accessibility<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO achieve complete underfill coverage beneath shrinking BGA standoff heights?<\/h4>\r\n <p>SANCO's low-viscosity underfill dispensing combined with precise volumetric dosing achieves complete capillary fill beneath BGA and CSP packages with standoff heights as small as tens of micrometres, matching the scale of current mobile mainboard packaging. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to review underfill parameters for your package specification.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO equipment reinforce connectors without affecting their mating function?<\/h4>\r\n <p>Yes. Programmable dispensing paths add mechanical reinforcement adhesive around connector housings while precisely avoiding the mating interface and functional contact areas, preserving connector performance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What throughput can SANCO achieve for high-volume mainboard underfill dispensing?<\/h4>\r\n <p>Cycle time depends on package count and underfill volume per package. SANCO high-speed dispensing platforms are configured to complete multi-package underfill and reinforcement dispensing within the takt time of high-volume mainboard assembly lines.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Does SANCO support rework-compatible underfill for mainboard manufacturing yield recovery?<\/h4>\r\n <p>Yes. SANCO dispensing platforms are compatible with underfill material chemistries specifically formulated to balance solder joint protection with the practical need to remove and replace failed high-value components during manufacturing.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO keep reinforcement bead height within thin mainboard stack-up tolerance?<\/h4>\r\n <p>Precise dispensing volume and pattern control keep reinforcement bead height within the tight vertical clearance available in thin smartphone and laptop mainboard designs, avoiding interference with adjacent layers or the device housing.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other mobile and computer electronics dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering conformal coating for PCBs, display module bonding and mid-frame structural bonding. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div>\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cb023cd elementor-widget elementor-widget-html\" data-id=\"cb023cd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 60%, #1a3a5c 100%);\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* subtle dot grid pattern *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n inset: 0;\r\n background-image: radial-gradient(circle, rgba(255,255,255,0.04) 1px, transparent 1px);\r\n background-size: 28px 28px;\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: rgba(255,255,255,0.65);\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.4);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: rgba(255,255,255,0.85);\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid rgba(255,255,255,0.25);\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: rgba(255,255,255,0.6);\r\n color: #fff;\r\n background: rgba(255,255,255,0.06);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; 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height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; 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height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n \r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Mainboard Dispensing and Reinforcement | SANCO Mobile & Computer Electronics \u00b7 Applications Mainboard Dispensing and Reinforcement Precision underfill and mechanical reinforcement dispensing for smartphone and laptop mainboards \u2014 protecting fine-pitch BGA and connector solder joints from drop shock and flex stress. Home \u203a Applications \u203a Mobile & Computer Electronics \u203a Mainboard Dispensing and Reinforcement Industry […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7170","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/comments?post=7170"}],"version-history":[{"count":4,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170\/revisions"}],"predecessor-version":[{"id":7197,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170\/revisions\/7197"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/media?parent=7170"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}

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\"HowTo\",\r\n \"name\": \"Mainboard Dispensing and Reinforcement Process for Mobile & Computer Electronics Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to precision underfill and reinforcement adhesive dispensing for smartphone and laptop mainboard protection using SANCO dispensing equipment.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Mainboard Load & Vision Alignment\",\r\n \"text\": \"Assembled mainboard is loaded into the fixture; CCD vision locates BGA packages, connectors and reinforcement zones for the dispensing programme.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"Capillary Underfill Dispensing\",\r\n \"text\": \"SANCO dispensing machine deposits low-viscosity underfill along the edge of BGA and chip-scale packages, drawn by capillary action beneath the package to protect solder joints from mechanical and thermal stress.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Connector & Component Reinforcement Dispensing\",\r\n \"text\": \"A reinforcement adhesive bead is dispensed around board-to-board connectors, battery connectors and other mechanically stressed components to add drop-shock and flex resistance.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Cure (Thermal or UV)\",\r\n \"text\": \"Dispensed materials cure per specification, locking underfill and reinforcement adhesive into their final protective state without disturbing component position.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Coverage & Reliability Verification\",\r\n \"text\": \"Sample units undergo underfill coverage inspection via X-ray or cross-section, along with drop-test and flex-test verification to confirm the reinforcement meets reliability specification.\"\r\n }\r\n]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget 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.cur{color:var(--navy);font-weight:600}\r\n\r\n\/* \u2500\u2500 INTRO \u2500\u2500 *\/\r\n.sanco-app-intro{padding:80px 0 60px;background:#fff}\r\n.sanco-app-intro-wrap{\r\n max-width:1200px;margin:0 auto;padding:0 48px;\r\n display:grid;grid-template-columns:1fr 1fr;gap:64px;align-items:center;\r\n}\r\n.sanco-app-eyebrow{\r\n font-size:11px;font-weight:700;color:var(--blue);\r\n letter-spacing:2.5px;text-transform:uppercase;margin-bottom:14px;\r\n}\r\n.sanco-app-intro-text h2{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:40px;font-weight:700;color:var(--navy);\r\n line-height:1.1;margin-bottom:18px;\r\n}\r\n.sanco-app-intro-text p{\r\n font-size:15.5px;line-height:1.85;color:var(--g600);margin-bottom:14px;\r\n}\r\n.sanco-app-intro-text a{color:var(--blue);font-weight:600;text-decoration:none}\r\n.sanco-app-intro-text a:hover{text-decoration:underline}\r\n.sanco-app-intro-img{border-radius:16px;overflow:hidden;box-shadow:0 20px 48px rgba(10,22,40,.1)}\r\n.sanco-app-intro-img img{width:100%;height:420px;object-fit:cover;display:block}\r\n\r\n\/* \u2500\u2500 CHALLENGES \u2500\u2500 *\/\r\n.sanco-app-challenges{padding:60px 0;background:var(--g50)}\r\n.sanco-app-challenges-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-app-sec-head{text-align:center;margin-bottom:44px}\r\n.sanco-app-sec-head .pill{\r\n display:inline-block;padding:5px 16px;\r\n background:var(--navy);color:#fff;\r\n font-size:10px;font-weight:700;letter-spacing:2px;\r\n text-transform:uppercase;border-radius:50px;margin-bottom:12px;\r\n}\r\n.sanco-app-sec-head h2{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:40px;font-weight:700;color:var(--navy);line-height:1.05;margin-bottom:10px;\r\n}\r\n.sanco-app-sec-head p{font-size:15.5px;color:var(--g600);max-width:640px;margin:0 auto}\r\n\r\n.sanco-challenge-grid{\r\n display:grid;grid-template-columns:repeat(3,1fr);gap:20px;\r\n}\r\n.sanco-challenge-card{\r\n padding:28px 26px;background:#fff;\r\n border:1px solid var(--g200);border-radius:var(--radius-card);\r\n}\r\n.sanco-challenge-card .cc-num{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:42px;font-weight:800;color:var(--g200);\r\n line-height:1;margin-bottom:10px;\r\n}\r\n.sanco-challenge-card h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\r\n.sanco-challenge-card p{font-size:13.5px;color:var(--g600);line-height:1.7}\r\n\r\n\/* \u2500\u2500 HIGHLIGHTS \u2500\u2500 *\/\r\n.sanco-app-hl{padding:60px 0;background:#fff}\r\n.sanco-app-hl-wrap{\r\n max-width:1200px;margin:0 auto;padding:0 48px;\r\n display:grid;grid-template-columns:repeat(4,1fr);gap:18px;\r\n}\r\n.sanco-app-hl-card{\r\n padding:26px 22px;background:var(--g50);\r\n border:1px solid var(--g200);border-radius:var(--radius-card);\r\n transition:all .25s;\r\n}\r\n.sanco-app-hl-card:hover{\r\n transform:translateY(-4px);\r\n box-shadow:0 14px 32px rgba(46,125,209,.1);\r\n border-color:var(--blue);\r\n}\r\n.sanco-app-hl-icon{\r\n width:44px;height:44px;border-radius:10px;\r\n background:linear-gradient(135deg,var(--blue),var(--blue-dk));\r\n color:#fff;display:flex;align-items:center;justify-content:center;\r\n font-size:20px;margin-bottom:14px;\r\n box-shadow:0 6px 16px rgba(46,125,209,.28);\r\n}\r\n.sanco-app-hl-icon svg{width:22px;height:22px;display:block}\r\n.sanco-app-hl-card h4{font-size:15px;font-weight:700;color:var(--navy);margin-bottom:6px}\r\n.sanco-app-hl-card p{font-size:13px;color:var(--g600);line-height:1.65}\r\n\r\n\/* \u2500\u2500 PROCESS \u2500\u2500 *\/\r\n.sanco-app-process{padding:60px 0;background:var(--g50)}\r\n.sanco-app-process-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-process-steps{display:grid;grid-template-columns:repeat(5,1fr);gap:12px;margin-top:10px}\r\n.sanco-process-step{\r\n background:#fff;border:1px solid var(--g200);border-radius:var(--radius-card);\r\n padding:22px 18px;position:relative;\r\n}\r\n.sanco-process-step::after{\r\n content:'\u203a';\r\n position:absolute;right:-14px;top:50%;transform:translateY(-50%);\r\n font-size:24px;color:var(--blue);font-weight:700;z-index:1;\r\n}\r\n.sanco-process-step:last-child::after{display:none}\r\n.sanco-process-step .ps-num{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:11px;font-weight:700;letter-spacing:2px;\r\n color:var(--blue);text-transform:uppercase;margin-bottom:8px;\r\n}\r\n.sanco-process-step h4{font-size:14px;font-weight:700;color:var(--navy);margin-bottom:6px}\r\n.sanco-process-step p{font-size:12.5px;color:var(--g600);line-height:1.65}\r\n\r\n\r\n\/* \u2500\u2500 MATERIALS TABLE \u2500\u2500 *\/\r\n.sanco-app-materials{padding:60px 0;background:var(--g50)}\r\n.sanco-app-materials-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-mat-table-scroll{width:100%;overflow-x:auto;-webkit-overflow-scrolling:touch;margin-top:8px}\r\n.sanco-mat-table{width:100%;min-width:640px;border-collapse:collapse;font-size:14px}\r\n.sanco-mat-table th{\r\n background:var(--navy);color:#fff;\r\n padding:13px 18px;text-align:left;font-size:12px;\r\n font-weight:700;letter-spacing:1px;text-transform:uppercase;\r\n}\r\n.sanco-mat-table th:first-child{border-radius:10px 0 0 0}\r\n.sanco-mat-table th:last-child{border-radius:0 10px 0 0}\r\n.sanco-mat-table td{\r\n padding:13px 18px;border-bottom:1px solid var(--g200);\r\n color:var(--g600);line-height:1.55;vertical-align:top;\r\n}\r\n.sanco-mat-table tr:last-child td{border-bottom:none}\r\n.sanco-mat-table tr:nth-child(even) td{background:var(--g100)}\r\n.sanco-mat-table .tag-rec{\r\n display:inline-block;padding:2px 10px;border-radius:50px;\r\n font-size:11px;font-weight:700;\r\n background:rgba(46,125,209,.1);color:var(--blue);\r\n}\r\n\r\n\/* \u2500\u2500 FAQS \u2500\u2500 *\/\r\n.sanco-app-faq{padding:60px 0;background:#fff}\r\n.sanco-app-faq-wrap{max-width:860px;margin:0 auto;padding:0 48px}\r\n.sanco-faq-item{\r\n border-bottom:1px solid var(--g200);padding:22px 0;\r\n}\r\n.sanco-faq-item:last-child{border-bottom:none}\r\n.sanco-faq-item h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\r\n.sanco-faq-item p{font-size:14.5px;color:var(--g600);line-height:1.8}\r\n.sanco-faq-item a{color:var(--blue);font-weight:600;text-decoration:none}\r\n.sanco-faq-item a:hover{text-decoration:underline}\r\n\r\n\/* \u2500\u2500 RESPONSIVE \u2500\u2500 *\/\r\n@media(max-width:1024px){\r\n .sanco-app-hero{height:360px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap,\r\n .sanco-app-faq-wrap{padding-left:24px;padding-right:24px}\r\n .sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\r\n .sanco-app-intro-img img{height:260px}\r\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\r\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\r\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\r\n .sanco-process-step::after{display:none}\r\n}\r\n@media(max-width:600px){\r\n .sanco-app-hero{height:auto;min-height:340px;padding:32px 0}\r\n .sanco-app-hero h1{font-size:30px}\r\n .sanco-app-hero-sub{font-size:15px}\r\n .sanco-app-hl-wrap,.sanco-challenge-grid,\r\n .sanco-process-steps{grid-template-columns:1fr}\r\n .sanco-app-intro-text h2,.sanco-app-sec-head h2{font-size:28px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-materials-wrap,.sanco-app-faq-wrap{padding-left:16px;padding-right:16px}\r\n .sanco-challenge-card,.sanco-app-hl-card,.sanco-process-step{padding:20px 16px}\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-app-wrap\">\r\n\r\n \r\n <section class=\"sanco-app-hero\" aria-label=\"Mobile & Computer Electronics application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Mobile & Computer Electronics \u00b7 Applications<\/span>\r\n <h1>Mainboard Dispensing and Reinforcement<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision underfill and mechanical reinforcement dispensing for smartphone and laptop mainboards \u2014 protecting fine-pitch BGA and connector solder joints from drop shock and flex stress.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Mobile & Computer Electronics<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Mainboard Dispensing and Reinforcement<\/span>\r\n <\/nav>\r\n\r\n \r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Precision Underfill and Reinforcement for Drop-Resistant Mobile Mainboards<\/h2>\r\n <p>Smartphone and laptop mainboards pack fine-pitch BGA packages, chip-scale packages and board-to-board connectors into an increasingly compact, thin form factor that must survive the drop shocks, bending stress and thermal cycling of daily consumer use. Capillary underfill dispensed beneath BGA packages fills the gap between package and board with a resin that mechanically couples the solder balls, dramatically improving their resistance to the shear stress a drop impact or board flex event would otherwise concentrate directly on the solder joints.<\/p>\r\n <p>The dispensing challenge is achieving complete capillary fill beneath packages with standoff heights and ball pitches that continue to shrink with each device generation, while dispensing volume precisely enough that underfill wicks fully beneath the package without flowing onto adjacent components or test points. Reinforcement dispensing around connectors and mechanically exposed components requires a complementary but distinct precision \u2014 placing adhesive to add mechanical support without interfering with connector mating function or component removal during rework.<\/p>\r\n <p>SANCO high-speed micro-dispensing platforms and <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> deliver the capillary fill precision, CCD vision alignment and reinforcement dispensing accuracy required for smartphone and laptop mainboard protection across high-volume consumer electronics production.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Mobile-Electronics-2.png\"\r\n alt=\"SANCO dispensing machine applying capillary underfill along a BGA package edge on a smartphone mainboard\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Mainboard Reinforcement Demands Drop-Shock-Grade Precision<\/h2>\r\n <p>Fine-pitch packages and connectors on modern mobile mainboards must survive real-world drop and flex events that concentrate stress directly on solder joints.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Complete Capillary Fill Beneath Shrinking Standoff Heights<\/h4>\r\n <p>BGA and chip-scale package standoff heights continue to shrink with each device generation; underfill must achieve complete capillary fill beneath these increasingly narrow gaps without voids that would leave solder joints unprotected.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Volume Control to Prevent Component and Test Point Contamination<\/h4>\r\n <p>Dispensed underfill volume must be precisely calibrated so capillary action draws material fully beneath the package without excess flowing onto adjacent components, test points or connector contacts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Drop-Shock Reinforcement Without Connector Function Interference<\/h4>\r\n <p>Reinforcement adhesive around board-to-board and battery connectors must add mechanical support against drop shock without flowing into the connector's mating interface or compromising its electrical or mechanical function.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Multi-Package Sequential Dispensing on Dense Boards<\/h4>\r\n <p>Modern mainboards carry numerous BGA and CSP packages requiring underfill in a single production pass; dispensing sequence and cycle time must accommodate this component density within tight mainboard assembly takt times.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Rework Compatibility for High-Value Components<\/h4>\r\n <p>Some underfill and reinforcement processes must remain compatible with rework requirements for high-value components, balancing mechanical protection against the practical need to remove and replace failed components during manufacturing yield recovery.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>Thin Form Factor Volume and Height Constraints<\/h4>\r\n <p>Increasingly thin smartphone and laptop designs leave minimal vertical clearance for dispensed material; underfill and reinforcement bead height must stay within the board's stack-up tolerance without interfering with adjacent layers or the device housing.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Mainboard Dispensing and Reinforcement\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Sub-100 \u00b5m Capillary Underfill Precision<\/h4>\r\n <p>Low-viscosity underfill dispensing achieves complete capillary fill beneath fine-pitch BGA and CSP packages with standoff heights as small as tens of micrometres.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>CCD Vision Package & Connector Alignment<\/h4>\r\n <p>High-resolution optical alignment references package edges and connector positions, ensuring precise dispensing placement across dense mainboard layouts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Volume-Controlled Wicking Dispensing<\/h4>\r\n <p>Closed-loop volumetric dosing calibrates dispensed underfill volume to achieve complete fill without overflow onto adjacent components or contacts.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>Connector-Safe Reinforcement Path Control<\/h4>\r\n <p>Programmable dispensing paths add mechanical reinforcement around connectors while precisely avoiding the mating interface and functional contact areas.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Multi-Package Sequential Dispensing<\/h4>\r\n <p>Single programme sequences underfill and reinforcement dispensing across every package and connector on the mainboard within one automated pass.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Low-Profile Bead Height Control<\/h4>\r\n <p>Precise dispensing volume and pattern control keep reinforcement bead height within the tight stack-up tolerance of thin smartphone and laptop mainboard designs.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Rework-Compatible Material Support<\/h4>\r\n <p>Compatible with underfill and reinforcement material chemistries selected to balance mechanical protection with rework accessibility requirements.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Mainboard SMT Line Integration<\/h4>\r\n <p>SMEMA-compatible conveyor integration links SANCO dispensing equipment directly into mainboard assembly lines between reflow and functional test stations.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Mainboard Dispensing and Reinforcement Process Step by Step<\/h2>\r\n <p>Mainboard reinforcement must achieve complete underfill coverage and connector-safe reinforcement across dense, thin-form-factor boards. SANCO equipment is calibrated for every stage.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Mainboard Load & Vision Alignment<\/h4>\r\n <p>Assembled mainboard is loaded and CCD vision locates BGA packages, connectors and reinforcement zones.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>Capillary Underfill Dispensing<\/h4>\r\n <p>Low-viscosity underfill is deposited along package edges, drawn beneath the package by capillary action to protect solder joints.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Connector & Component Reinforcement Dispensing<\/h4>\r\n <p>Reinforcement adhesive is dispensed around connectors and mechanically stressed components for drop-shock and flex resistance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Cure<\/h4>\r\n <p>Dispensed materials cure per specification, locking underfill and reinforcement into their final protective state.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Coverage & Reliability Verification<\/h4>\r\n <p>Sample units undergo underfill coverage inspection and drop\/flex-test verification against reliability specification.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n \r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Mainboard Dispensing Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing machines handle the underfill and reinforcement materials used across smartphone and laptop mainboard protection.<\/p>\r\n <\/div>\r\n <div class=\"sanco-mat-table-scroll\">\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Mainboard Dispensing Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>Capillary Underfill (No-Flow \/ Standard)<\/strong><\/td>\r\n <td>500 \u2013 5,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013150\u00b0C<\/td>\r\n <td>Solder joint protection beneath BGA and chip-scale packages against drop and flex stress<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Corner Bond \/ Edge Bond Adhesive<\/strong><\/td>\r\n <td>5,000 \u2013 30,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm or thermal 100\u2013130\u00b0C<\/td>\r\n <td>Targeted corner reinforcement for large BGA packages requiring partial rather than full underfill<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Connector Reinforcement Adhesive<\/strong><\/td>\r\n <td>10,000 \u2013 50,000 mPa\u00b7s<\/td>\r\n <td>UV or thermal 80\u2013120\u00b0C<\/td>\r\n <td>Mechanical reinforcement around board-to-board and battery connectors for drop-shock resistance<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Low-Stress Flexible Underfill<\/strong><\/td>\r\n <td>1,000 \u2013 8,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013130\u00b0C<\/td>\r\n <td>Flex-tolerant underfill for packages on boards subject to bending stress in thin form factors<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Rework-Compatible Underfill<\/strong><\/td>\r\n <td>800 \u2013 6,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013120\u00b0C<\/td>\r\n <td>Underfill formulation balancing solder joint protection with component rework accessibility<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO achieve complete underfill coverage beneath shrinking BGA standoff heights?<\/h4>\r\n <p>SANCO's low-viscosity underfill dispensing combined with precise volumetric dosing achieves complete capillary fill beneath BGA and CSP packages with standoff heights as small as tens of micrometres, matching the scale of current mobile mainboard packaging. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to review underfill parameters for your package specification.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO equipment reinforce connectors without affecting their mating function?<\/h4>\r\n <p>Yes. Programmable dispensing paths add mechanical reinforcement adhesive around connector housings while precisely avoiding the mating interface and functional contact areas, preserving connector performance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What throughput can SANCO achieve for high-volume mainboard underfill dispensing?<\/h4>\r\n <p>Cycle time depends on package count and underfill volume per package. SANCO high-speed dispensing platforms are configured to complete multi-package underfill and reinforcement dispensing within the takt time of high-volume mainboard assembly lines.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Does SANCO support rework-compatible underfill for mainboard manufacturing yield recovery?<\/h4>\r\n <p>Yes. SANCO dispensing platforms are compatible with underfill material chemistries specifically formulated to balance solder joint protection with the practical need to remove and replace failed high-value components during manufacturing.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO keep reinforcement bead height within thin mainboard stack-up tolerance?<\/h4>\r\n <p>Precise dispensing volume and pattern control keep reinforcement bead height within the tight vertical clearance available in thin smartphone and laptop mainboard designs, avoiding interference with adjacent layers or the device housing.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other mobile and computer electronics dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering conformal coating for PCBs, display module bonding and mid-frame structural bonding. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div>\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cb023cd elementor-widget elementor-widget-html\" data-id=\"cb023cd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 60%, #1a3a5c 100%);\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* subtle dot grid pattern *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n inset: 0;\r\n background-image: radial-gradient(circle, rgba(255,255,255,0.04) 1px, transparent 1px);\r\n background-size: 28px 28px;\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: rgba(255,255,255,0.65);\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.4);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: rgba(255,255,255,0.85);\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid rgba(255,255,255,0.25);\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: rgba(255,255,255,0.6);\r\n color: #fff;\r\n background: rgba(255,255,255,0.06);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; }\r\n to { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n background: #fff;\r\n border-radius: 20px;\r\n width: 100%;\r\n max-width: 560px;\r\n max-height: 92vh;\r\n overflow-y: auto;\r\n box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n to { opacity: 1; transform: translateY(0) scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n padding: 28px 32px 24px;\r\n border-radius: 20px 20px 0 0;\r\n position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n font-size: 22px;\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n font-size: 14px;\r\n color: rgba(255,255,255,0.6);\r\n margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n position: absolute;\r\n top: 18px;\r\n right: 18px;\r\n width: 36px;\r\n height: 36px;\r\n background: rgba(255,255,255,0.22);\r\n border: 1.5px solid rgba(255,255,255,0.5);\r\n border-radius: 8px;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n transition: background 0.2s, border-color 0.2s;\r\n color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n background: rgba(255,255,255,0.38);\r\n border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; }\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n outline: none;\r\n border-color: #2563eb;\r\n background: #fff;\r\n box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n background-repeat: no-repeat;\r\n background-position: right 12px center;\r\n background-color: #f8fafc;\r\n cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n min-height: 100px;\r\n resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n width: 100%;\r\n padding: 15px;\r\n background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n color: #fff;\r\n border: none;\r\n border-radius: 12px;\r\n font-size: 16px;\r\n font-weight: 700;\r\n font-family: inherit;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n gap: 10px;\r\n margin-top: 6px;\r\n transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n opacity: 0.92;\r\n transform: translateY(-1px);\r\n box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n \r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Mainboard Dispensing and Reinforcement | SANCO Mobile & Computer Electronics \u00b7 Applications Mainboard Dispensing and Reinforcement Precision underfill and mechanical reinforcement dispensing for smartphone and laptop mainboards \u2014 protecting fine-pitch BGA and connector solder joints from drop shock and flex stress. Home \u203a Applications \u203a Mobile & Computer Electronics \u203a Mainboard Dispensing and Reinforcement Industry […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7170","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/comments?post=7170"}],"version-history":[{"count":4,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170\/revisions"}],"predecessor-version":[{"id":7197,"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/pages\/7170\/revisions\/7197"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pl\/wp-json\/wp\/v2\/media?parent=7170"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}