{"id":6835,"date":"2026-07-01T03:48:39","date_gmt":"2026-07-01T03:48:39","guid":{"rendered":"https:\/\/www.sancofd.com\/"},"modified":"2026-07-03T07:39:53","modified_gmt":"2026-07-03T07:39:53","slug":"die-attach-dispensing","status":"publish","type":"page","link":"https:\/\/www.sancofd.com\/pt\/die-attach-dispensing\/","title":{"rendered":"Die Attach Dispensing"},"content":{"rendered":"\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\r\n\r\n\r\n\r\n\r\n\r\nDie Attach Dispensing | SANCO<\/title>\r\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\r\n<\/head>\r\n<body>\r\n<!-- ============================================================\r\n SANCO \u2014 Application Sub-page: Die Attach Dispensing (Semiconductor)\r\n For use inside Elementor HTML widget\r\n SEO\/GEO optimised \u00b7 JSON-LD Schema \u00b7 Internal product links \u2264 5\r\n============================================================ -->\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n JSON-LD SCHEMA (WebPage + HowTo + Product mentions)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<script type=\"application\/ld+json\">\r\n{\r\n \"@context\": \"https:\/\/schema.org\",\r\n \"@graph\": [\r\n {\r\n \"@type\": \"WebPage\",\r\n \"@id\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/die-attach-dispensing\/\",\r\n \"url\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/die-attach-dispensing\/\",\r\n \"name\": \"Die Attach Dispensing for Semiconductor Packaging | SANCO\",\r\n \"description\": \"SANCO dispensing machines deliver precision die attach adhesive dispensing for semiconductor packaging \u2014 conductive epoxy, eutectic and film alternatives for IC, MEMS and power device die bonding.\",\r\n \"inLanguage\": \"en\",\r\n \"isPartOf\": {\r\n \"@type\": \"WebSite\",\r\n \"url\": \"https:\/\/www.sancofd.com\/\",\r\n \"name\": \"SANCO Fluid Dispensing\"\r\n },\r\n \"breadcrumb\": {\r\n \"@type\": \"BreadcrumbList\",\r\n \"itemListElement\": [\r\n {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\r\n {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Semiconductor\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Die Attach Dispensing\",\"item\":\"https:\/\/www.sancofd.com\/application\/semiconductors\/die-attach-dispensing\/\"}\r\n ]\r\n }\r\n },\r\n {\r\n \"@type\": \"HowTo\",\r\n \"name\": \"Die Attach Dispensing Process for Semiconductor Packaging Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to dispensing die attach adhesive for semiconductor die bonding to lead frames and substrates using SANCO dispensing machines.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Lead Frame \/ Substrate Inspection\",\r\n \"text\": \"Lead frame or substrate die pad is inspected for oxidation, contamination or plating defects that would reduce die attach adhesion. Surface is plasma-cleaned if required by the material specification.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"Pattern Selection & Volume Calculation\",\r\n \"text\": \"Dispensing programme calculates the required adhesive pattern \u2014 dot, cross, X-pattern or full-coverage \u2014 based on die size, to achieve target bond line thickness and complete coverage after die placement squeeze-out.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Precision Die Attach Dispensing\",\r\n \"text\": \"SANCO dispensing machine deposits the calculated adhesive volume onto the die pad with positioning accuracy of \u00b10.03 mm. Dispensing speed and needle retraction are optimised to prevent tailing or stringing.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Die Placement & Squeeze-Out Verification\",\r\n \"text\": \"Die is placed onto the dispensed adhesive by the pick-and-place system. Adhesive squeeze-out forms a fillet around the die edge \u2014 verified by vision inspection to confirm complete coverage without bridging to adjacent dies.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Cure & Bond Line Thickness Verification\",\r\n \"text\": \"Adhesive is cured per material specification (thermal or UV). X-ray or cross-section sampling verifies bond line thickness and void content meet the package reliability specification.\"\r\n }\r\n ]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n STYLES (scoped, safe inside Elementor)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap *{box-sizing:border-box;margin:0;padding:0}\r\n\r\n\/* \u2500\u2500 tokens \u2500\u2500 *\/\r\n.sanco-app-wrap{\r\n --navy:#0a1628;\r\n --blue:#2e7dd1;\r\n --blue-dk:#1c68b8;\r\n --g50:#f8fafc;\r\n --g100:#f1f5f9;\r\n --g200:#e2e8f0;\r\n --g400:#94a3b8;\r\n --g600:#475569;\r\n --radius-card:14px;\r\n font-family:'DM Sans',sans-serif;\r\n color:var(--navy);\r\n}\r\n\r\n\/* \u2500\u2500 HERO \u2500\u2500 *\/\r\n.sanco-app-hero{\r\n position:relative;\r\n height:480px;\r\n overflow:hidden;\r\n display:flex;\r\n align-items:center;\r\n border-radius:0;\r\n}\r\n.sanco-app-hero-bg{\r\n position:absolute;inset:0;\r\n background:url('https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/04\/Semiconductors.png')\r\n center\/cover no-repeat;\r\n filter:brightness(.42);\r\n}\r\n.sanco-app-hero-overlay{\r\n position:absolute;inset:0;\r\n background:linear-gradient(90deg,rgba(10,22,40,.78) 40%,transparent 100%);\r\n}\r\n.sanco-app-hero-inner{\r\n position:relative;z-index:2;\r\n max-width:1200px;width:100%;margin:0 auto;padding:0 48px;\r\n}\r\n.sanco-app-hero-label{\r\n display:inline-block;padding:5px 16px;\r\n background:var(--blue);color:#fff;\r\n font-size:11px;font-weight:700;letter-spacing:2px;\r\n text-transform:uppercase;border-radius:50px;margin-bottom:16px;\r\n}\r\n.sanco-app-hero h1{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:clamp(40px,5.5vw,68px);font-weight:700;\r\n color:#fff;line-height:1.05;margin-bottom:16px;\r\n}\r\n.sanco-app-hero-sub{\r\n font-size:17px;color:rgba(255,255,255,.82);\r\n max-width:580px;line-height:1.75;\r\n}\r\n\r\n\/* \u2500\u2500 BREADCRUMB \u2500\u2500 *\/\r\n.sanco-app-bread{\r\n max-width:1200px;margin:0 auto;padding:15px 48px;\r\n font-size:13px;color:var(--g600);\r\n}\r\n.sanco-app-bread a{color:var(--g600);text-decoration:none}\r\n.sanco-app-bread a:hover{color:var(--blue)}\r\n.sanco-app-bread .sep{margin:0 8px;color:var(--g400)}\r\n.sanco-app-bread .cur{color:var(--navy);font-weight:600}\r\n\r\n\/* \u2500\u2500 INTRO \u2500\u2500 *\/\r\n.sanco-app-intro{padding:80px 0 60px;background:#fff}\r\n.sanco-app-intro-wrap{\r\n max-width:1200px;margin:0 auto;padding:0 48px;\r\n display:grid;grid-template-columns:1fr 1fr;gap:64px;align-items:center;\r\n}\r\n.sanco-app-eyebrow{\r\n font-size:11px;font-weight:700;color:var(--blue);\r\n letter-spacing:2.5px;text-transform:uppercase;margin-bottom:14px;\r\n}\r\n.sanco-app-intro-text h2{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:40px;font-weight:700;color:var(--navy);\r\n line-height:1.1;margin-bottom:18px;\r\n}\r\n.sanco-app-intro-text p{\r\n font-size:15.5px;line-height:1.85;color:var(--g600);margin-bottom:14px;\r\n}\r\n.sanco-app-intro-text a{color:var(--blue);font-weight:600;text-decoration:none}\r\n.sanco-app-intro-text a:hover{text-decoration:underline}\r\n.sanco-app-intro-img{border-radius:16px;overflow:hidden;box-shadow:0 20px 48px rgba(10,22,40,.1)}\r\n.sanco-app-intro-img img{width:100%;height:420px;object-fit:cover;display:block}\r\n\r\n\/* \u2500\u2500 CHALLENGES \u2500\u2500 *\/\r\n.sanco-app-challenges{padding:60px 0;background:var(--g50)}\r\n.sanco-app-challenges-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-app-sec-head{text-align:center;margin-bottom:44px}\r\n.sanco-app-sec-head .pill{\r\n display:inline-block;padding:5px 16px;\r\n background:var(--navy);color:#fff;\r\n font-size:10px;font-weight:700;letter-spacing:2px;\r\n text-transform:uppercase;border-radius:50px;margin-bottom:12px;\r\n}\r\n.sanco-app-sec-head h2{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:40px;font-weight:700;color:var(--navy);line-height:1.05;margin-bottom:10px;\r\n}\r\n.sanco-app-sec-head p{font-size:15.5px;color:var(--g600);max-width:640px;margin:0 auto}\r\n\r\n.sanco-challenge-grid{\r\n display:grid;grid-template-columns:repeat(3,1fr);gap:20px;\r\n}\r\n.sanco-challenge-card{\r\n padding:28px 26px;background:#fff;\r\n border:1px solid var(--g200);border-radius:var(--radius-card);\r\n}\r\n.sanco-challenge-card .cc-num{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:42px;font-weight:800;color:var(--g200);\r\n line-height:1;margin-bottom:10px;\r\n}\r\n.sanco-challenge-card h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\r\n.sanco-challenge-card p{font-size:13.5px;color:var(--g600);line-height:1.7}\r\n\r\n\/* \u2500\u2500 HIGHLIGHTS \u2500\u2500 *\/\r\n.sanco-app-hl{padding:60px 0;background:#fff}\r\n.sanco-app-hl-wrap{\r\n max-width:1200px;margin:0 auto;padding:0 48px;\r\n display:grid;grid-template-columns:repeat(4,1fr);gap:18px;\r\n}\r\n.sanco-app-hl-card{\r\n padding:26px 22px;background:var(--g50);\r\n border:1px solid var(--g200);border-radius:var(--radius-card);\r\n transition:all .25s;\r\n}\r\n.sanco-app-hl-card:hover{\r\n transform:translateY(-4px);\r\n box-shadow:0 14px 32px rgba(46,125,209,.1);\r\n border-color:var(--blue);\r\n}\r\n.sanco-app-hl-icon{\r\n width:44px;height:44px;border-radius:10px;\r\n background:linear-gradient(135deg,var(--blue),var(--blue-dk));\r\n color:#fff;display:flex;align-items:center;justify-content:center;\r\n font-size:20px;margin-bottom:14px;\r\n box-shadow:0 6px 16px rgba(46,125,209,.28);\r\n}\r\n.sanco-app-hl-icon svg{width:22px;height:22px;display:block}\r\n.sanco-app-hl-card h4{font-size:15px;font-weight:700;color:var(--navy);margin-bottom:6px}\r\n.sanco-app-hl-card p{font-size:13px;color:var(--g600);line-height:1.65}\r\n\r\n\/* \u2500\u2500 PROCESS \u2500\u2500 *\/\r\n.sanco-app-process{padding:60px 0;background:var(--g50)}\r\n.sanco-app-process-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-process-steps{display:grid;grid-template-columns:repeat(5,1fr);gap:12px;margin-top:10px}\r\n.sanco-process-step{\r\n background:#fff;border:1px solid var(--g200);border-radius:var(--radius-card);\r\n padding:22px 18px;position:relative;\r\n}\r\n.sanco-process-step::after{\r\n content:'\u203a';\r\n position:absolute;right:-14px;top:50%;transform:translateY(-50%);\r\n font-size:24px;color:var(--blue);font-weight:700;z-index:1;\r\n}\r\n.sanco-process-step:last-child::after{display:none}\r\n.sanco-process-step .ps-num{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:11px;font-weight:700;letter-spacing:2px;\r\n color:var(--blue);text-transform:uppercase;margin-bottom:8px;\r\n}\r\n.sanco-process-step h4{font-size:14px;font-weight:700;color:var(--navy);margin-bottom:6px}\r\n.sanco-process-step p{font-size:12.5px;color:var(--g600);line-height:1.65}\r\n\r\n\r\n\/* \u2500\u2500 MATERIALS TABLE \u2500\u2500 *\/\r\n.sanco-app-materials{padding:60px 0;background:var(--g50)}\r\n.sanco-app-materials-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-mat-table{width:100%;border-collapse:collapse;margin-top:8px;font-size:14px}\r\n.sanco-mat-table th{\r\n background:var(--navy);color:#fff;\r\n padding:13px 18px;text-align:left;font-size:12px;\r\n font-weight:700;letter-spacing:1px;text-transform:uppercase;\r\n}\r\n.sanco-mat-table th:first-child{border-radius:10px 0 0 0}\r\n.sanco-mat-table th:last-child{border-radius:0 10px 0 0}\r\n.sanco-mat-table td{\r\n padding:13px 18px;border-bottom:1px solid var(--g200);\r\n color:var(--g600);line-height:1.55;vertical-align:top;\r\n}\r\n.sanco-mat-table tr:last-child td{border-bottom:none}\r\n.sanco-mat-table tr:nth-child(even) td{background:var(--g100)}\r\n.sanco-mat-table .tag-rec{\r\n display:inline-block;padding:2px 10px;border-radius:50px;\r\n font-size:11px;font-weight:700;\r\n background:rgba(46,125,209,.1);color:var(--blue);\r\n}\r\n\r\n\/* \u2500\u2500 FAQS \u2500\u2500 *\/\r\n.sanco-app-faq{padding:60px 0;background:#fff}\r\n.sanco-app-faq-wrap{max-width:860px;margin:0 auto;padding:0 48px}\r\n.sanco-faq-item{\r\n border-bottom:1px solid var(--g200);padding:22px 0;\r\n}\r\n.sanco-faq-item:last-child{border-bottom:none}\r\n.sanco-faq-item h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\r\n.sanco-faq-item p{font-size:14.5px;color:var(--g600);line-height:1.8}\r\n.sanco-faq-item a{color:var(--blue);font-weight:600;text-decoration:none}\r\n.sanco-faq-item a:hover{text-decoration:underline}\r\n\r\n\/* \u2500\u2500 RESPONSIVE \u2500\u2500 *\/\r\n@media(max-width:1024px){\r\n .sanco-app-hero{height:360px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap,\r\n .sanco-app-faq-wrap{padding-left:24px;padding-right:24px}\r\n .sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\r\n .sanco-app-intro-img img{height:260px}\r\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\r\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\r\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\r\n .sanco-process-step::after{display:none}\r\n}\r\n@media(max-width:600px){\r\n .sanco-app-hero{height:300px}\r\n .sanco-app-hero h1{font-size:32px}\r\n .sanco-app-hero-sub{font-size:14.5px}\r\n .sanco-app-sec-head h2{font-size:28px}\r\n .sanco-app-intro-text h2{font-size:28px}\r\n .sanco-app-hl-wrap,.sanco-challenge-grid,\r\n .sanco-process-steps{grid-template-columns:1fr}\r\n .sanco-mat-table{display:block;overflow-x:auto;-webkit-overflow-scrolling:touch;white-space:nowrap}\r\n .sanco-app-faq-wrap{padding-left:20px;padding-right:20px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap{padding-left:20px;padding-right:20px}\r\n}\r\n@media(max-width:420px){\r\n .sanco-app-hero{height:260px}\r\n .sanco-app-hero h1{font-size:28px}\r\n .sanco-app-hero-label{font-size:10px;padding:4px 12px}\r\n}\r\n<\/style>\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n PAGE WRAPPER\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<div class=\"sanco-app-wrap\">\r\n\r\n <!-- \u2550\u2550 HERO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-hero\" aria-label=\"Semiconductor application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Semiconductor \u00b7 Applications<\/span>\r\n <h1>Die Attach Dispensing<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision die attach adhesive dispensing for semiconductor packaging \u2014 conductive epoxy, silver-filled and thermally conductive die bond materials for IC, MEMS, power device and LED die attach.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 BREADCRUMB \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Semiconductor<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Die Attach Dispensing<\/span>\r\n <\/nav>\r\n\r\n <!-- \u2550\u2550 INTRO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Precision Die Attach Adhesive Dispensing for Semiconductor Packaging<\/h2>\r\n <p>Die attach is the foundational interconnect in nearly every semiconductor package \u2014 the bond that mechanically and often electrically connects the silicon die to its lead frame, substrate or heat spreader. While eutectic and solder die attach remain common for specific applications, adhesive die attach using silver-filled epoxy, thermally conductive non-conductive films and specialty formulations has become the dominant method across IC packaging, MEMS sensors, power devices and LED die bonding \u2014 prized for its lower processing temperature, stress-absorbing properties and compatibility with a wide range of die and substrate materials.<\/p>\r\n <p>The dispensing challenge in die attach is achieving consistent bond line thickness and complete void-free coverage across die sizes ranging from sub-1 mm MEMS dies to 10+ mm power semiconductor dies \u2014 all while controlling the adhesive volume precisely enough that squeeze-out forms a clean fillet without bridging to adjacent dies on a multi-die substrate or contaminating wire bond pads. For power semiconductor applications, the die attach layer must also conduct heat efficiently away from the die, making bond line thickness control directly relevant to thermal performance and device reliability.<\/p>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> and <a href='https:\/\/www.sancofd.com\/high-speed-dispenser\/' title='SANCO High-Speed Dispenser'>high-speed dispensers<\/a> deliver the micro-volume accuracy, CCD vision alignment and pattern programmability needed for die attach dispensing across the full range of semiconductor package types and production volumes.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/02\/Semiconductor-Packaging_\u7ed3\u679c.webp\"\r\n alt=\"SANCO dispensing machine applying silver-filled epoxy die attach adhesive onto a semiconductor lead frame\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 CHALLENGES \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Die Attach Dispensing Demands Precision Across Diverse Package Types<\/h2>\r\n <p>Die attach dispensing must adapt to enormous variation in die size, substrate type and thermal requirement while maintaining consistent bond quality across every unit.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Bond Line Thickness Control for Thermal Performance<\/h4>\r\n <p>For power semiconductor die attach, bond line thickness directly determines thermal resistance between die and heat spreader. A BLT variation of just 10 \u00b5m can change junction-to-case thermal resistance by 5\u201310%, affecting device current rating and long-term reliability.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Pattern Scaling Across Die Sizes<\/h4>\r\n <p>A single assembly line may process dies from 0.5\u00d70.5 mm sensor chips to 15\u00d715 mm power modules. Each die size requires a different dispensing pattern \u2014 single dot, multi-dot array or cross pattern \u2014 calculated to deliver the correct squeeze-out coverage without excess flash.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Void-Free Coverage Under Large Dies<\/h4>\r\n <p>Large power device dies create extended flow distances during die placement squeeze-out. Incomplete adhesive flow leaves voids beneath the die centre that concentrate thermal and mechanical stress, leading to premature device failure under power cycling.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Multi-Die Substrate Bridging Prevention<\/h4>\r\n <p>Multi-chip modules and SiP substrates place dies as close as 0.2 mm apart. Dispensed adhesive volume and squeeze-out pattern must be precisely controlled to prevent bridging between adjacent die attach pads, which would short electrical isolation between dies.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Conductive vs Non-Conductive Material Selection<\/h4>\r\n <p>Silver-filled conductive epoxy is required where the die back-side serves as an electrical terminal; non-conductive or thermally conductive films are used where electrical isolation is required. Dispensing equipment must handle the differing viscosity and filler content of both material classes.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>High-Throughput Lead Frame Strip Processing<\/h4>\r\n <p>IC assembly lines process lead frame strips with 20\u2013100+ die sites per strip at rates of 3,000\u20138,000 units per hour. Dispensing cycle time per die site must be under 0.5 seconds while maintaining positioning accuracy across the full strip.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 HIGHLIGHTS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Die Attach Dispensing\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>0.001 ml Minimum Dispense Volume<\/h4>\r\n <p>Sub-milligram dispense capability supports the smallest MEMS and sensor die attach applications with precise control over adhesive volume per die site.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>CCD Vision Alignment \u00b10.03 mm<\/h4>\r\n <p>Automatic optical alignment compensates for lead frame strip positioning variation, placing the adhesive pattern accurately on every die pad across the full strip.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Bond Line Thickness Control via Volume Dosing<\/h4>\r\n <p>Precise volumetric dosing per die pad, combined with known die placement force, achieves repeatable bond line thickness \u2014 critical for power semiconductor thermal performance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>High-Speed Multi-Site Dispensing<\/h4>\r\n <p>800 mm\/s axis speed completes die attach dispensing across full lead frame strips at rates compatible with 3,000\u20138,000 units per hour assembly lines.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Pattern Library for All Die Sizes<\/h4>\r\n <p>Pre-built dot, cross, multi-dot array and full-coverage dispensing patterns scale automatically from die dimensions \u2014 covering the full range from MEMS to power device die sizes.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Conductive & Non-Conductive Material Compatible<\/h4>\r\n <p>Handles silver-filled conductive epoxy, thermally conductive adhesive and non-conductive die attach films through interchangeable valve configurations on the same platform.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Lead Frame Strip Programme Import<\/h4>\r\n <p>Import lead frame strip layout data to auto-generate dispensing coordinates for all die sites \u2014 supporting rapid changeover between different package families.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Die Bonder Integration<\/h4>\r\n <p>SMEMA-compatible conveyor integration links SANCO dispensing machines directly into die bonding lines between lead frame loading and die placement stations.<\/p>\r\n <\/div>\r\n\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 PROCESS STEPS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Die Attach Dispensing Process Step by Step<\/h2>\r\n <p>Die attach dispensing must deliver precise, repeatable adhesive volume across diverse die sizes and substrate types. SANCO equipment supports every stage.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Lead Frame Inspection & Load<\/h4>\r\n <p>Lead frame strip or substrate loaded and inspected for surface defects. CCD vision captures die pad positions across the strip.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>Pattern & Volume Calculation<\/h4>\r\n <p>Dispensing programme selects pattern type and volume based on die dimensions stored for the package family being processed.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Precision Multi-Site Dispensing<\/h4>\r\n <p>SANCO machine dispenses adhesive across all die sites on the strip with \u00b10.03 mm positioning accuracy and controlled volume per site.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Die Placement & Vision Verification<\/h4>\r\n <p>Die placed by pick-and-place system. Squeeze-out coverage verified by vision inspection to confirm complete, bridge-free fillet formation.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Cure & Bond Quality Verification<\/h4>\r\n <p>Thermal or UV cure per material specification. Sample X-ray or cross-section inspection verifies bond line thickness and void content.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n <!-- \u2550\u2550 MATERIALS TABLE \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Die Attach Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing machines handle all adhesive die attach material types used in semiconductor packaging.<\/p>\r\n <\/div>\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Die Attach Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>Silver-Filled Conductive Epoxy<\/strong><\/td>\r\n <td>5,000 \u2013 30,000 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u2013175\u00b0C, 30\u201360 min<\/td>\r\n <td>Electrically and thermally conductive die attach for power semiconductors, RF devices and discrete components<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Non-Conductive Epoxy<\/strong><\/td>\r\n <td>3,000 \u2013 20,000 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u00b0C, 30\u201360 min<\/td>\r\n <td>Electrically isolating die attach for stacked die packages and multi-chip modules requiring isolation<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Thermally Conductive Non-Conductive Adhesive<\/strong><\/td>\r\n <td>10,000 \u2013 50,000 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u2013175\u00b0C<\/td>\r\n <td>High thermal conductivity without electrical conductivity for sensitive analog and RF die attach<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Snap-Cure Epoxy (High Throughput)<\/strong><\/td>\r\n <td>5,000 \u2013 25,000 mPa\u00b7s<\/td>\r\n <td>Thermal 200\u00b0C, 5\u201315 min<\/td>\r\n <td>Fast-cure die attach for high-volume lead frame assembly lines requiring minimal cure oven dwell time<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>UV-Cure Die Attach Adhesive<\/strong><\/td>\r\n <td>2,000 \u2013 15,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm, 10\u201330 s<\/td>\r\n <td>Rapid-cure die attach for UV-transparent substrates; used in optical sensor and MEMS die bonding<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 FAQ \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO control bond line thickness for power semiconductor die attach?<\/h4>\r\n <p>SANCO dispensing machines precisely meter the adhesive volume per die pad based on die area and target bond line thickness. Since die placement force is consistent in automated die bonders, controlling dispensed volume directly controls the resulting bond line thickness after squeeze-out. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to validate volume calculations for your specific die and BLT target.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What dispensing pattern does SANCO recommend for large power device dies?<\/h4>\r\n <p>For dies larger than 5\u00d75 mm, SANCO recommends a multi-dot or cross dispensing pattern rather than a single central dot. This ensures adhesive flow distance during die placement squeeze-out remains short enough to achieve void-free coverage under the entire die, particularly at the die corners which are furthest from a single-point dispense location.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO machines prevent adhesive bridging on closely spaced multi-die substrates?<\/h4>\r\n <p>Yes. SANCO's closed-loop volume control combined with CCD vision-verified die pad spacing ensures dispensed adhesive volume is calculated to produce squeeze-out that stays within each die's allocated pad area, even at die-to-die spacing as tight as 0.2 mm.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What throughput can SANCO dispensing machines achieve for lead frame strip processing?<\/h4>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/high-speed-dispenser\/'>high-speed dispensers<\/a> achieve dispensing cycle times under 0.5 seconds per die site, supporting lead frame assembly lines processing 3,000\u20138,000 units per hour depending on strip configuration and die count per strip.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Does SANCO support both conductive and non-conductive die attach materials on the same machine?<\/h4>\r\n <p>Yes. SANCO dispensing machines use interchangeable valve heads and material-specific barrel configurations, allowing changeover between silver-filled conductive epoxy and non-conductive die attach adhesives within 15\u201330 minutes for mixed-product assembly lines.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other semiconductor packaging dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering chip underfill, wafer-level packaging dispensing, glob top encapsulation and dam and fill processes. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div><!-- \/.sanco-app-wrap -->\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-38e3646 e-con-full e-flex e-con e-parent\" data-id=\"38e3646\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a102bae elementor-widget elementor-widget-html\" data-id=\"a102bae\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t<!-- SANCO CTA Section with Popup Contact Form | Elementor HTML Widget -->\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; }\r\n to { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n background: #fff;\r\n border-radius: 20px;\r\n width: 100%;\r\n max-width: 560px;\r\n max-height: 92vh;\r\n overflow-y: auto;\r\n box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n to { opacity: 1; transform: translateY(0) scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n padding: 28px 32px 24px;\r\n border-radius: 20px 20px 0 0;\r\n position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n font-size: 22px;\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n font-size: 14px;\r\n color: rgba(255,255,255,0.6);\r\n margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n position: absolute;\r\n top: 18px;\r\n right: 18px;\r\n width: 36px;\r\n height: 36px;\r\n background: rgba(255,255,255,0.22);\r\n border: 1.5px solid rgba(255,255,255,0.5);\r\n border-radius: 8px;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n transition: background 0.2s, border-color 0.2s;\r\n color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n background: rgba(255,255,255,0.38);\r\n border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; }\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n outline: none;\r\n border-color: #2563eb;\r\n background: #fff;\r\n box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n background-repeat: no-repeat;\r\n background-position: right 12px center;\r\n background-color: #f8fafc;\r\n cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n min-height: 100px;\r\n resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n width: 100%;\r\n padding: 15px;\r\n background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n color: #fff;\r\n border: none;\r\n border-radius: 12px;\r\n font-size: 16px;\r\n font-weight: 700;\r\n font-family: inherit;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n gap: 10px;\r\n margin-top: 6px;\r\n transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n opacity: 0.92;\r\n transform: translateY(-1px);\r\n box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n<!-- \u2500\u2500 CTA SECTION \u2500\u2500 -->\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 MODAL \u2500\u2500 -->\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n <!-- Honeypot -->\r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Die Attach Dispensing | SANCO Semiconductor \u00b7 Applications Die Attach Dispensing Precision die attach adhesive dispensing for semiconductor packaging \u2014 conductive epoxy, silver-filled and thermally conductive die bond materials for IC, MEMS, power device and LED die attach. Home \u203a Applications \u203a Semiconductor \u203a Die Attach Dispensing Industry Overview Precision Die Attach Adhesive Dispensing for […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6835","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6835","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/comments?post=6835"}],"version-history":[{"count":9,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6835\/revisions"}],"predecessor-version":[{"id":7286,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6835\/revisions\/7286"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/media?parent=6835"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}