Wafer-Level Packaging Dispensing | SANCO<\/title>\r\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\r\n<\/head>\r\n<body>\r\n\r\n\r\n\r\n<script type=\"application\/ld+json\">\r\n{\r\n \"@context\": \"https:\/\/schema.org\",\r\n \"@graph\": [\r\n {\r\n \"@type\": \"WebPage\",\r\n \"@id\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\",\r\n \"url\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\",\r\n \"name\": \"Wafer-Level Packaging Dispensing | Semiconductor Manufacturing | SANCO\",\r\n \"description\": \"SANCO dispensing machines deliver precision dispensing for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection and wafer-level molding compound dispensing for advanced semiconductor packaging.\",\r\n \"inLanguage\": \"en\",\r\n \"isPartOf\": {\r\n \"@type\": \"WebSite\",\r\n \"url\": \"https:\/\/www.sancofd.com\/\",\r\n \"name\": \"SANCO Fluid Dispensing\"\r\n },\r\n \"breadcrumb\": {\r\n \"@type\": \"BreadcrumbList\",\r\n \"itemListElement\": [\r\n {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\r\n {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Semiconductor\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Wafer-Level Packaging Dispensing\",\"item\":\"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\"}\r\n ]\r\n }\r\n },\r\n {\r\n \"@type\": \"HowTo\",\r\n \"name\": \"Wafer-Level Packaging Dispensing Process Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to precision dispensing for wafer-level chip-scale packaging and fan-out wafer-level packaging using SANCO dispensing machines.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Wafer Mount & Alignment\",\r\n \"text\": \"Diced or full wafer is mounted on a vacuum chuck or carrier frame. CCD vision captures wafer notch and die fiducials to establish the coordinate system for all subsequent dispensing operations across the full wafer.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"RDL Protection Coating Dispensing\",\r\n \"text\": \"SANCO dispensing machine applies a thin, controlled-thickness protective coating over the redistribution layer (RDL) traces, leaving bump pad openings exposed within \u00b10.02 mm tolerance.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Bump Protection or Underfill Dispensing\",\r\n \"text\": \"For WLCSP applications, underfill material is dispensed in a wafer-level pattern beneath the solder bump array, or protective material is dispensed around individual bumps to prevent damage during dicing and handling.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Singulation Edge Sealing\",\r\n \"text\": \"After wafer dicing, edge sealant may be dispensed along the die perimeter to protect exposed silicon and prevent moisture ingress at the singulated edge \u2014 particularly important for fan-out packages with exposed mold compound interfaces.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Cure & Wafer-Level Inspection\",\r\n \"text\": \"Material is cured per specification (UV or thermal). Automated wafer-level inspection scans 100% of die sites to verify dispensing coverage, thickness and absence of defects before wafer sort and ship.\"\r\n }\r\n ]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap *{box-sizing:border-box;margin:0;padding:0}\r\n\r\n\/* \u2500\u2500 tokens \u2500\u2500 *\/\r\n.sanco-app-wrap{\r\n --navy:#0a1628;\r\n --blue:#2e7dd1;\r\n --blue-dk:#1c68b8;\r\n --g50:#f8fafc;\r\n --g100:#f1f5f9;\r\n --g200:#e2e8f0;\r\n --g400:#94a3b8;\r\n --g600:#475569;\r\n --radius-card:14px;\r\n font-family:'DM Sans',sans-serif;\r\n color:var(--navy);\r\n}\r\n\r\n\/* \u2500\u2500 HERO \u2500\u2500 *\/\r\n.sanco-app-hero{\r\n position:relative;\r\n height:480px;\r\n overflow:hidden;\r\n display:flex;\r\n align-items:center;\r\n border-radius:0;\r\n}\r\n.sanco-app-hero-bg{\r\n position:absolute;inset:0;\r\n 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.sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap{padding-left:20px;padding-right:20px}\r\n}\r\n@media(max-width:420px){\r\n .sanco-app-hero{height:260px}\r\n .sanco-app-hero h1{font-size:28px}\r\n .sanco-app-hero-label{font-size:10px;padding:4px 12px}\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-app-wrap\">\r\n\r\n \r\n <section class=\"sanco-app-hero\" aria-label=\"Semiconductor application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Semiconductor \u00b7 Applications<\/span>\r\n <h1>Wafer-Level Packaging Dispensing<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision dispensing solutions for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection, wafer-level molding compound dispensing and bump protection for advanced semiconductor packaging.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Semiconductor<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Wafer-Level Packaging Dispensing<\/span>\r\n <\/nav>\r\n\r\n \r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Precision Dispensing for Wafer-Level Packaging Processes<\/h2>\r\n <p>Wafer-level packaging (WLP) represents the most miniaturised and highest-density tier of semiconductor packaging, performing all package-level processes \u2014 redistribution layer formation, bumping, protective coating and even molding \u2014 while the die is still part of the full wafer, before singulation. This approach, used in wafer-level chip-scale packages (WLCSP) and fan-out wafer-level packages (FOWLP), eliminates the substrate entirely for many applications, producing the smallest possible package footprint for mobile processors, RF front-end modules and sensor ICs. Every dispensing operation in WLP must be executed across the entire wafer surface \u2014 typically 200mm or 300mm in diameter \u2014 with consistency from edge to edge.<\/p>\r\n <p>The dispensing challenge in wafer-level packaging is achieving micron-level pattern accuracy and thickness uniformity across a large-area substrate where even small variations compound across thousands of die sites per wafer. RDL protection coating must leave bump pad openings precisely exposed while covering all routing traces \u2014 a keep-out boundary that may be only 20\u201330 \u00b5m wide on advanced nodes. Underfill dispensing for WLCSP bump arrays must achieve complete capillary fill beneath bump pitches as fine as 150\u2013400 \u00b5m, while edge sealing after singulation must protect the die perimeter without contaminating the active circuit area.<\/p>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> with high-resolution vision systems provide the wafer-scale positioning accuracy, pattern precision and process repeatability needed for wafer-level packaging dispensing across WLCSP, fan-out and advanced bumped wafer applications.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/02\/Semiconductor-packaging_\u7ed3\u679c-1.webp\"\r\n alt=\"SANCO dispensing machine applying precision coating across a semiconductor wafer for wafer-level packaging\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Wafer-Level Packaging Dispensing Demands Wafer-Scale Precision<\/h2>\r\n <p>WLP dispensing must maintain micron-level accuracy across an entire wafer surface, where small variations compound across thousands of die sites.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Edge-to-Edge Thickness Uniformity<\/h4>\r\n <p>RDL protection coating and wafer-level molding compound must maintain thickness uniformity within \u00b15% across the full 200mm or 300mm wafer diameter. Edge effects from spin or spray coating processes are a common source of non-uniformity that selective dispensing must avoid.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Fine-Pitch Bump Pad Keep-Out<\/h4>\r\n <p>Advanced WLCSP designs use bump pitches as fine as 150\u2013400 \u00b5m. Protective coating dispensing must leave bump pad openings exposed within \u00b10.02 mm tolerance \u2014 any coating bridging onto the bump pad prevents proper solder ball attachment in the next process step.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Sub-Bump Underfill Capillary Fill<\/h4>\r\n <p>Underfill beneath fine-pitch bump arrays must achieve complete capillary fill in gaps as small as 50\u2013100 \u00b5m at wafer level, before singulation. Incomplete fill creates voids that are extremely difficult to detect and rework at this stage of the process.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Wafer Warpage Compensation<\/h4>\r\n <p>Wafers with asymmetric layer stress, particularly fan-out wafers with reconstituted mold compound, can exhibit warpage of several hundred microns across the wafer diameter. Dispensing Z-axis must compensate for this warpage in real time to maintain consistent standoff height.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Singulation Edge Protection Without Active Area Contamination<\/h4>\r\n <p>Edge sealant dispensed after dicing must protect the exposed die edge and mold compound interface without flowing onto the active circuit area or bond pads \u2014 a particular challenge given the proximity of the die edge to functional structures in fan-out packages.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>100% Wafer Inspection Throughput<\/h4>\r\n <p>WLP dispensing quality must be verified across 100% of die sites per wafer before shipment, since any coverage defect affects yield. Inspection cycle time must keep pace with dispensing throughput to avoid becoming a production bottleneck.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Wafer-Level Packaging Dispensing\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Wafer-Scale Vision Alignment \u00b10.02 mm<\/h4>\r\n <p>High-resolution CCD vision system maintains positioning accuracy across the full wafer diameter, critical for fine-pitch bump pad keep-out zones on advanced WLCSP designs.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>Real-Time Z-Axis Warpage Compensation<\/h4>\r\n <p>Laser height sensing tracks wafer surface profile in real time, automatically adjusting dispensing standoff height to compensate for fan-out wafer warpage of several hundred microns.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Thickness Uniformity Control \u00b15%<\/h4>\r\n <p>Closed-loop dispensing parameters maintain coating or underfill thickness uniformity within \u00b15% from wafer centre to edge \u2014 essential for consistent electrical and mechanical performance across all die.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>High-Throughput Wafer Processing<\/h4>\r\n <p>Optimised dispensing path planning processes a full 300mm wafer in minutes, supporting wafer-level packaging production volumes without becoming a line bottleneck.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Sub-100 \u00b5m Capillary Underfill Capability<\/h4>\r\n <p>Low-viscosity underfill dispensing achieves complete capillary fill beneath fine-pitch bump arrays with gaps as small as 50\u2013100 \u00b5m, validated for WLCSP reliability requirements.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Multi-Material Platform for WLP Process Flow<\/h4>\r\n <p>Handles RDL protection coating, bump underfill, mold compound dam material and singulation edge sealant through interchangeable valve configurations on one platform.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Wafer Map Import for Die-Level Programming<\/h4>\r\n <p>Import wafer map data identifying known-good-die locations to selectively process only viable die sites, reducing material consumption on wafers with yield-limited maps.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Wafer Fab Back-End Integration<\/h4>\r\n <p>Cassette-to-cassette wafer handling compatible interfaces integrate SANCO dispensing machines into wafer-level packaging back-end lines between RDL formation, bumping and dicing stations.<\/p>\r\n <\/div>\r\n\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Wafer-Level Packaging Dispensing Process Step by Step<\/h2>\r\n <p>Wafer-level packaging dispensing requires wafer-scale precision across multiple process steps. SANCO equipment supports the full WLP process flow.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Wafer Mount & Vision Alignment<\/h4>\r\n <p>Wafer mounted on chuck or carrier. CCD vision captures notch orientation and die grid fiducials to establish the full-wafer coordinate system.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>RDL Protection Dispensing<\/h4>\r\n <p>Protective coating dispensed over RDL routing traces, leaving bump pad openings exposed within \u00b10.02 mm across all die sites on the wafer.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Bump Underfill or Protection Dispensing<\/h4>\r\n <p>Underfill or protective material dispensed around the bump array using wafer-level pattern programming, validated for complete capillary fill.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Cure & Wafer-Level Inspection<\/h4>\r\n <p>Material cured per specification. 100% automated wafer inspection verifies coverage, thickness and defect-free dispensing across all die sites.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Singulation Edge Sealing (Post-Dice)<\/h4>\r\n <p>After dicing, edge sealant dispensed along die perimeter to protect exposed silicon and mold compound interfaces without contaminating active circuit areas.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n \r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Wafer-Level Packaging Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing machines handle the materials used across the wafer-level packaging process flow from RDL protection through singulation edge sealing.<\/p>\r\n <\/div>\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Wafer-Level Packaging Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>RDL Protection Coating (Polyimide-Compatible)<\/strong><\/td>\r\n <td>100 \u2013 2,000 mPa\u00b7s<\/td>\r\n <td>Thermal cure or UV<\/td>\r\n <td>Selective protection over redistribution layer traces, leaving bump pads exposed for WLCSP and FOWLP<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Wafer-Level Capillary Underfill (WLCUF)<\/strong><\/td>\r\n <td>50 \u2013 500 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u2013165\u00b0C<\/td>\r\n <td>Sub-bump underfill for fine-pitch WLCSP bump arrays with pitch as fine as 150\u2013400 \u00b5m<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Wafer-Level Molding Compound Dam Material<\/strong><\/td>\r\n <td>5,000 \u2013 30,000 mPa\u00b7s<\/td>\r\n <td>Thermal or UV pre-cure<\/td>\r\n <td>Dam dispensing to contain liquid molding compound during fan-out wafer reconstitution process<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Singulation Edge Sealant<\/strong><\/td>\r\n <td>2,000 \u2013 20,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm or thermal<\/td>\r\n <td>Post-dice edge protection sealant for exposed die edges and mold compound interfaces in fan-out packages<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Bump Protection Coating<\/strong><\/td>\r\n <td>500 \u2013 5,000 mPa\u00b7s<\/td>\r\n <td>UV or thermal<\/td>\r\n <td>Selective protective coating around solder bump arrays to prevent damage during dicing and wafer handling<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO maintain positioning accuracy across a full 300mm wafer?<\/h4>\r\n <p>SANCO desktop visual dispensing machines use high-resolution CCD vision referenced to wafer notch and multiple die fiducials distributed across the wafer surface, correcting for any rotational or scaling offset between the programmed coordinate system and the actual wafer position. This achieves positioning accuracy of \u00b10.02 mm consistently from wafer centre to edge. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to discuss wafer-scale process validation.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO machines compensate for fan-out wafer warpage during dispensing?<\/h4>\r\n <p>Yes. SANCO dispensing machines support real-time laser height sensing that tracks the wafer surface profile during the dispensing pass, automatically adjusting Z-axis position to maintain consistent standoff height even across wafers with several hundred microns of warpage \u2014 common in reconstituted fan-out wafers.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What underfill capability does SANCO offer for fine-pitch WLCSP bump arrays?<\/h4>\r\n <p>SANCO dispensing machines apply wafer-level capillary underfill with viscosities as low as 50 mPa\u00b7s, achieving complete capillary fill beneath bump pitches from 150 to 400 \u00b5m. The dispensing pattern and volume are validated through void-content verification using acoustic microscopy or cross-section sampling during process development.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO prevent RDL protection coating from covering bump pad openings?<\/h4>\r\n <p>SANCO's CCD vision-guided selective dispensing programs each bump pad location as a keep-out zone, maintaining a boundary accuracy of \u00b10.02 mm between the dispensed coating and the pad opening. This precision is validated against the specific RDL design rules for each wafer product before production release.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO equipment integrate with cassette-to-cassette wafer handling systems?<\/h4>\r\n <p>Yes. SANCO dispensing machines can be configured with cassette-to-cassette wafer handling interfaces compatible with standard wafer fab back-end automation, enabling integration into existing wafer-level packaging production lines without manual wafer transfer.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other semiconductor packaging dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering die attach dispensing, chip package encapsulation, glob top protection and dam and fill processes. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div>\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-8de0a80 e-con-full e-flex e-con e-parent\" data-id=\"8de0a80\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ed10779 elementor-widget elementor-widget-html\" data-id=\"ed10779\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; 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}\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n outline: none;\r\n border-color: #2563eb;\r\n background: #fff;\r\n box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n background-repeat: no-repeat;\r\n background-position: right 12px center;\r\n background-color: #f8fafc;\r\n cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n min-height: 100px;\r\n resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n width: 100%;\r\n padding: 15px;\r\n background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n color: #fff;\r\n border: none;\r\n border-radius: 12px;\r\n font-size: 16px;\r\n font-weight: 700;\r\n font-family: inherit;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n gap: 10px;\r\n margin-top: 6px;\r\n transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n opacity: 0.92;\r\n transform: translateY(-1px);\r\n box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n \r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Wafer-Level Packaging Dispensing | SANCO Semiconductor \u00b7 Applications Wafer-Level Packaging Dispensing Precision dispensing solutions for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection, wafer-level molding compound dispensing and bump protection for advanced semiconductor packaging. Home \u203a Applications \u203a Semiconductor \u203a Wafer-Level Packaging Dispensing Industry Overview Precision Dispensing for Wafer-Level Packaging Processes Wafer-level packaging (WLP) represents […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6839","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/comments?post=6839"}],"version-history":[{"count":10,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839\/revisions"}],"predecessor-version":[{"id":7298,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839\/revisions\/7298"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/media?parent=6839"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}

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\n\t\t\t\t\t\r\n\r\n\r\n\r\n\r\n\r\nWafer-Level Packaging Dispensing | SANCO<\/title>\r\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\r\n<\/head>\r\n<body>\r\n\r\n\r\n\r\n<script type=\"application\/ld+json\">\r\n{\r\n \"@context\": \"https:\/\/schema.org\",\r\n \"@graph\": [\r\n {\r\n \"@type\": \"WebPage\",\r\n \"@id\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\",\r\n \"url\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\",\r\n \"name\": \"Wafer-Level Packaging Dispensing | Semiconductor Manufacturing | SANCO\",\r\n \"description\": \"SANCO dispensing machines deliver precision dispensing for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection and wafer-level molding compound dispensing for advanced semiconductor packaging.\",\r\n \"inLanguage\": \"en\",\r\n \"isPartOf\": {\r\n \"@type\": \"WebSite\",\r\n \"url\": \"https:\/\/www.sancofd.com\/\",\r\n \"name\": \"SANCO Fluid Dispensing\"\r\n },\r\n \"breadcrumb\": {\r\n \"@type\": \"BreadcrumbList\",\r\n \"itemListElement\": [\r\n {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\r\n {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Semiconductor\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Wafer-Level Packaging Dispensing\",\"item\":\"https:\/\/www.sancofd.com\/application\/semiconductors\/wafer-level-packaging-dispensing\/\"}\r\n ]\r\n }\r\n },\r\n {\r\n \"@type\": \"HowTo\",\r\n \"name\": \"Wafer-Level Packaging Dispensing Process Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to precision dispensing for wafer-level chip-scale packaging and fan-out wafer-level packaging using SANCO dispensing machines.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Wafer Mount & Alignment\",\r\n \"text\": \"Diced or full wafer is mounted on a vacuum chuck or carrier frame. CCD vision captures wafer notch and die fiducials to establish the coordinate system for all subsequent dispensing operations across the full wafer.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"RDL Protection Coating Dispensing\",\r\n \"text\": \"SANCO dispensing machine applies a thin, controlled-thickness protective coating over the redistribution layer (RDL) traces, leaving bump pad openings exposed within \u00b10.02 mm tolerance.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Bump Protection or Underfill Dispensing\",\r\n \"text\": \"For WLCSP applications, underfill material is dispensed in a wafer-level pattern beneath the solder bump array, or protective material is dispensed around individual bumps to prevent damage during dicing and handling.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Singulation Edge Sealing\",\r\n \"text\": \"After wafer dicing, edge sealant may be dispensed along the die perimeter to protect exposed silicon and prevent moisture ingress at the singulated edge \u2014 particularly important for fan-out packages with exposed mold compound interfaces.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Cure & Wafer-Level Inspection\",\r\n \"text\": \"Material is cured per specification (UV or thermal). Automated wafer-level inspection scans 100% of die sites to verify dispensing coverage, thickness and absence of defects before wafer sort and ship.\"\r\n }\r\n ]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap *{box-sizing:border-box;margin:0;padding:0}\r\n\r\n\/* \u2500\u2500 tokens \u2500\u2500 *\/\r\n.sanco-app-wrap{\r\n --navy:#0a1628;\r\n --blue:#2e7dd1;\r\n --blue-dk:#1c68b8;\r\n --g50:#f8fafc;\r\n --g100:#f1f5f9;\r\n --g200:#e2e8f0;\r\n --g400:#94a3b8;\r\n --g600:#475569;\r\n --radius-card:14px;\r\n font-family:'DM Sans',sans-serif;\r\n color:var(--navy);\r\n}\r\n\r\n\/* \u2500\u2500 HERO \u2500\u2500 *\/\r\n.sanco-app-hero{\r\n position:relative;\r\n height:480px;\r\n overflow:hidden;\r\n display:flex;\r\n align-items:center;\r\n border-radius:0;\r\n}\r\n.sanco-app-hero-bg{\r\n position:absolute;inset:0;\r\n 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.sanco-app-faq-wrap{padding-left:24px;padding-right:24px}\r\n .sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\r\n .sanco-app-intro-img img{height:260px}\r\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\r\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\r\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\r\n .sanco-process-step::after{display:none}\r\n}\r\n@media(max-width:600px){\r\n .sanco-app-hero{height:300px}\r\n .sanco-app-hero h1{font-size:32px}\r\n .sanco-app-hero-sub{font-size:14.5px}\r\n .sanco-app-sec-head h2{font-size:28px}\r\n .sanco-app-intro-text h2{font-size:28px}\r\n .sanco-app-hl-wrap,.sanco-challenge-grid,\r\n .sanco-process-steps{grid-template-columns:1fr}\r\n .sanco-mat-table{display:block;overflow-x:auto;-webkit-overflow-scrolling:touch;white-space:nowrap}\r\n .sanco-app-faq-wrap{padding-left:20px;padding-right:20px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap{padding-left:20px;padding-right:20px}\r\n}\r\n@media(max-width:420px){\r\n .sanco-app-hero{height:260px}\r\n .sanco-app-hero h1{font-size:28px}\r\n .sanco-app-hero-label{font-size:10px;padding:4px 12px}\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-app-wrap\">\r\n\r\n \r\n <section class=\"sanco-app-hero\" aria-label=\"Semiconductor application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Semiconductor \u00b7 Applications<\/span>\r\n <h1>Wafer-Level Packaging Dispensing<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision dispensing solutions for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection, wafer-level molding compound dispensing and bump protection for advanced semiconductor packaging.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Semiconductor<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Wafer-Level Packaging Dispensing<\/span>\r\n <\/nav>\r\n\r\n \r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Precision Dispensing for Wafer-Level Packaging Processes<\/h2>\r\n <p>Wafer-level packaging (WLP) represents the most miniaturised and highest-density tier of semiconductor packaging, performing all package-level processes \u2014 redistribution layer formation, bumping, protective coating and even molding \u2014 while the die is still part of the full wafer, before singulation. This approach, used in wafer-level chip-scale packages (WLCSP) and fan-out wafer-level packages (FOWLP), eliminates the substrate entirely for many applications, producing the smallest possible package footprint for mobile processors, RF front-end modules and sensor ICs. Every dispensing operation in WLP must be executed across the entire wafer surface \u2014 typically 200mm or 300mm in diameter \u2014 with consistency from edge to edge.<\/p>\r\n <p>The dispensing challenge in wafer-level packaging is achieving micron-level pattern accuracy and thickness uniformity across a large-area substrate where even small variations compound across thousands of die sites per wafer. RDL protection coating must leave bump pad openings precisely exposed while covering all routing traces \u2014 a keep-out boundary that may be only 20\u201330 \u00b5m wide on advanced nodes. Underfill dispensing for WLCSP bump arrays must achieve complete capillary fill beneath bump pitches as fine as 150\u2013400 \u00b5m, while edge sealing after singulation must protect the die perimeter without contaminating the active circuit area.<\/p>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> with high-resolution vision systems provide the wafer-scale positioning accuracy, pattern precision and process repeatability needed for wafer-level packaging dispensing across WLCSP, fan-out and advanced bumped wafer applications.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/02\/Semiconductor-packaging_\u7ed3\u679c-1.webp\"\r\n alt=\"SANCO dispensing machine applying precision coating across a semiconductor wafer for wafer-level packaging\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Wafer-Level Packaging Dispensing Demands Wafer-Scale Precision<\/h2>\r\n <p>WLP dispensing must maintain micron-level accuracy across an entire wafer surface, where small variations compound across thousands of die sites.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Edge-to-Edge Thickness Uniformity<\/h4>\r\n <p>RDL protection coating and wafer-level molding compound must maintain thickness uniformity within \u00b15% across the full 200mm or 300mm wafer diameter. Edge effects from spin or spray coating processes are a common source of non-uniformity that selective dispensing must avoid.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Fine-Pitch Bump Pad Keep-Out<\/h4>\r\n <p>Advanced WLCSP designs use bump pitches as fine as 150\u2013400 \u00b5m. Protective coating dispensing must leave bump pad openings exposed within \u00b10.02 mm tolerance \u2014 any coating bridging onto the bump pad prevents proper solder ball attachment in the next process step.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Sub-Bump Underfill Capillary Fill<\/h4>\r\n <p>Underfill beneath fine-pitch bump arrays must achieve complete capillary fill in gaps as small as 50\u2013100 \u00b5m at wafer level, before singulation. Incomplete fill creates voids that are extremely difficult to detect and rework at this stage of the process.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Wafer Warpage Compensation<\/h4>\r\n <p>Wafers with asymmetric layer stress, particularly fan-out wafers with reconstituted mold compound, can exhibit warpage of several hundred microns across the wafer diameter. Dispensing Z-axis must compensate for this warpage in real time to maintain consistent standoff height.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Singulation Edge Protection Without Active Area Contamination<\/h4>\r\n <p>Edge sealant dispensed after dicing must protect the exposed die edge and mold compound interface without flowing onto the active circuit area or bond pads \u2014 a particular challenge given the proximity of the die edge to functional structures in fan-out packages.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>100% Wafer Inspection Throughput<\/h4>\r\n <p>WLP dispensing quality must be verified across 100% of die sites per wafer before shipment, since any coverage defect affects yield. Inspection cycle time must keep pace with dispensing throughput to avoid becoming a production bottleneck.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Wafer-Level Packaging Dispensing\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Wafer-Scale Vision Alignment \u00b10.02 mm<\/h4>\r\n <p>High-resolution CCD vision system maintains positioning accuracy across the full wafer diameter, critical for fine-pitch bump pad keep-out zones on advanced WLCSP designs.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>Real-Time Z-Axis Warpage Compensation<\/h4>\r\n <p>Laser height sensing tracks wafer surface profile in real time, automatically adjusting dispensing standoff height to compensate for fan-out wafer warpage of several hundred microns.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Thickness Uniformity Control \u00b15%<\/h4>\r\n <p>Closed-loop dispensing parameters maintain coating or underfill thickness uniformity within \u00b15% from wafer centre to edge \u2014 essential for consistent electrical and mechanical performance across all die.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>High-Throughput Wafer Processing<\/h4>\r\n <p>Optimised dispensing path planning processes a full 300mm wafer in minutes, supporting wafer-level packaging production volumes without becoming a line bottleneck.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Sub-100 \u00b5m Capillary Underfill Capability<\/h4>\r\n <p>Low-viscosity underfill dispensing achieves complete capillary fill beneath fine-pitch bump arrays with gaps as small as 50\u2013100 \u00b5m, validated for WLCSP reliability requirements.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Multi-Material Platform for WLP Process Flow<\/h4>\r\n <p>Handles RDL protection coating, bump underfill, mold compound dam material and singulation edge sealant through interchangeable valve configurations on one platform.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Wafer Map Import for Die-Level Programming<\/h4>\r\n <p>Import wafer map data identifying known-good-die locations to selectively process only viable die sites, reducing material consumption on wafers with yield-limited maps.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Wafer Fab Back-End Integration<\/h4>\r\n <p>Cassette-to-cassette wafer handling compatible interfaces integrate SANCO dispensing machines into wafer-level packaging back-end lines between RDL formation, bumping and dicing stations.<\/p>\r\n <\/div>\r\n\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Wafer-Level Packaging Dispensing Process Step by Step<\/h2>\r\n <p>Wafer-level packaging dispensing requires wafer-scale precision across multiple process steps. SANCO equipment supports the full WLP process flow.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Wafer Mount & Vision Alignment<\/h4>\r\n <p>Wafer mounted on chuck or carrier. CCD vision captures notch orientation and die grid fiducials to establish the full-wafer coordinate system.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>RDL Protection Dispensing<\/h4>\r\n <p>Protective coating dispensed over RDL routing traces, leaving bump pad openings exposed within \u00b10.02 mm across all die sites on the wafer.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Bump Underfill or Protection Dispensing<\/h4>\r\n <p>Underfill or protective material dispensed around the bump array using wafer-level pattern programming, validated for complete capillary fill.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Cure & Wafer-Level Inspection<\/h4>\r\n <p>Material cured per specification. 100% automated wafer inspection verifies coverage, thickness and defect-free dispensing across all die sites.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Singulation Edge Sealing (Post-Dice)<\/h4>\r\n <p>After dicing, edge sealant dispensed along die perimeter to protect exposed silicon and mold compound interfaces without contaminating active circuit areas.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n \r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Wafer-Level Packaging Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing machines handle the materials used across the wafer-level packaging process flow from RDL protection through singulation edge sealing.<\/p>\r\n <\/div>\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Wafer-Level Packaging Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>RDL Protection Coating (Polyimide-Compatible)<\/strong><\/td>\r\n <td>100 \u2013 2,000 mPa\u00b7s<\/td>\r\n <td>Thermal cure or UV<\/td>\r\n <td>Selective protection over redistribution layer traces, leaving bump pads exposed for WLCSP and FOWLP<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Wafer-Level Capillary Underfill (WLCUF)<\/strong><\/td>\r\n <td>50 \u2013 500 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u2013165\u00b0C<\/td>\r\n <td>Sub-bump underfill for fine-pitch WLCSP bump arrays with pitch as fine as 150\u2013400 \u00b5m<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Wafer-Level Molding Compound Dam Material<\/strong><\/td>\r\n <td>5,000 \u2013 30,000 mPa\u00b7s<\/td>\r\n <td>Thermal or UV pre-cure<\/td>\r\n <td>Dam dispensing to contain liquid molding compound during fan-out wafer reconstitution process<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Singulation Edge Sealant<\/strong><\/td>\r\n <td>2,000 \u2013 20,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm or thermal<\/td>\r\n <td>Post-dice edge protection sealant for exposed die edges and mold compound interfaces in fan-out packages<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Bump Protection Coating<\/strong><\/td>\r\n <td>500 \u2013 5,000 mPa\u00b7s<\/td>\r\n <td>UV or thermal<\/td>\r\n <td>Selective protective coating around solder bump arrays to prevent damage during dicing and wafer handling<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/section>\r\n\r\n \r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO maintain positioning accuracy across a full 300mm wafer?<\/h4>\r\n <p>SANCO desktop visual dispensing machines use high-resolution CCD vision referenced to wafer notch and multiple die fiducials distributed across the wafer surface, correcting for any rotational or scaling offset between the programmed coordinate system and the actual wafer position. This achieves positioning accuracy of \u00b10.02 mm consistently from wafer centre to edge. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> to discuss wafer-scale process validation.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO machines compensate for fan-out wafer warpage during dispensing?<\/h4>\r\n <p>Yes. SANCO dispensing machines support real-time laser height sensing that tracks the wafer surface profile during the dispensing pass, automatically adjusting Z-axis position to maintain consistent standoff height even across wafers with several hundred microns of warpage \u2014 common in reconstituted fan-out wafers.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What underfill capability does SANCO offer for fine-pitch WLCSP bump arrays?<\/h4>\r\n <p>SANCO dispensing machines apply wafer-level capillary underfill with viscosities as low as 50 mPa\u00b7s, achieving complete capillary fill beneath bump pitches from 150 to 400 \u00b5m. The dispensing pattern and volume are validated through void-content verification using acoustic microscopy or cross-section sampling during process development.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO prevent RDL protection coating from covering bump pad openings?<\/h4>\r\n <p>SANCO's CCD vision-guided selective dispensing programs each bump pad location as a keep-out zone, maintaining a boundary accuracy of \u00b10.02 mm between the dispensed coating and the pad opening. This precision is validated against the specific RDL design rules for each wafer product before production release.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO equipment integrate with cassette-to-cassette wafer handling systems?<\/h4>\r\n <p>Yes. SANCO dispensing machines can be configured with cassette-to-cassette wafer handling interfaces compatible with standard wafer fab back-end automation, enabling integration into existing wafer-level packaging production lines without manual wafer transfer.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other semiconductor packaging dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering die attach dispensing, chip package encapsulation, glob top protection and dam and fill processes. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine product pages<\/a>.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div>\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-8de0a80 e-con-full e-flex e-con e-parent\" data-id=\"8de0a80\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ed10779 elementor-widget elementor-widget-html\" data-id=\"ed10779\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; }\r\n to { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n background: #fff;\r\n border-radius: 20px;\r\n width: 100%;\r\n max-width: 560px;\r\n max-height: 92vh;\r\n overflow-y: auto;\r\n box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n to { opacity: 1; transform: translateY(0) scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n padding: 28px 32px 24px;\r\n border-radius: 20px 20px 0 0;\r\n position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n font-size: 22px;\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n font-size: 14px;\r\n color: rgba(255,255,255,0.6);\r\n margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n position: absolute;\r\n top: 18px;\r\n right: 18px;\r\n width: 36px;\r\n height: 36px;\r\n background: rgba(255,255,255,0.22);\r\n border: 1.5px solid rgba(255,255,255,0.5);\r\n border-radius: 8px;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n transition: background 0.2s, border-color 0.2s;\r\n color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n background: rgba(255,255,255,0.38);\r\n border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; }\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n outline: none;\r\n border-color: #2563eb;\r\n background: #fff;\r\n box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n background-repeat: no-repeat;\r\n background-position: right 12px center;\r\n background-color: #f8fafc;\r\n cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n min-height: 100px;\r\n resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n width: 100%;\r\n padding: 15px;\r\n background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n color: #fff;\r\n border: none;\r\n border-radius: 12px;\r\n font-size: 16px;\r\n font-weight: 700;\r\n font-family: inherit;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n gap: 10px;\r\n margin-top: 6px;\r\n transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n opacity: 0.92;\r\n transform: translateY(-1px);\r\n box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n \r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Wafer-Level Packaging Dispensing | SANCO Semiconductor \u00b7 Applications Wafer-Level Packaging Dispensing Precision dispensing solutions for wafer-level packaging \u2014 WLCSP underfill, fan-out RDL protection, wafer-level molding compound dispensing and bump protection for advanced semiconductor packaging. Home \u203a Applications \u203a Semiconductor \u203a Wafer-Level Packaging Dispensing Industry Overview Precision Dispensing for Wafer-Level Packaging Processes Wafer-level packaging (WLP) represents […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6839","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/comments?post=6839"}],"version-history":[{"count":10,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839\/revisions"}],"predecessor-version":[{"id":7298,"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/pages\/6839\/revisions\/7298"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/pt\/wp-json\/wp\/v2\/media?parent=6839"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}