{"id":6833,"date":"2026-07-01T03:51:20","date_gmt":"2026-07-01T03:51:20","guid":{"rendered":"https:\/\/www.sancofd.com\/"},"modified":"2026-07-03T07:45:28","modified_gmt":"2026-07-03T07:45:28","slug":"chip-package-encapsulation","status":"publish","type":"page","link":"https:\/\/www.sancofd.com\/ru\/chip-package-encapsulation\/","title":{"rendered":"Chip Package Encapsulation"},"content":{"rendered":"\t\t
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\n\t\t\t\t\t\r\n\r\n\r\n\r\n\r\n\r\nChip Package Encapsulation | SANCO<\/title>\r\n<link rel=\"preconnect\" href=\"https:\/\/fonts.googleapis.com\">\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=DM+Sans:wght@400;500;600;700&family=Barlow+Condensed:wght@600;700;800&display=swap\" rel=\"stylesheet\">\r\n<\/head>\r\n<body>\r\n<!-- ============================================================\r\n SANCO \u2014 Application Sub-page: Chip Package Encapsulation (Semiconductor)\r\n For use inside Elementor HTML widget\r\n SEO\/GEO optimised \u00b7 JSON-LD Schema \u00b7 Internal product links \u2264 5\r\n============================================================ -->\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n JSON-LD SCHEMA (WebPage + HowTo + Product mentions)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<script type=\"application\/ld+json\">\r\n{\r\n \"@context\": \"https:\/\/schema.org\",\r\n \"@graph\": [\r\n {\r\n \"@type\": \"WebPage\",\r\n \"@id\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/chip-package-encapsulation\/\",\r\n \"url\": \"https:\/\/www.sancofd.com\/application\/semiconductors\/chip-package-encapsulation\/\",\r\n \"name\": \"Chip Package Encapsulation for Semiconductor Manufacturing | SANCO\",\r\n \"description\": \"SANCO dispensing and potting machines deliver precision chip package encapsulation \u2014 QFN, DFN, SIP module and hybrid package molding for moisture, mechanical and chemical protection.\",\r\n \"inLanguage\": \"en\",\r\n \"isPartOf\": {\r\n \"@type\": \"WebSite\",\r\n \"url\": \"https:\/\/www.sancofd.com\/\",\r\n \"name\": \"SANCO Fluid Dispensing\"\r\n },\r\n \"breadcrumb\": {\r\n \"@type\": \"BreadcrumbList\",\r\n \"itemListElement\": [\r\n {\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.sancofd.com\/\"},\r\n {\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applications\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":3,\"name\":\"Semiconductor\",\"item\":\"https:\/\/www.sancofd.com\/application\/\"},\r\n {\"@type\":\"ListItem\",\"position\":4,\"name\":\"Chip Package Encapsulation\",\"item\":\"https:\/\/www.sancofd.com\/application\/semiconductors\/chip-package-encapsulation\/\"}\r\n ]\r\n }\r\n },\r\n {\r\n \"@type\": \"HowTo\",\r\n \"name\": \"Chip Package Encapsulation Process for Semiconductor Manufacturing Using SANCO Equipment\",\r\n \"description\": \"Step-by-step guide to dispensing encapsulant for semiconductor chip package protection \u2014 covering QFN, DFN, SIP and hybrid package encapsulation using SANCO dispensing and potting equipment.\",\r\n \"step\": [\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 1,\r\n \"name\": \"Package Pre-Bake & Inspection\",\r\n \"text\": \"Assembled package (wire-bonded or flip-chip die on substrate or lead frame) is pre-baked to remove moisture and inspected for wire bond integrity before encapsulation.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 2,\r\n \"name\": \"Encapsulant Material Preparation\",\r\n \"text\": \"Liquid encapsulation compound (epoxy molding compound alternative or glob top material) is conditioned to dispensing temperature and, for two-component systems, mixed at the specified ratio.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 3,\r\n \"name\": \"Cavity Fill or Glob Top Dispensing\",\r\n \"text\": \"SANCO dispensing machine fills the package cavity or applies a glob top dome over the die and wire bonds, controlling volume to achieve complete coverage without overflow onto package leads or contact pads.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 4,\r\n \"name\": \"Degassing & Self-Leveling\",\r\n \"text\": \"Dispensed encapsulant is vacuum-degassed or vibrated to remove entrapped air, then allowed to self-level for a controlled period to achieve a uniform surface profile before cure.\"\r\n },\r\n {\r\n \"@type\": \"HowToStep\",\r\n \"position\": 5,\r\n \"name\": \"Cure & Reliability Verification\",\r\n \"text\": \"Encapsulant is cured per material specification (thermal, typically 150\u00b0C for 1\u20134 hours). Sample units undergo thermal cycling, moisture sensitivity testing and cross-section analysis to verify package reliability.\"\r\n }\r\n ]\r\n }\r\n ]\r\n}\r\n<\/script>\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n STYLES (scoped, safe inside Elementor)\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<style>\r\n\/* \u2500\u2500 reset scoped to this widget only \u2500\u2500 *\/\r\n.sanco-app-wrap 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rgba(10,22,40,.1)}\r\n.sanco-app-intro-img img{width:100%;height:420px;object-fit:cover;display:block}\r\n\r\n\/* \u2500\u2500 CHALLENGES \u2500\u2500 *\/\r\n.sanco-app-challenges{padding:60px 0;background:var(--g50)}\r\n.sanco-app-challenges-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-app-sec-head{text-align:center;margin-bottom:44px}\r\n.sanco-app-sec-head .pill{\r\n display:inline-block;padding:5px 16px;\r\n background:var(--navy);color:#fff;\r\n font-size:10px;font-weight:700;letter-spacing:2px;\r\n text-transform:uppercase;border-radius:50px;margin-bottom:12px;\r\n}\r\n.sanco-app-sec-head h2{\r\n font-family:'Barlow Condensed',sans-serif;\r\n font-size:40px;font-weight:700;color:var(--navy);line-height:1.05;margin-bottom:10px;\r\n}\r\n.sanco-app-sec-head p{font-size:15.5px;color:var(--g600);max-width:640px;margin:0 auto}\r\n\r\n.sanco-challenge-grid{\r\n display:grid;grid-template-columns:repeat(3,1fr);gap:20px;\r\n}\r\n.sanco-challenge-card{\r\n padding:28px 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border-color:var(--blue);\r\n}\r\n.sanco-app-hl-icon{\r\n width:44px;height:44px;border-radius:10px;\r\n background:linear-gradient(135deg,var(--blue),var(--blue-dk));\r\n color:#fff;display:flex;align-items:center;justify-content:center;\r\n font-size:20px;margin-bottom:14px;\r\n box-shadow:0 6px 16px rgba(46,125,209,.28);\r\n}\r\n.sanco-app-hl-icon svg{width:22px;height:22px;display:block}\r\n.sanco-app-hl-card h4{font-size:15px;font-weight:700;color:var(--navy);margin-bottom:6px}\r\n.sanco-app-hl-card p{font-size:13px;color:var(--g600);line-height:1.65}\r\n\r\n\/* \u2500\u2500 PROCESS \u2500\u2500 *\/\r\n.sanco-app-process{padding:60px 0;background:var(--g50)}\r\n.sanco-app-process-wrap{max-width:1200px;margin:0 auto;padding:0 48px}\r\n.sanco-process-steps{display:grid;grid-template-columns:repeat(5,1fr);gap:12px;margin-top:10px}\r\n.sanco-process-step{\r\n background:#fff;border:1px solid var(--g200);border-radius:var(--radius-card);\r\n padding:22px 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0;\r\n}\r\n.sanco-faq-item:last-child{border-bottom:none}\r\n.sanco-faq-item h4{font-size:16px;font-weight:700;color:var(--navy);margin-bottom:8px}\r\n.sanco-faq-item p{font-size:14.5px;color:var(--g600);line-height:1.8}\r\n.sanco-faq-item a{color:var(--blue);font-weight:600;text-decoration:none}\r\n.sanco-faq-item a:hover{text-decoration:underline}\r\n\r\n\/* \u2500\u2500 RESPONSIVE \u2500\u2500 *\/\r\n@media(max-width:1024px){\r\n .sanco-app-hero{height:360px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap,\r\n .sanco-app-faq-wrap{padding-left:24px;padding-right:24px}\r\n .sanco-app-intro-wrap{grid-template-columns:1fr;gap:32px}\r\n .sanco-app-intro-img img{height:260px}\r\n .sanco-app-hl-wrap{grid-template-columns:repeat(2,1fr)}\r\n .sanco-challenge-grid{grid-template-columns:repeat(2,1fr)}\r\n .sanco-process-steps{grid-template-columns:repeat(3,1fr)}\r\n .sanco-process-step::after{display:none}\r\n}\r\n@media(max-width:600px){\r\n .sanco-app-hero{height:300px}\r\n .sanco-app-hero h1{font-size:32px}\r\n .sanco-app-hero-sub{font-size:14.5px}\r\n .sanco-app-sec-head h2{font-size:28px}\r\n .sanco-app-intro-text h2{font-size:28px}\r\n .sanco-app-hl-wrap,.sanco-challenge-grid,\r\n .sanco-process-steps{grid-template-columns:1fr}\r\n .sanco-mat-table{display:block;overflow-x:auto;-webkit-overflow-scrolling:touch;white-space:nowrap}\r\n .sanco-app-faq-wrap{padding-left:20px;padding-right:20px}\r\n .sanco-app-hero-inner,.sanco-app-bread,\r\n .sanco-app-intro-wrap,.sanco-app-hl-wrap,\r\n .sanco-app-challenges-wrap,.sanco-app-process-wrap,\r\n .sanco-app-products-wrap,.sanco-app-materials-wrap{padding-left:20px;padding-right:20px}\r\n}\r\n@media(max-width:420px){\r\n .sanco-app-hero{height:260px}\r\n .sanco-app-hero h1{font-size:28px}\r\n .sanco-app-hero-label{font-size:10px;padding:4px 12px}\r\n}\r\n<\/style>\r\n\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n PAGE WRAPPER\r\n\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<div class=\"sanco-app-wrap\">\r\n\r\n <!-- \u2550\u2550 HERO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-hero\" aria-label=\"Semiconductor application hero\">\r\n <div class=\"sanco-app-hero-bg\"><\/div>\r\n <div class=\"sanco-app-hero-overlay\"><\/div>\r\n <div class=\"sanco-app-hero-inner\">\r\n <span class=\"sanco-app-hero-label\">Semiconductor \u00b7 Applications<\/span>\r\n <h1>Chip Package Encapsulation<\/h1>\r\n <p class=\"sanco-app-hero-sub\">Precision encapsulation dispensing for semiconductor chip packages \u2014 QFN, DFN, SIP modules, hybrid packages and custom encapsulated devices requiring moisture, mechanical and chemical protection.<\/p>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 BREADCRUMB \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <nav class=\"sanco-app-bread\" aria-label=\"Breadcrumb\">\r\n <a href=\"https:\/\/www.sancofd.com\/\">Home<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <a href=\"https:\/\/www.sancofd.com\/application\/\">Applications<\/a>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span>Semiconductor<\/span>\r\n <span class=\"sep\" aria-hidden=\"true\">\u203a<\/span>\r\n <span class=\"cur\">Chip Package Encapsulation<\/span>\r\n <\/nav>\r\n\r\n <!-- \u2550\u2550 INTRO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-intro\">\r\n <div class=\"sanco-app-intro-wrap\">\r\n <div class=\"sanco-app-intro-text\">\r\n <div class=\"sanco-app-eyebrow\">Industry Overview<\/div>\r\n <h2>Reliable Encapsulation Dispensing for Semiconductor Chip Packages<\/h2>\r\n <p>While transfer molding with epoxy molding compound remains the dominant encapsulation method for high-volume standard IC packages, an increasing range of semiconductor products \u2014 QFN and DFN leadframe packages in specific configurations, system-in-package (SiP) modules, hybrid circuits, multi-chip modules and low-to-medium volume custom devices \u2014 rely on liquid dispensed encapsulation instead. Dispensed encapsulation offers advantages that transfer molding cannot match for these applications: no mold tooling investment, compatibility with mixed component heights on a single substrate, and the flexibility to encapsulate only selected areas of a package while leaving others \u2014 connectors, optical windows, RF antennas \u2014 completely exposed.<\/p>\r\n <p>The dispensing challenge in chip package encapsulation is filling the package cavity or forming the glob top dome completely around delicate wire bonds without bridging adjacent bond wires, without creating voids that would fail moisture sensitivity testing, and without overflow contaminating package leads, optical windows or connector interfaces. For SiP modules integrating multiple dies of different heights, the encapsulant must flow to fully cover the tallest component while maintaining controlled total package height \u2014 a balance that requires precise volume control and validated material rheology.<\/p>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/desktop-visual\/' title='SANCO Desktop Visual Dispensing Machine'>desktop visual dispensing machines<\/a> and <a href='https:\/\/www.sancofd.com\/offline-potting-machine\/' title='SANCO Offline Potting Machine'>offline potting machines<\/a> provide the precision volume control, vision-guided keep-out boundaries and multi-material capability required for chip package encapsulation across QFN, DFN, SiP and hybrid package applications.<\/p>\r\n <\/div>\r\n <div class=\"sanco-app-intro-img\">\r\n <img loading=\"lazy\" decoding=\"async\"\r\n src=\"https:\/\/www.sancofd.com\/wp-content\/uploads\/2026\/02\/Encapsulation-2_\u7ed3\u679c.webp\"\r\n alt=\"SANCO dispensing machine applying liquid encapsulant over a wire-bonded semiconductor chip package\"\r\n loading=\"lazy\"\r\n width=\"600\" height=\"420\"\r\n >\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 CHALLENGES \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-challenges\">\r\n <div class=\"sanco-app-challenges-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Manufacturing Challenges<\/span>\r\n <h2>Why Chip Package Encapsulation Demands Precise Process Control<\/h2>\r\n <p>Dispensed chip package encapsulation must protect delicate wire bonds and dies while avoiding contamination of leads, connectors and optical interfaces.<\/p>\r\n <\/div>\r\n <div class=\"sanco-challenge-grid\">\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">01<\/div>\r\n <h4>Wire Bond Wash-Out Prevention<\/h4>\r\n <p>Encapsulant flow during dispensing can displace or deform fine wire bonds (as thin as 18\u201325 \u00b5m gold or copper wire) if dispensed too aggressively. Dispensing flow rate and approach pattern must be controlled to avoid wire bond wash-out or bridging between adjacent wires.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">02<\/div>\r\n <h4>Void-Free Fill Around Complex Topography<\/h4>\r\n <p>Wire bonds, die edges and substrate features create complex 3D topography that encapsulant must flow around completely. Voids trapped beneath wire loops or around die corners cause moisture sensitivity test failures and reduced thermal cycling reliability.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">03<\/div>\r\n <h4>Lead Frame and Connector Keep-Out Compliance<\/h4>\r\n <p>QFN and DFN packages have exposed leads on the package perimeter that must remain free of encapsulant for board-level solder attachment. Dispensing boundary control must maintain a clean keep-out zone within 0.1\u20130.2 mm of the lead edge.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">04<\/div>\r\n <h4>Mixed Component Height Coverage<\/h4>\r\n <p>SiP modules and hybrid circuits integrate multiple dies and passive components of varying heights on a single substrate. Encapsulant volume must be calculated to fully cover the tallest component while controlling total package height within specification.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">05<\/div>\r\n <h4>Moisture Sensitivity Level (MSL) Compliance<\/h4>\r\n <p>Encapsulated packages must achieve the target Moisture Sensitivity Level classification (typically MSL1\u2013MSL3) per JEDEC J-STD-020. Void content, encapsulant adhesion and material selection all affect MSL performance and must be validated together.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-challenge-card\">\r\n <div class=\"cc-num\">06<\/div>\r\n <h4>Selective Encapsulation for Hybrid Functionality<\/h4>\r\n <p>Packages combining digital, RF and optical functions on one substrate require selective encapsulation that protects sensitive areas while leaving optical windows, RF antennas or connector interfaces completely free of encapsulant.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 HIGHLIGHTS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-hl\">\r\n <div style=\"max-width:1200px;margin:0 auto;padding:0 48px 0\">\r\n <div class=\"sanco-app-sec-head\" style=\"text-align:left;margin-bottom:32px\">\r\n <div class=\"sanco-app-eyebrow\">SANCO Advantages<\/div>\r\n <h2 style=\"font-family:'Barlow Condensed',sans-serif;font-size:40px;font-weight:700;color:var(--navy);line-height:1.1\">\r\n Key Capabilities for Chip Package Encapsulation\r\n <\/h2>\r\n <\/div>\r\n <\/div>\r\n <div class=\"sanco-app-hl-wrap\">\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"8\" stroke=\"currentColor\" stroke-width=\"2\"\/><circle cx=\"12\" cy=\"12\" r=\"2.5\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Low-Stress Dispensing for Wire Bond Protection<\/h4>\r\n <p>Controlled flow rate and dispensing approach pattern minimise encapsulant impact force on fine wire bonds, preventing wire wash-out or bridging during the fill process.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"6.5\" y=\"6.5\" width=\"11\" height=\"11\" rx=\"1.5\" transform=\"rotate(45 12 12)\" stroke=\"currentColor\" stroke-width=\"2\"\/><\/svg><\/div>\r\n <h4>CCD Vision Lead Keep-Out \u00b10.1 mm<\/h4>\r\n <p>Vision-guided dispensing boundary control maintains a clean lead keep-out zone on QFN and DFN packages, ensuring board-level solderability is preserved after encapsulation.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"12\" cy=\"12\" r=\"4.5\" stroke=\"currentColor\" stroke-width=\"2\"\/><g stroke=\"currentColor\" stroke-width=\"2\" stroke-linecap=\"round\"><line x1=\"12\" y1=\"2.5\" x2=\"12\" y2=\"5\"\/><line x1=\"12\" y1=\"19\" x2=\"12\" y2=\"21.5\"\/><line x1=\"2.5\" y1=\"12\" x2=\"5\" y2=\"12\"\/><line x1=\"19\" y1=\"12\" x2=\"21.5\" y2=\"12\"\/><line x1=\"5\" y1=\"5\" x2=\"6.8\" y2=\"6.8\"\/><line x1=\"17.2\" y1=\"17.2\" x2=\"19\" y2=\"19\"\/><line x1=\"5\" y1=\"19\" x2=\"6.8\" y2=\"17.2\"\/><line x1=\"17.2\" y1=\"6.8\" x2=\"19\" y2=\"5\"\/><\/g><\/svg><\/div>\r\n <h4>Heated Barrel for Controlled Flow Viscosity<\/h4>\r\n <p>Barrel temperature control optimises encapsulant viscosity for complete flow around wire bonds and complex topography without excessive flow that could cause bridging or overflow.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6l1-8Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\" stroke-linecap=\"round\"\/><\/svg><\/div>\r\n <h4>Variable Dispense Volume for Mixed-Height Packages<\/h4>\r\n <p>Programmable dispense volume per package position accommodates SiP modules with components of varying heights, ensuring full coverage of the tallest element within a single dispensing pass.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 4.5 9 9.5h6L12 4.5Z\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linejoin=\"round\"\/><path d=\"M4.5 15.5 3 12l3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M19.5 15.5 21 12l-3-5.5\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/><path d=\"M7 19h10\" stroke=\"currentColor\" stroke-width=\"1.6\" stroke-linecap=\"round\"\/><circle cx=\"12\" cy=\"12\" r=\"9\" stroke=\"currentColor\" stroke-width=\"1.6\"\/><\/svg><\/div>\r\n <h4>Vacuum Degassing Integration<\/h4>\r\n <p>Optional vacuum degassing station removes entrapped air from dispensed encapsulant before cure, supporting void content targets required for MSL1\u2013MSL3 compliance.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"currentColor\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 2 14.2 9.8 22 12 14.2 14.2 12 22 9.8 14.2 2 12 9.8 9.8 12 2Z\"\/><\/svg><\/div>\r\n <h4>Selective Encapsulation for Hybrid Packages<\/h4>\r\n <p>Programmable keep-out zones protect optical windows, RF antennas and connector interfaces from encapsulant contact while fully covering sensitive die and wire bond areas.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><rect x=\"3.5\" y=\"3.5\" width=\"17\" height=\"17\" rx=\"2\" stroke=\"currentColor\" stroke-width=\"2\"\/><rect x=\"8\" y=\"8\" width=\"8\" height=\"8\" rx=\"1\" fill=\"currentColor\"\/><\/svg><\/div>\r\n <h4>Package Layout CAD Import<\/h4>\r\n <p>Import package substrate or lead frame CAD data to auto-generate dispensing boundaries and volume calculations for each package design \u2014 reducing NPI programming time.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-app-hl-card\">\r\n <div class=\"sanco-app-hl-icon\"><svg viewBox=\"0 0 24 24\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M12 3 20 8v8l-8 5-8-5V8l8-5Z\" stroke=\"currentColor\" stroke-width=\"2\" stroke-linejoin=\"round\"\/><\/svg><\/div>\r\n <h4>Inline Assembly Line Integration<\/h4>\r\n <p>SMEMA-compatible conveyor integration links SANCO encapsulation equipment between wire bonding, dispensing and cure oven stations in automated semiconductor assembly lines.<\/p>\r\n <\/div>\r\n\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 PROCESS STEPS \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-process\">\r\n <div class=\"sanco-app-process-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Process Guide<\/span>\r\n <h2>The Chip Package Encapsulation Process Step by Step<\/h2>\r\n <p>Chip package encapsulation requires careful flow control around delicate wire bonds with precise keep-out boundary management. SANCO equipment supports every stage.<\/p>\r\n <\/div>\r\n <div class=\"sanco-process-steps\">\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 01<\/div>\r\n <h4>Package Pre-Bake & Wire Bond Inspection<\/h4>\r\n <p>Assembled package pre-baked to remove moisture. Wire bond integrity confirmed by inspection before encapsulation begins.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 02<\/div>\r\n <h4>Encapsulant Preparation<\/h4>\r\n <p>Material conditioned to dispensing temperature. Two-component systems mixed at specified ratio with viscosity verified before production dispensing.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 03<\/div>\r\n <h4>Controlled Cavity Fill or Glob Top Dispensing<\/h4>\r\n <p>SANCO machine dispenses encapsulant with controlled flow rate to protect wire bonds, maintaining lead or connector keep-out boundaries within specification.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 04<\/div>\r\n <h4>Degassing & Self-Level<\/h4>\r\n <p>Dispensed material vacuum-degassed or vibrated to remove air, then self-levels for a controlled period to achieve uniform surface profile.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-process-step\">\r\n <div class=\"ps-num\">Step 05<\/div>\r\n <h4>Cure & Reliability Sampling<\/h4>\r\n <p>Thermal cure per material TDS. Sample units undergo MSL testing, thermal cycling and cross-section analysis to verify package reliability before full production release.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/div>\r\n <\/section>\r\n\r\n\r\n <!-- \u2550\u2550 MATERIALS TABLE \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-materials\">\r\n <div class=\"sanco-app-materials-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">Materials Compatibility<\/span>\r\n <h2>Chip Package Encapsulation Material Types & SANCO Compatibility<\/h2>\r\n <p>SANCO dispensing and potting machines handle the encapsulation materials used across QFN, DFN, SiP and hybrid semiconductor package applications.<\/p>\r\n <\/div>\r\n <table class=\"sanco-mat-table\" role=\"table\" aria-label=\"Chip Package Encapsulation Material Types & SANCO Compatibility\">\r\n <thead>\r\n <tr>\r\n <th>Material Type<\/th>\r\n <th>Viscosity Range<\/th>\r\n <th>Cure Method<\/th>\r\n <th>Typical Application<\/th>\r\n <th>SANCO Compatibility<\/th>\r\n <\/tr>\r\n <\/thead>\r\n <tbody>\r\n <tr>\r\n <td><strong>Liquid Epoxy Molding Compound (Glob Top)<\/strong><\/td>\r\n <td>5,000 \u2013 40,000 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u00b0C, 1\u20134 h<\/td>\r\n <td>Glob top dome encapsulation over wire-bonded die on lead frame or substrate; MSL1\u2013MSL3 capable<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Cavity Fill Encapsulant (QFN\/DFN)<\/strong><\/td>\r\n <td>3,000 \u2013 25,000 mPa\u00b7s<\/td>\r\n <td>Thermal 150\u2013175\u00b0C, 1\u20132 h<\/td>\r\n <td>Cavity fill encapsulation for QFN and DFN packages with exposed lead keep-out requirements<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Two-Component SiP Encapsulant<\/strong><\/td>\r\n <td>A: 1,000\u201310,000 \/ B: 500\u20135,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013150\u00b0C, 1\u20132 h<\/td>\r\n <td>Variable-height encapsulation for system-in-package modules with multiple die and component heights<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>UV-Cure Encapsulant (Selective)<\/strong><\/td>\r\n <td>2,000 \u2013 15,000 mPa\u00b7s<\/td>\r\n <td>UV 365 nm + thermal post-cure<\/td>\r\n <td>Rapid-handling encapsulation for hybrid packages requiring fast in-process tack-free state<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <tr>\r\n <td><strong>Low-Stress Silicone Encapsulant<\/strong><\/td>\r\n <td>1,000 \u2013 8,000 mPa\u00b7s<\/td>\r\n <td>Thermal 100\u2013150\u00b0C<\/td>\r\n <td>Stress-sensitive die encapsulation for MEMS and pressure sensor hybrid packages requiring minimal package stress transfer<\/td>\r\n <td><span class=\"tag-rec\">Recommended<\/span><\/td>\r\n <\/tr>\r\n <\/tbody>\r\n <\/table>\r\n <\/div>\r\n <\/section>\r\n\r\n <!-- \u2550\u2550 FAQ \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n <section class=\"sanco-app-faq\">\r\n <div class=\"sanco-app-faq-wrap\">\r\n <div class=\"sanco-app-sec-head\">\r\n <span class=\"pill\">FAQ<\/span>\r\n <h2>Frequently Asked Questions<\/h2>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO prevent wire bond wash-out during cavity fill encapsulation?<\/h4>\r\n <p>SANCO dispensing machines use controlled, low-velocity dispensing approach patterns combined with optimised needle positioning that introduces encapsulant gradually around the package perimeter rather than directly onto wire bonds. Flow rate is calibrated during process development for each package design to ensure encapsulant flows around bonds without sufficient force to deform or displace them. Contact our <a href='https:\/\/www.sancofd.com\/contact\/'>application engineers<\/a> for wire bond protection process validation.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO machines maintain lead keep-out zones on QFN packages during encapsulation?<\/h4>\r\n <p>Yes. SANCO's CCD vision-guided dispensing maintains lead keep-out boundaries within \u00b10.1 mm, ensuring exposed QFN and DFN leads remain free of encapsulant for board-level solder attachment. Boundary accuracy is validated against the specific package lead frame design during process qualification.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>How does SANCO handle variable component heights in SiP module encapsulation?<\/h4>\r\n <p>SANCO <a href='https:\/\/www.sancofd.com\/offline-potting-machine\/'>offline potting machines<\/a> support programmable dispense volume per package, calculated to ensure the tallest component on the substrate is fully covered while maintaining the target total package height. For SiP modules with significant height variation, multi-pass dispensing programmes can apply encapsulant selectively to different zones.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>What void content can SANCO achieve for MSL-compliant chip package encapsulation?<\/h4>\r\n <p>With vacuum degassing integration, SANCO machines achieve void content below 0.5% by volume in dispensed encapsulant, sufficient to meet MSL1 through MSL3 classification requirements per JEDEC J-STD-020 when combined with appropriate material selection and cure profile.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Can SANCO equipment perform selective encapsulation for hybrid packages with optical or RF elements?<\/h4>\r\n <p>Yes. SANCO dispensing machines program keep-out zones around optical windows, RF antenna structures and connector interfaces, allowing selective encapsulation that protects only the intended areas of a hybrid package while leaving functional interfaces completely exposed.<\/p>\r\n <\/div>\r\n\r\n <div class=\"sanco-faq-item\">\r\n <h4>Where can I learn about other semiconductor packaging dispensing applications?<\/h4>\r\n <p>Visit our <a href='https:\/\/www.sancofd.com\/application\/'>Applications section<\/a> for guides covering die attach dispensing, wafer-level packaging, glob top protection and dam and fill processes. For equipment specifications, see our <a href='https:\/\/www.sancofd.com\/desktop-visual\/'>dispensing machine<\/a> and <a href='https:\/\/www.sancofd.com\/offline-potting-machine\/'>potting machine<\/a> product pages.<\/p>\r\n <\/div>\r\n\r\n <\/div>\r\n <\/section>\r\n\r\n<\/div><!-- \/.sanco-app-wrap -->\r\n\r\n<\/body>\r\n<\/html>\r\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0fa474c e-con-full e-flex e-con e-parent\" data-id=\"0fa474c\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a60c087 elementor-widget elementor-widget-html\" data-id=\"a60c087\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t<!-- SANCO CTA Section with Popup Contact Form | Elementor HTML Widget -->\r\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Inter:wght@400;500;600;700;800&display=swap\" rel=\"stylesheet\">\r\n\r\n<style>\r\n\/* ===== CTA SECTION ===== *\/\r\n.sanco-cta-wrap {\r\n font-family: 'Inter', -apple-system, BlinkMacSystemFont, sans-serif;\r\n background: #ffffff;\r\n position: relative;\r\n overflow: hidden;\r\n padding: 80px 24px;\r\n text-align: center;\r\n}\r\n\r\n\/* soft color accent blobs *\/\r\n.sanco-cta-wrap::after {\r\n content: '';\r\n position: absolute;\r\n top: -140px;\r\n right: -120px;\r\n width: 480px;\r\n height: 480px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(37,99,235,0.55) 0%, rgba(37,99,235,0.28) 40%, rgba(37,99,235,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n\/* accent blob, bottom-left \u2014 a second hue for contrast *\/\r\n.sanco-cta-wrap::before {\r\n content: '';\r\n position: absolute;\r\n bottom: -160px;\r\n left: -130px;\r\n width: 420px;\r\n height: 420px;\r\n border-radius: 50%;\r\n background: radial-gradient(circle, rgba(6,182,212,0.45) 0%, rgba(6,182,212,0.22) 40%, rgba(6,182,212,0) 72%);\r\n pointer-events: none;\r\n}\r\n\r\n.sanco-cta-inner {\r\n position: relative;\r\n z-index: 1;\r\n max-width: 680px;\r\n margin: 0 auto;\r\n}\r\n\r\n.sanco-cta-inner h2 {\r\n font-size: clamp(26px, 4vw, 42px);\r\n font-weight: 800;\r\n color: #0a1628;\r\n margin: 0 0 14px;\r\n line-height: 1.2;\r\n letter-spacing: -0.5px;\r\n}\r\n\r\n.sanco-cta-inner p {\r\n font-size: clamp(14px, 1.8vw, 17px);\r\n color: #5a6472;\r\n margin: 0 auto 36px;\r\n max-width: 480px;\r\n line-height: 1.7;\r\n}\r\n\r\n.sanco-cta-btns {\r\n display: flex;\r\n gap: 14px;\r\n justify-content: center;\r\n flex-wrap: wrap;\r\n}\r\n\r\n.sanco-btn-primary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: #2563eb;\r\n color: #fff;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 700;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: none;\r\n cursor: pointer;\r\n transition: background 0.2s, transform 0.2s, box-shadow 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-primary:hover {\r\n background: #1d4ed8;\r\n transform: translateY(-2px);\r\n box-shadow: 0 8px 24px rgba(37,99,235,0.3);\r\n}\r\n\r\n.sanco-btn-secondary {\r\n display: inline-flex;\r\n align-items: center;\r\n gap: 8px;\r\n background: transparent;\r\n color: #0a1628;\r\n font-family: inherit;\r\n font-size: 15px;\r\n font-weight: 600;\r\n padding: 14px 30px;\r\n border-radius: 10px;\r\n border: 1.5px solid #dbe0e8;\r\n cursor: pointer;\r\n transition: border-color 0.2s, color 0.2s, background 0.2s;\r\n text-decoration: none;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-btn-secondary:hover {\r\n border-color: #2563eb;\r\n color: #2563eb;\r\n background: rgba(37,99,235,0.04);\r\n}\r\n\r\n\/* ===== MODAL OVERLAY ===== *\/\r\n.sanco-modal-overlay {\r\n display: none;\r\n position: fixed;\r\n inset: 0;\r\n background: rgba(5, 10, 22, 0.75);\r\n backdrop-filter: blur(4px);\r\n z-index: 99999;\r\n align-items: center;\r\n justify-content: center;\r\n padding: 20px;\r\n animation: sanco-fade-in 0.2s ease;\r\n}\r\n.sanco-modal-overlay.active {\r\n display: flex;\r\n}\r\n\r\n@keyframes sanco-fade-in {\r\n from { opacity: 0; }\r\n to { opacity: 1; }\r\n}\r\n\r\n\/* ===== MODAL CARD ===== *\/\r\n.sanco-modal {\r\n background: #fff;\r\n border-radius: 20px;\r\n width: 100%;\r\n max-width: 560px;\r\n max-height: 92vh;\r\n overflow-y: auto;\r\n box-shadow: 0 30px 80px rgba(0,0,0,0.4);\r\n animation: sanco-slide-up 0.28s cubic-bezier(0.34,1.3,0.64,1);\r\n position: relative;\r\n}\r\n\r\n@keyframes sanco-slide-up {\r\n from { opacity: 0; transform: translateY(30px) scale(0.97); }\r\n to { opacity: 1; transform: translateY(0) scale(1); }\r\n}\r\n\r\n.sanco-modal-header {\r\n background: linear-gradient(135deg, #0a1628 0%, #132744 100%);\r\n padding: 28px 32px 24px;\r\n border-radius: 20px 20px 0 0;\r\n position: relative;\r\n}\r\n\r\n.sanco-modal-header h3 {\r\n font-size: 22px;\r\n font-weight: 800;\r\n color: #fff;\r\n margin: 0 0 6px;\r\n}\r\n\r\n.sanco-modal-header p {\r\n font-size: 14px;\r\n color: rgba(255,255,255,0.6);\r\n margin: 0;\r\n}\r\n\r\n.sanco-modal-close {\r\n position: absolute;\r\n top: 18px;\r\n right: 18px;\r\n width: 36px;\r\n height: 36px;\r\n background: rgba(255,255,255,0.22);\r\n border: 1.5px solid rgba(255,255,255,0.5);\r\n border-radius: 8px;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n transition: background 0.2s, border-color 0.2s;\r\n color: #fff;\r\n}\r\n.sanco-modal-close:hover {\r\n background: rgba(255,255,255,0.38);\r\n border-color: rgba(255,255,255,0.8);\r\n}\r\n.sanco-modal-close svg { width: 20px; height: 20px; stroke-width: 3; }\r\n\r\n.sanco-modal-body {\r\n padding: 28px 32px 32px;\r\n}\r\n\r\n\/* ===== FORM STYLES ===== *\/\r\n.sanco-form-row {\r\n display: grid;\r\n grid-template-columns: 1fr 1fr;\r\n gap: 14px;\r\n}\r\n\r\n.sanco-form-group {\r\n margin-bottom: 16px;\r\n}\r\n\r\n.sanco-form-group label {\r\n display: block;\r\n font-size: 13px;\r\n font-weight: 600;\r\n color: #0a1628;\r\n margin-bottom: 7px;\r\n letter-spacing: 0.1px;\r\n}\r\n\r\n.sanco-form-group label .req {\r\n color: #ef4444;\r\n margin-left: 2px;\r\n}\r\n\r\n.sanco-form-group input,\r\n.sanco-form-group select,\r\n.sanco-form-group textarea {\r\n width: 100%;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border: 1.5px solid #e5e7eb;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n color: #0a1628;\r\n font-family: inherit;\r\n transition: border-color 0.2s, box-shadow 0.2s, background 0.2s;\r\n box-sizing: border-box;\r\n appearance: none;\r\n}\r\n\r\n.sanco-form-group input::placeholder,\r\n.sanco-form-group textarea::placeholder { color: #b0b8c4; }\r\n\r\n.sanco-form-group input:focus,\r\n.sanco-form-group select:focus,\r\n.sanco-form-group textarea:focus {\r\n outline: none;\r\n border-color: #2563eb;\r\n background: #fff;\r\n box-shadow: 0 0 0 3px rgba(37,99,235,0.12);\r\n}\r\n\r\n.sanco-form-group select {\r\n background-image: url(\"data:image\/svg+xml,%3Csvg xmlns='http:\/\/www.w3.org\/2000\/svg' width='16' height='16' viewBox='0 0 24 24' fill='none' stroke='%236b7280' stroke-width='2'%3E%3Cpath d='M6 9l6 6 6-6'\/%3E%3C\/svg%3E\");\r\n background-repeat: no-repeat;\r\n background-position: right 12px center;\r\n background-color: #f8fafc;\r\n cursor: pointer;\r\n}\r\n\r\n.sanco-form-group textarea {\r\n min-height: 100px;\r\n resize: vertical;\r\n}\r\n\r\n\/* honeypot *\/\r\n.sanco-hp { position: absolute; left: -9999px; opacity: 0; pointer-events: none; }\r\n\r\n.sanco-submit-btn {\r\n width: 100%;\r\n padding: 15px;\r\n background: linear-gradient(135deg, #0a1628 0%, #1d4ed8 100%);\r\n color: #fff;\r\n border: none;\r\n border-radius: 12px;\r\n font-size: 16px;\r\n font-weight: 700;\r\n font-family: inherit;\r\n cursor: pointer;\r\n display: flex;\r\n align-items: center;\r\n justify-content: center;\r\n gap: 10px;\r\n margin-top: 6px;\r\n transition: opacity 0.2s, transform 0.2s, box-shadow 0.2s;\r\n letter-spacing: 0.1px;\r\n}\r\n.sanco-submit-btn:hover {\r\n opacity: 0.92;\r\n transform: translateY(-1px);\r\n box-shadow: 0 8px 20px rgba(10,22,40,0.3);\r\n}\r\n.sanco-submit-btn svg { width: 18px; height: 18px; }\r\n\r\n.sanco-privacy {\r\n display: flex;\r\n align-items: flex-start;\r\n gap: 10px;\r\n margin-top: 18px;\r\n padding: 12px 14px;\r\n background: #f8fafc;\r\n border-radius: 10px;\r\n}\r\n.sanco-privacy svg { width: 16px; height: 16px; color: #9ca3af; flex-shrink: 0; margin-top: 2px; }\r\n.sanco-privacy span { font-size: 12px; color: #6b7280; line-height: 1.5; }\r\n\r\n\/* messages *\/\r\n.sanco-msg {\r\n display: none;\r\n align-items: center;\r\n gap: 10px;\r\n padding: 13px 16px;\r\n border-radius: 10px;\r\n font-size: 14px;\r\n margin-bottom: 18px;\r\n}\r\n.sanco-msg.show { display: flex; }\r\n.sanco-msg.error { background: #fef2f2; border: 1px solid #fecaca; color: #dc2626; }\r\n.sanco-msg.success{ background: #f0fdf4; border: 1px solid #bbf7d0; color: #16a34a; }\r\n.sanco-msg svg { width: 18px; height: 18px; flex-shrink: 0; }\r\n\r\n\/* ===== RESPONSIVE ===== *\/\r\n@media (max-width: 520px) {\r\n .sanco-form-row { grid-template-columns: 1fr; }\r\n .sanco-modal-body { padding: 22px 20px 28px; }\r\n .sanco-modal-header { padding: 22px 20px 18px; }\r\n}\r\n<\/style>\r\n\r\n<!-- \u2500\u2500 CTA SECTION \u2500\u2500 -->\r\n<div class=\"sanco-cta-wrap\">\r\n <div class=\"sanco-cta-inner\">\r\n <h2>Ready to Optimize Your Production?<\/h2>\r\n <p>Talk to our engineers about a dispensing or coating solution tailored to your consumer electronics line.<\/p>\r\n <div class=\"sanco-cta-btns\">\r\n <button class=\"sanco-btn-primary\" onclick=\"sancoOpenModal()\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2\"\/><\/svg>\r\n Get a Quote\r\n <\/button>\r\n <a class=\"sanco-btn-secondary\" href=\"https:\/\/www.sancofd.com\/product\/\" target=\"_blank\" rel=\"noopener\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"16\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4 6h16M4 10h16M4 14h10\"\/><\/svg>\r\n View Products\r\n <\/a>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<!-- \u2500\u2500 MODAL \u2500\u2500 -->\r\n<div class=\"sanco-modal-overlay\" id=\"sancoModal\" onclick=\"sancoCloseOnBg(event)\">\r\n <div class=\"sanco-modal\" role=\"dialog\" aria-modal=\"true\" aria-labelledby=\"sancoModalTitle\">\r\n\r\n <div class=\"sanco-modal-header\">\r\n <h3 id=\"sancoModalTitle\">Request a Quote<\/h3>\r\n <p>Our team will respond within 24 hours.<\/p>\r\n <button class=\"sanco-modal-close\" onclick=\"sancoCloseModal()\" aria-label=\"Close\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M6 18L18 6M6 6l12 12\"\/><\/svg>\r\n <\/button>\r\n <\/div>\r\n\r\n <div class=\"sanco-modal-body\">\r\n\r\n <div class=\"sanco-msg error\" id=\"sancoError\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 8v4m0 4h.01M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"\/><\/svg>\r\n <span id=\"sancoErrorText\"><\/span>\r\n <\/div>\r\n\r\n <div class=\"sanco-msg success\" id=\"sancoSuccess\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M5 13l4 4L19 7\"\/><\/svg>\r\n <span>Thank you! Your message has been sent. We'll be in touch within 24 hours.<\/span>\r\n <\/div>\r\n\r\n <form id=\"sancoContactForm\" action=\"https:\/\/api.form-data.com\/f\/FnvziDiv8iiDZg\" method=\"post\" target=\"_blank\">\r\n\r\n <!-- Honeypot -->\r\n <div class=\"sanco-hp\" aria-hidden=\"true\">\r\n <input type=\"text\" name=\"website\" id=\"sancoHp\" tabindex=\"-1\" autocomplete=\"off\">\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoName\">Full Name <span class=\"req\">*<\/span><\/label>\r\n <input type=\"text\" id=\"sancoName\" name=\"name\" placeholder=\"Your name\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoCompany\">Company<\/label>\r\n <input type=\"text\" id=\"sancoCompany\" name=\"company\" placeholder=\"Company name\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-row\">\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoEmail\">Email Address <span class=\"req\">*<\/span><\/label>\r\n <input type=\"email\" id=\"sancoEmail\" name=\"email\" placeholder=\"your@email.com\" required>\r\n <\/div>\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoPhone\">Phone \/ WhatsApp<\/label>\r\n <input type=\"tel\" id=\"sancoPhone\" name=\"phone\" placeholder=\"+1 234 567 890\">\r\n <\/div>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoInquiry\">Inquiry Type<\/label>\r\n <select id=\"sancoInquiry\" name=\"inquiry\">\r\n <option value=\"\">Select an option<\/option>\r\n <option value=\"quote\">Request a Quote<\/option>\r\n <option value=\"product\">Product Inquiry<\/option>\r\n <option value=\"support\">Technical Support<\/option>\r\n <option value=\"partnership\">Partnership<\/option>\r\n <option value=\"other\">Other<\/option>\r\n <\/select>\r\n <\/div>\r\n\r\n <div class=\"sanco-form-group\">\r\n <label for=\"sancoMessage\">Message <span class=\"req\">*<\/span><\/label>\r\n <textarea id=\"sancoMessage\" name=\"message\" placeholder=\"Please let us know the model you're interested in and estimated quantity.\" required><\/textarea>\r\n <\/div>\r\n\r\n <button type=\"submit\" class=\"sanco-submit-btn\" id=\"sancoSubmitBtn\">\r\n <span>Send Enquiry<\/span>\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2.5\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M14 5l7 7m0 0l-7 7m7-7H3\"\/><\/svg>\r\n <\/button>\r\n\r\n <div class=\"sanco-privacy\">\r\n <svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" fill=\"none\" viewBox=\"0 0 24 24\" stroke=\"currentColor\" stroke-width=\"2\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M12 15v2m-6 4h12a2 2 0 002-2v-6a2 2 0 00-2-2H6a2 2 0 00-2 2v6a2 2 0 002 2zm10-10V7a4 4 0 00-8 0v4h8z\"\/><\/svg>\r\n <span>Your information is secure and will never be shared with third parties.<\/span>\r\n <\/div>\r\n\r\n <\/form>\r\n <\/div>\r\n <\/div>\r\n<\/div>\r\n\r\n<script>\r\n(function() {\r\n var loadTime = Date.now();\r\n\r\n window.sancoOpenModal = function() {\r\n document.getElementById('sancoModal').classList.add('active');\r\n document.body.style.overflow = 'hidden';\r\n };\r\n\r\n window.sancoCloseModal = function() {\r\n document.getElementById('sancoModal').classList.remove('active');\r\n document.body.style.overflow = '';\r\n };\r\n\r\n window.sancoCloseOnBg = function(e) {\r\n if (e.target === document.getElementById('sancoModal')) sancoCloseModal();\r\n };\r\n\r\n \/\/ Esc key\r\n document.addEventListener('keydown', function(e) {\r\n if (e.key === 'Escape') sancoCloseModal();\r\n });\r\n\r\n \/\/ Form submit\r\n document.getElementById('sancoContactForm').addEventListener('submit', function(e) {\r\n var err = document.getElementById('sancoError');\r\n var suc = document.getElementById('sancoSuccess');\r\n var errTxt = document.getElementById('sancoErrorText');\r\n\r\n err.classList.remove('show');\r\n suc.classList.remove('show');\r\n\r\n \/\/ Honeypot\r\n if (document.getElementById('sancoHp').value) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Bot detected. Please try again.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Time check\r\n if ((Date.now() - loadTime) \/ 1000 < 3) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please take a moment to fill in the form.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n \/\/ Email\r\n var email = document.getElementById('sancoEmail').value;\r\n if (!\/^[^\\s@]+@[^\\s@]+\\.[^\\s@]+$\/.test(email)) {\r\n e.preventDefault();\r\n errTxt.textContent = 'Please enter a valid email address.';\r\n err.classList.add('show');\r\n return;\r\n }\r\n\r\n suc.classList.add('show');\r\n });\r\n})();\r\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Chip Package Encapsulation | SANCO Semiconductor \u00b7 Applications Chip Package Encapsulation Precision encapsulation dispensing for semiconductor chip packages \u2014 QFN, DFN, SIP modules, hybrid packages and custom encapsulated devices requiring moisture, mechanical and chemical protection. Home \u203a Applications \u203a Semiconductor \u203a Chip Package Encapsulation Industry Overview Reliable Encapsulation Dispensing for Semiconductor Chip Packages While transfer […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6833","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/pages\/6833","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/comments?post=6833"}],"version-history":[{"count":9,"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/pages\/6833\/revisions"}],"predecessor-version":[{"id":7301,"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/pages\/6833\/revisions\/7301"}],"wp:attachment":[{"href":"https:\/\/www.sancofd.com\/ru\/wp-json\/wp\/v2\/media?parent=6833"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}