Coating Equipment
3D Digital Printing Conformal Coating Machine
Pixel-level precision jetting with 1,000+ independently controlled nozzles — digital, layer-by-layer PCBA protection without masking.
Product Description
The 3D Digital Printing Conformal Coating Machine applies inkjet-based digital control to PCBA protection. Instead of spraying coating material across a board and masking off sensitive areas, the system jets material through more than 1,000 independently controlled nozzles — each one turned on or off individually to build coating exactly where it's needed and nowhere else.
Coating is built layer by layer, with each layer cured instantly under UV-LED before the next is applied. This digital, additive process gives full control over thickness and geometry across a single board — thin-film protection in most areas, with selective reinforcement built up only where required.
Because keep-out zones are defined in software rather than physical masking, the system automatically avoids test points, connectors, gold fingers, and sensor windows — reducing labor, rework, and material waste while improving first-pass yield.
Digital, Layer-by-Layer Coating
From board data to cured protection, entirely software-defined
Import Board Data
CAD/Gerber data defines coating zones and keep-out areas digitally — no physical masking required.
Pixel-Level Jetting
Over 1,000 nozzles jet ~80 pL droplets at up to 400 dpi, coating only the defined target areas.
Instant UV-LED Cure
Each layer cures immediately after jetting, preventing dripping, spreading, or edge distortion.
Build Up in 3D
Layers stack digitally to create variable thickness — thin film in most zones, reinforced protection where needed.
Where Precision Matters Most
Built for dense, high-value, and safety-critical PCBA
Automotive Electronics
ECUs, sensor modules, and control boards exposed to vibration and moisture
Medical Device PCBA
High-reliability boards requiring precise, repeatable protective coating
Aerospace & Industrial Control
Mission-critical modules requiring consistent, verified coating coverage
High-Density Consumer Electronics
Compact boards with connectors and test points that can't be blocked
Technical Highlights
Key specifications that define pixel-level coating
Independently controlled
Minimum droplet volume
Jetting resolution
Minimum layer thickness
Edge control accuracy
Key Features
Ten advantages of digital jetting for PCBA conformal coating
Pixel-Level Precision Jetting
Over 1,000 independently controlled nozzles enable fine, selective coating of targeted areas.
Ultra-Fine Droplet Control
Minimum droplet volume of approximately 80 pL, with jetting resolution up to 400 dpi.
Ultra-Thin Film Formation
Single-layer thickness as low as 0.016 mm, ideal for lightweight, high-precision protection.
3D Multi-Layer Stacked Encapsulation
Layer-by-layer jetting and curing enables fully digital control of thickness and geometry.
Sharp, Clean Coating Edges
Edge control accuracy within 0.05 mm, significantly reducing overspray.
Precise Keep-Out Zone Avoidance
Automatically avoids test points, connectors, gold fingers, and sensor windows without masking.
Localized Variable Thickness
Enables thin-film protection, selective reinforcement, and 3D encapsulation on the same PCBA.
Instant UV-LED Curing
Curing immediately follows jetting, minimizing dripping, spreading, and edge distortion.
High Material Utilization
On-demand jetting eliminates atomization waste, reducing material consumption by roughly one-third.
Intelligent Automated Maintenance
Supports automatic humidification, nozzle-clog detection, fluid path circulation, and printhead condition monitoring.
Technical Parameter
| Item | Technical parameters and description | Item | Technical parameters and description |
|---|---|---|---|
| Technology | Digital inkjet selective encapsulation (piezoelectric) | Working direction | Left→right (standard) Right→left (optional) |
| Dimensions | W1000mm * L1200mm * H1170mm | Conveying height | 900±20mm |
| Weight | 1000kg (1 ton) | Transfer speed | 0-13m/min |
| Control method | IPC + motion controller | Conveyor track | Chain conveyor |
| Software | RIP / layer-slicing software + Windows system | Rail width adjust speed | 250mm/min |
| Programming | Graphic import + teach points, layer/thickness setting | PCB edge space | ≥5mm |
| Print head type | Multi-nozzle piezoelectric inkjet head, X Y Z axes | Communication port | SMEMA connector |
| Nozzle count | >1,000 independently driven nozzles | No-coat zone control | Digitally masked — test points, connectors, gold fingers, sensor windows |
| Print resolution | 400 dpi (pixel pitch ≈63.5 μm) | Head maintenance | Auto humidification, clog detection, ink-path circulation |
| Minimum droplet volume | ≈80 pL | Material utilization | On-demand jetting, no atomization loss — up to ~1/3 material savings vs. spray |
| Jetting frequency | Up to ≈20 kHz per nozzle | Equipment air pressure | 0.5 Mpa |
| Coating area | X: 460mm Y: 460mm | Exhaust air volume requirements | More than 15m³/min |
| Single-layer thickness | ≈15/30/50 μm (settable) | Input voltage | AC220V 50~60HZ |
| Total thickness range | ≈15-500 μm+ (multi-layer stacking) | Total power | 2.2kw |
| Coating edge precision | <0.05mm | Standard features | Purge station, LED UV detection light, LED lighting |
| Curing method | Water-cooled UV-LED, cure-per-layer | ||
| Maximum movement speed | 800mm/sec | ||
| Component maximum height | Conveying surface 180mm, bottom 100mm | ||
| Repeatability | 0.02mm |